Market Overview:
The global wafer carrier boxes market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The market growth can be attributed to the increasing demand for semiconductor devices and rising number of fabless companies. In terms of type, the front opening shipping box (FOSB) segment is expected to hold a larger share of the market during the forecast period. This can be attributed to its advantages such as easy handling and less damage caused due to mishandling. In terms of application, IDM is expected to hold a larger share of the market during the forecast period owing to increased demand for semiconductor devices from this sector.
Product Definition:
Wafer carrier boxes are used to transport semiconductor wafers. The boxes protect the wafers from being damaged and help keep them organized.
Front Opening Shipping Box (FOSB):
The front opening shipping box (FOSB) is a type of packaging used for electronic devices such as integrated circuits or semiconductor wafers. The FOSB is generally made up of cardboard and comprises two flaps that can be hinged at the top to provide access to the contents inside. The size and shape of the FOSBs are designed according to regulations set by various regulatory bodies including RoHS, REACH, U.S. FDA etc.
Front Opening Unified Pod (FOUP):
The Front opening unified pods (FOUP) are used in Wafer Carrier Boxes. The FOUP is a type of packaging that consists of two metal plates, which form the walls of the carrier box. These metal plates have numerous small holes in them, through which air can flow easily and freely to cool down the integrated circuit (IC).
Application Insights:
The integrated device manufacturing application segment accounted for the largest revenue share of over 30% in 2017. The growth is attributed to the increasing demand for IC packaging solutions, which offer enhanced thermal and electrical insulation properties. These boxes are used to pack an entire wafer stage into one unit, which helps in reducing overall production cost by eliminating excess inventory.
Wafer carrier boxes are also used in foundry applications as they provide excellent shock resistance and protection against physical damage during transportation or storage conditions. Furthermore, these units can be customized as per specific requirements of customers offering a wide range of color options along with barcodes and other details that help identify individual products during the production process.
The semiconductor packaging market is expected to witness significant growth on account of rising product demand from various end-use industries including data storage devices, consumer electronics & appliances, telecommunication equipment and automotive components among others at a global level.
Regional Analysis:
Asia Pacific region dominated the global market in 2017 and is expected to continue its dominance over the forecast period. The growth of this region can be attributed to increasing demand for electronic products, particularly smartphones and computer chips, on account of rising disposable income. Furthermore, China is anticipated to remain a key manufacturing hub for electronics manufacturers owing to low production costs as compared to other countries such as the U.S., Japan or Germany. This scenario will drive regional product demand over the forecast period.
The Latin American market was valued at USD X million in 2017 and is projected to expand at a CAGR of XX% from 2018 To 2030 owing her geographical location close proximity with Asian economies coupled with growing investments by foreign players such as Micron Technology Inc.; SK Hynix; Western Digital Technologies Co., Ltd.; Samsung Electronics Co., Ltd.; among others are driving industry expansion across this region which will fuel industry growth over next eight years until 2030 time frame).
Growth Factors:
- Increasing demand for semiconductor devices from the electronics and automotive industries
- Growing popularity of miniaturized and high-density electronic devices
- Proliferation of next-generation 3D IC technologies
- Rising demand for advanced packaging solutions in the data center market
- Emergence of new applications such as 5G, artificial intelligence, and Internet of Things
Scope Of The Report
Report Attributes
Report Details
Report Title
Wafer Carrier Boxes Market Research Report
By Type
Front Opening Shipping Box (FOSB), Front Opening Unified Pod (FOUP)
By Application
IDM, Foundry
By Companies
Entegris, Shin-Etsu Polymer, Miraial Co.,Ltd., S Korea, Chuang King Enterprise
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
128
Number of Tables & Figures
90
Customization Available
Yes, the report can be customized as per your need.
Global Wafer Carrier Boxes Market Report Segments:
The global Wafer Carrier Boxes market is segmented on the basis of:
Types
Front Opening Shipping Box (FOSB), Front Opening Unified Pod (FOUP)
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
IDM, Foundry
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Entegris
- Shin-Etsu Polymer
- Miraial Co.,Ltd.
- S Korea
- Chuang King Enterprise
Highlights of The Wafer Carrier Boxes Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Front Opening Shipping Box (FOSB)
- Front Opening Unified Pod (FOUP)
- By Application:
- IDM
- Foundry
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Wafer Carrier Boxes Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Wafer carrier boxes are a type of electronic packaging that is used to hold semiconductor wafers. These boxes are made up of several layers, including an outer layer of polystyrene or other material, and a layer of metal foil that is coated with an insulating material. The wafers are placed on top of the metal foil, and then the entire package is sealed shut with heat and pressure.
Some of the major companies in the wafer carrier boxes market are Entegris, Shin-Etsu Polymer, Miraial Co.,Ltd., S Korea, Chuang King Enterprise.
The wafer carrier boxes market is expected to grow at a compound annual growth rate of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Wafer Carrier Boxes Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Wafer Carrier Boxes Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Wafer Carrier Boxes Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Wafer Carrier Boxes Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Wafer Carrier Boxes Market Size & Forecast, 2020-2028
4.5.1 Wafer Carrier Boxes Market Size and Y-o-Y Growth
4.5.2 Wafer Carrier Boxes Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Front Opening Shipping Box (FOSB)
5.2.2 Front Opening Unified Pod (FOUP)
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 IDM
6.2.2 Foundry
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Wafer Carrier Boxes Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Wafer Carrier Boxes Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Front Opening Shipping Box (FOSB)
9.6.2 Front Opening Unified Pod (FOUP)
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 IDM
9.10.2 Foundry
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Front Opening Shipping Box (FOSB)
10.6.2 Front Opening Unified Pod (FOUP)
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 IDM
10.10.2 Foundry
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Front Opening Shipping Box (FOSB)
11.6.2 Front Opening Unified Pod (FOUP)
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 IDM
11.10.2 Foundry
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Front Opening Shipping Box (FOSB)
12.6.2 Front Opening Unified Pod (FOUP)
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 IDM
12.10.2 Foundry
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Front Opening Shipping Box (FOSB)
13.6.2 Front Opening Unified Pod (FOUP)
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 IDM
13.10.2 Foundry
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Wafer Carrier Boxes Market: Competitive Dashboard
14.2 Global Wafer Carrier Boxes Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Entegris
14.3.2 Shin-Etsu Polymer
14.3.3 Miraial Co.,Ltd.
14.3.4 S Korea
14.3.5 Chuang King Enterprise
