Market Overview:
The global wafer defect inspection system market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The market growth can be attributed to the increasing demand for semiconductor devices and rising adoption of advanced inspection technologies. In terms of type, the pattern defect type segment is expected to hold the largest share in the global wafer defect inspection system market during the forecast period. This can be attributed to factors such as miniaturization of semiconductor devices and increased complexity in manufacturing processes. In terms of application, 8-12 inch wafers are expected to hold a larger share in the global wafer defect inspection system market during the forecast period.
Product Definition:
A Wafer Defect Inspection System is a device that is used to inspect the surface of a wafer for defects. The importance of this system is that it allows manufacturers to identify and correct defects in the wafers before they are processed into semiconductor devices.
Pattern Defect Type:
The global pattern defect type, it's usage and growth factor in wafer defect inspection system market size was valued at USD 6.5 billion in 2016. It is expected to witness a CAGR of XX% over the forecast period.
Luminescence Defect Type:
Luminescence is the light given off by a material when stimulated with an electric current. In semiconductors, this phenomenon is used for detecting defects in wafers during manufacturing and packaging processes. The most common type of defect that can be detected using luminescence is called as stacking fault or crystal to crystal (CTC).
Application Insights:
The 2-8 inch wafer defect inspection system market is categorized on the basis of application as well as by region, namely, North America, Latin America, Europe, Asia Pacific and Middle East & Africa. The 2-8 inch wafer segment accounted for a major share in 2017 and is expected to maintain its dominance over the forecast period. This can be attributed to increasing demand for semiconductors from various end-use industries such as consumer electronics (LED/LCD), telecommunication & IT (BT), automotive and healthcare among others.
The 8-12 inch wafer segment is anticipated to witness significant growth over the forecast period owing to rising adoption of advanced process technologies such as High Temperature Coating (HTC) that helps improve yield while simultaneously reducing costs associated with manufacturing processes. Furthermore, growing demand for chips with high performance characteristics coupled with an increase in production volumes are expected fuel industry growth during the estimated time frame.
Regional Analysis:
The market in Asia Pacific is expected to grow at a significant rate over the forecast period owing to the presence of key players such as KLA-Tencor, Taiwan Semiconductor Manufacturing Company (TSMC), and Samsung. The increasing demand for advanced technology products coupled with rising investments by companies for manufacturing high-end semiconductors is also driving growth in this region.
In addition, growing adoption of inspection systems across major end-use industries such as electronics and medical devices are further fueling growth in this region. In addition, favorable government initiatives pertaining to research & development activities are anticipated to drive industry expansion over the next eight years.
Europe was estimated at USD X million in 2017 and is projected to expand at a CAGR of XX% from 2018 till 2030 due its increased application scope across various end-use industries including medical devices manufacturing facilities worldwide.
Growth Factors:
- Increasing demand for semiconductor devices in consumer electronics and automotive industries
- Growing number of wafer fabrication plants across the globe
- Rising need for advanced inspection technologies to detect defects at early stages
- Proliferation of 3D integrated circuits (ICs) and 2.5D ICs
- Increasing adoption of wafer-level packaging (WLP) technology
Scope Of The Report
Report Attributes
Report Details
Report Title
Wafer Defect Inspection System Market Research Report
By Type
Pattern Defect Type, Luminescence Defect Type
By Application
2-8 Inch Wafer, 8-12 Inch Wafer
By Companies
Hitachi High-Tech Corporation, SCREEN Semiconductor Solutions, TASMIT, CE-MAT, Sonix, Micro Engineering, Nextin, KLA-Tencor
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
249
Number of Tables & Figures
175
Customization Available
Yes, the report can be customized as per your need.
Global Wafer Defect Inspection System Market Report Segments:
The global Wafer Defect Inspection System market is segmented on the basis of:
Types
Pattern Defect Type, Luminescence Defect Type
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
2-8 Inch Wafer, 8-12 Inch Wafer
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Hitachi High-Tech Corporation
- SCREEN Semiconductor Solutions
- TASMIT
- CE-MAT
- Sonix
- Micro Engineering
- Nextin
- KLA-Tencor
Highlights of The Wafer Defect Inspection System Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Pattern Defect Type
- Luminescence Defect Type
- By Application:
- 2-8 Inch Wafer
- 8-12 Inch Wafer
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Wafer Defect Inspection System Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
A Wafer Defect Inspection System (WDIS) is a type of inspection system that uses wafers as the object to be inspected. The WDIS can be used to inspect semiconductor devices, integrated circuits, and other electronic components.
Some of the key players operating in the wafer defect inspection system market are Hitachi High-Tech Corporation, SCREEN Semiconductor Solutions, TASMIT, CE-MAT, Sonix, Micro Engineering, Nextin, KLA-Tencor.
The wafer defect inspection system market is expected to register a CAGR of 6.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Wafer Defect Inspection System Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Wafer Defect Inspection System Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Wafer Defect Inspection System Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Wafer Defect Inspection System Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Wafer Defect Inspection System Market Size & Forecast, 2020-2028
4.5.1 Wafer Defect Inspection System Market Size and Y-o-Y Growth
4.5.2 Wafer Defect Inspection System Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Pattern Defect Type
5.2.2 Luminescence Defect Type
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 2-8 Inch Wafer
6.2.2 8-12 Inch Wafer
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Wafer Defect Inspection System Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Wafer Defect Inspection System Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Pattern Defect Type
9.6.2 Luminescence Defect Type
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 2-8 Inch Wafer
9.10.2 8-12 Inch Wafer
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Pattern Defect Type
10.6.2 Luminescence Defect Type
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 2-8 Inch Wafer
10.10.2 8-12 Inch Wafer
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Pattern Defect Type
11.6.2 Luminescence Defect Type
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 2-8 Inch Wafer
11.10.2 8-12 Inch Wafer
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Pattern Defect Type
12.6.2 Luminescence Defect Type
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 2-8 Inch Wafer
12.10.2 8-12 Inch Wafer
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Pattern Defect Type
13.6.2 Luminescence Defect Type
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 2-8 Inch Wafer
13.10.2 8-12 Inch Wafer
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Wafer Defect Inspection System Market: Competitive Dashboard
14.2 Global Wafer Defect Inspection System Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Hitachi High-Tech Corporation
14.3.2 SCREEN Semiconductor Solutions
14.3.3 TASMIT
14.3.4 CE-MAT
14.3.5 Sonix
14.3.6 Micro Engineering
14.3.7 Nextin
14.3.8 KLA-Tencor
