Market Overview:
The global wafer CMP pads market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for semiconductor devices and rising number of fabless companies. In terms of type, the hard CMP pads segment is expected to hold a larger share of the global wafer CMP pads market during the forecast period. This can be attributed to their superior performance as compared to soft CMP pads in terms of removal rate and defectivity. In terms of application, 300mm wafers are expected to account for a larger share of the global wafer CMP pads market during the forecast period.
Product Definition:
Wafer CMP pads are generally discs made of polishing materials that attach to the surface of a wafer. They are used to polish the wafer's surface and improve its flatness and finish.
Hard CMP Pads:
Hard cmp pads are used in wafer cmp pads market for the transfer of large volume and high-precision components. The technology is used to manufacture integrated circuits (IC) on silicon wafers, which are then utilized in electronic devices such as smartphones or computers.
The global hard cMP pads market was valued at USD 1,849.1 million in 2016.
Soft CMP Pads:
The soft cmp pads are used in the wafer cmp pads market. The soft cmp pad is a device that is used to transfer wafers between stages of manufacturing processes such as cleaning, polishing, and packaging. It also helps in protecting the sensitive integrated circuits from damage due to mechanical or chemical contamination during handling and transportation of semiconductor devices.
Application Insights:
300mm wafer was the largest application segment in 2017 and is expected to maintain its lead over the forecast period. 300mm wafer has been witnessing significant adoption in various sectors such as data centers, telecom equipment, and consumer electronics owing to its benefits such as high performance, low power consumption, cost-effectiveness among others. The demand for 300 mm WCPs is anticipated to increase at a CAGR of XX% from 2018 to 2030 owing to their increasing use in electronic devices across end-use industries.
200mm Wafer Complementary Metal-Oxide-Semiconductor (CMOS) image sensor application segment accounted for a share of 15.9% of the total market revenue in 2017 on account of factors such as growing need for advanced imaging technology across various verticals including medical and defense among others.
Regional Analysis:
North America dominated the global market in 2017, accounting for a share of over 30.0% owing to the presence of major players such as Intel and Micron Technology Inc., which have been manufacturing semiconductor products including planar technologies such as 3D-stacked ICs and 2D-stacked ICs using advanced technology. Moreover, increasing demand for consumer electronics products along with rapid development in high-end computing devices is expected to drive the regional market growth over the forecast period.
Asia Pacific is projected to be one of the fastest growing regions during 2018 - 2030 due to developing economies such as China and India along with other Southeast Asian countries that are leading manufacturers of semiconductors on account of low labor cost coupled with high availability of raw material supply at relatively lower prices compared to North America or Europe. Furthermore, favorable government policies encouraging domestic production through Foreign Direct Investments (FDI) are anticipated to boost industry expansion rates in this region over next eight years.
Growth Factors:
- Increasing demand for semiconductor devices: The growth of the semiconductor industry is one of the primary drivers for the wafer CMP pads market. This is because as the demand for semiconductors increases, so does the need for better and more advanced wafer CMP pads.
- Rising number of fabs: Another key driver for this market is the increasing number of fabs being set up across different parts of the world. This leads to an increase in demand for wafer CMP pads, as these are essential components in fabricating semiconductor devices.
- Growing popularity of 3D ICs: With a growing focus on miniaturization and higher performance, 3D IC technology is gaining popularity among manufacturers and consumers alike. And as this technology gains traction, there will be an increased need for better quality wafer CMP pads to meet its requirements.
Scope Of The Report
Report Attributes
Report Details
Report Title
Wafer CMP Pads Market Research Report
By Type
Hard CMP Pads, Soft CMP Pads
By Application
300mm Wafer, 200mm Wafer, 150mm Wafer, 450mm Wafer, Others
By Companies
DuPont, CMC Materials, FUJIBO, TWI Incorporated, JSR Micro, M, FNS TECH, IVT Technologies, SKC, Hubei Dinglong
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
214
Number of Tables & Figures
150
Customization Available
Yes, the report can be customized as per your need.
Global Wafer CMP Pads Market Report Segments:
The global Wafer CMP Pads market is segmented on the basis of:
Types
Hard CMP Pads, Soft CMP Pads
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
300mm Wafer, 200mm Wafer, 150mm Wafer, 450mm Wafer, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- DuPont
- CMC Materials
- FUJIBO
- TWI Incorporated
- JSR Micro
- M
- FNS TECH
- IVT Technologies
- SKC
- Hubei Dinglong
Highlights of The Wafer CMP Pads Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Hard CMP Pads
- Soft CMP Pads
- By Application:
- 300mm Wafer
- 200mm Wafer
- 150mm Wafer
- 450mm Wafer
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Wafer CMP Pads Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Wafer CMP pads are a type of semiconductor surface mount technology (SMT) pad that is used to produce integrated circuits. Wafer CMP pads are made up of a number of small, square-shaped pieces that are bonded together to create an electronic component.
Some of the major players in the wafer cmp pads market are DuPont, CMC Materials, FUJIBO, TWI Incorporated, JSR Micro, M, FNS TECH, IVT Technologies, SKC, Hubei Dinglong.
The wafer cmp pads market is expected to register a CAGR of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Wafer CMP Pads Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Wafer CMP Pads Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Wafer CMP Pads Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Wafer CMP Pads Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Wafer CMP Pads Market Size & Forecast, 2020-2028
4.5.1 Wafer CMP Pads Market Size and Y-o-Y Growth
4.5.2 Wafer CMP Pads Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Hard CMP Pads
5.2.2 Soft CMP Pads
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 300mm Wafer
6.2.2 200mm Wafer
6.2.3 150mm Wafer
6.2.4 450mm Wafer
6.2.5 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Wafer CMP Pads Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Wafer CMP Pads Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Hard CMP Pads
9.6.2 Soft CMP Pads
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 300mm Wafer
9.10.2 200mm Wafer
9.10.3 150mm Wafer
9.10.4 450mm Wafer
9.10.5 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Hard CMP Pads
10.6.2 Soft CMP Pads
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 300mm Wafer
10.10.2 200mm Wafer
10.10.3 150mm Wafer
10.10.4 450mm Wafer
10.10.5 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Hard CMP Pads
11.6.2 Soft CMP Pads
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 300mm Wafer
11.10.2 200mm Wafer
11.10.3 150mm Wafer
11.10.4 450mm Wafer
11.10.5 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Hard CMP Pads
12.6.2 Soft CMP Pads
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 300mm Wafer
12.10.2 200mm Wafer
12.10.3 150mm Wafer
12.10.4 450mm Wafer
12.10.5 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Hard CMP Pads
13.6.2 Soft CMP Pads
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 300mm Wafer
13.10.2 200mm Wafer
13.10.3 150mm Wafer
13.10.4 450mm Wafer
13.10.5 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Wafer CMP Pads Market: Competitive Dashboard
14.2 Global Wafer CMP Pads Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 DuPont
14.3.2 CMC Materials
14.3.3 FUJIBO
14.3.4 TWI Incorporated
14.3.5 JSR Micro
14.3.6 M
14.3.7 FNS TECH
14.3.8 IVT Technologies
14.3.9 SKC
14.3.10 Hubei Dinglong
