Market Overview:
The global wafer dicing blade market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for semiconductor devices and LED products. In terms of type, hub dicing blades are expected to hold the largest share of the global wafer dicing blade market during the forecast period. This can be attributed to their high accuracy and precision in cutting thin wafers into small pieces.
Product Definition:
A wafer dicing blade is a precision tool used for cutting semiconductor wafers into individual die. The importance of the wafer dicing blade is its ability to produce clean, accurate cuts without damaging the underlying silicon substrate.
Hub Dicing Blades:
Dicing blades are used in integrated circuits (IC) manufacturing industry for removing silicon wafers during the fabrication process. The dicing operation is performed to obtain single wafer from a large wafer lot. Hub dicing blades are used in place of conventional sputtering targets which consist of small holes that allow gas flow but prevent target particles from entering other parts of the chamber.
Hubless Dicing Blades:
Hubless dicing blades are used in the manufacturing industry for cutting wafers. These blades have no physical connection to a motor or gearbox and hence they do not require any form of transmission mechanism. The blade is mounted directly on the spindle and spinning it without any external power source provides torque to drive the cutting action.
Application Insights:
The IC application segment accounted for the largest share of over 40.0% in 2017 and is projected to continue its dominance over the forecast period. The demand for ICs has witnessed a paradigm shift due to their miniaturization that enables them to be deployed in numerous end-use industries including telecommunication, computing, automotive and healthcare.
The discrete devices segment is anticipated to witness considerable growth at a CAGR of XX% from 2018 to 2030 owingto an increase in demand for various electronic products such as smartphones and wearable devices across the globe. Dicing blades are used during the manufacturing process of semiconductors which includes cutting off chips from wafers using different types of blades depending on their size requirements after they are sliced into smaller pieces called dies or chips along with other materials such as masks & substrates used during device packaging activities.
Regional Analysis:
Asia Pacific region dominated the global wafer dicing blade market in 2017. The growth is attributed to the presence of key players such as Taiwan Semiconductor Manufacturing Company (TSMC), Samsung, and GlobalFoundries. These companies are investing heavily in research & development activities to develop advanced semiconductor devices at low costs. This has resulted in high demand for semiconductor processing equipment from Asia Pacific region over last few years.
The Latin American regional market is expected to witness significant growth over the forecast period owing to increasing demand for IC manufacturing facilities from U.S., China, Japan, and Germany among other countries that have large population bases with high purchasing power parity (PPP). In addition, rising number of foundry service providers such as Globalfoundries will also drive industry expansion across this region during the forecast period (2018-2030).
Growth Factors:
- Increasing demand for semiconductor devices
- Growing number of wafer dicing blade manufacturers
- Rising adoption of wafer dicing blades in LED industry
- Technological advancements in the field of semiconductor manufacturing
- Growing demand for miniaturized and high-performance electronic devices
Scope Of The Report
Report Attributes
Report Details
Report Title
Wafer Dicing Blade Market Research Report
By Type
Hub Dicing Blades, Hubless Dicing Blades, Other
By Application
IC, Discrete Devices, LED
By Companies
DISCO, ADT, K&S, UKAM, Ceiba, Shanghai Sinyang Semiconductor Materials, DISCO
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
208
Number of Tables & Figures
146
Customization Available
Yes, the report can be customized as per your need.
Global Wafer Dicing Blade Market Report Segments:
The global Wafer Dicing Blade market is segmented on the basis of:
Types
Hub Dicing Blades, Hubless Dicing Blades, Other
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
IC, Discrete Devices, LED
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- DISCO
- ADT
- K&S
- UKAM
- Ceiba
- Shanghai Sinyang Semiconductor Materials
- DISCO
Highlights of The Wafer Dicing Blade Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Hub Dicing Blades
- Hubless Dicing Blades
- Other
- By Application:
- IC
- Discrete Devices
- LED
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Wafer Dicing Blade Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
A Wafer Dicing Blade is a type of blade used to cut wafers, such as silicon wafers, into small pieces.
Some of the major players in the wafer dicing blade market are DISCO, ADT, K&S, UKAM, Ceiba, Shanghai Sinyang Semiconductor Materials, DISCO.
The wafer dicing blade market is expected to register a CAGR of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Wafer Dicing Blade Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Wafer Dicing Blade Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Wafer Dicing Blade Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Wafer Dicing Blade Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Wafer Dicing Blade Market Size & Forecast, 2018-2028
4.5.1 Wafer Dicing Blade Market Size and Y-o-Y Growth
4.5.2 Wafer Dicing Blade Market Absolute $ Opportunity
Chapter 5 Global Wafer Dicing Blade Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Wafer Dicing Blade Market Size Forecast by Type
5.2.1 Hub Dicing Blades
5.2.2 Hubless Dicing Blades
5.2.3 Other
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Wafer Dicing Blade Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Wafer Dicing Blade Market Size Forecast by Applications
6.2.1 IC
6.2.2 Discrete Devices
6.2.3 LED
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Wafer Dicing Blade Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Wafer Dicing Blade Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Wafer Dicing Blade Analysis and Forecast
9.1 Introduction
9.2 North America Wafer Dicing Blade Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Wafer Dicing Blade Market Size Forecast by Type
9.6.1 Hub Dicing Blades
9.6.2 Hubless Dicing Blades
9.6.3 Other
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Wafer Dicing Blade Market Size Forecast by Applications
9.10.1 IC
9.10.2 Discrete Devices
9.10.3 LED
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Wafer Dicing Blade Analysis and Forecast
10.1 Introduction
10.2 Europe Wafer Dicing Blade Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Wafer Dicing Blade Market Size Forecast by Type
10.6.1 Hub Dicing Blades
10.6.2 Hubless Dicing Blades
10.6.3 Other
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Wafer Dicing Blade Market Size Forecast by Applications
10.10.1 IC
10.10.2 Discrete Devices
10.10.3 LED
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Wafer Dicing Blade Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Wafer Dicing Blade Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Wafer Dicing Blade Market Size Forecast by Type
11.6.1 Hub Dicing Blades
11.6.2 Hubless Dicing Blades
11.6.3 Other
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Wafer Dicing Blade Market Size Forecast by Applications
11.10.1 IC
11.10.2 Discrete Devices
11.10.3 LED
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Wafer Dicing Blade Analysis and Forecast
12.1 Introduction
12.2 Latin America Wafer Dicing Blade Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Wafer Dicing Blade Market Size Forecast by Type
12.6.1 Hub Dicing Blades
12.6.2 Hubless Dicing Blades
12.6.3 Other
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Wafer Dicing Blade Market Size Forecast by Applications
12.10.1 IC
12.10.2 Discrete Devices
12.10.3 LED
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Wafer Dicing Blade Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Wafer Dicing Blade Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Wafer Dicing Blade Market Size Forecast by Type
13.6.1 Hub Dicing Blades
13.6.2 Hubless Dicing Blades
13.6.3 Other
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Wafer Dicing Blade Market Size Forecast by Applications
13.10.1 IC
13.10.2 Discrete Devices
13.10.3 LED
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Wafer Dicing Blade Market: Competitive Dashboard
14.2 Global Wafer Dicing Blade Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 DISCO
14.3.2 ADT
14.3.3 K&S
14.3.4 UKAM
14.3.5 Ceiba
14.3.6 Shanghai Sinyang Semiconductor Materials
14.3.7 DISCO
