Market Overview:
The global wafer dicing machines market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for semiconductor and photovoltaic devices across the globe. In addition, the growing demand for miniaturized and high-performance devices is also contributing to the growth of this market. The laser dicing segment is expected to dominate the global wafer dicing machines market during the forecast period from 2018 to 2030. This segment accounted for a majority share of 71% in 2017 and is projected to grow at a CAGR of 6% during the forecast period.
Product Definition:
A wafer dicing machine is a tool used to cut semiconductor wafers into individual dies. This is done by using a diamond blade to make a very precise cut through the wafer. The importance of this tool comes from the fact that it allows for very small and intricate dies to be created, which can then be used in microelectronic devices.
Laser Dicing:
Laser dicing is a process of removing wafers in a controlled manner. It helps to produce uniform and fine cuts which are required for manufacturing semiconductors, microelectronics components, PCB’s (Printed Circuit Boards) and other electronic products. The laser beam used in the process is focused on the wafer which acts as an operator and simultaneously creates multiple parallel cuts along with specific patterns from one solid block of material.
Blades Dicing:
Blades dicing is a technique of cutting wafers where the material is divided into small pieces by the use of rotating blades. The process helps to achieve high accuracy and efficiency in terms of production. It also helps to reduce die wastage which can be attributed to improper wafer handling or poor quality raw material.
Application Insights:
The photovoltaic application segment accounted for the largest market share in 2017 and is projected to expand at a CAGR of XX% over the forecast period. The growth can be attributed to rising demand for solar energy across countries, such as China, India and Germany; increasing government support towards installation of rooftop solar panels; and growing need for clean energy generation due to rapid urbanization.
Semiconductor was the second-largest application segment in 2017 owing to increased use of wafer thinning machines by semiconductor manufacturers. The semiconductors are increasingly used in electronic devices on account of their high efficiency, miniaturization potentials, low power consumption properties leading to higher product demand globally.
Regional Analysis:
Asia Pacific region dominated the global market in 2017 and is expected to continue its dominance over the forecast period. The growth of this region can be attributed to increasing demand for semiconductors and solar panels. China, Taiwan Semiconductor Manufacturing Company (TSMC), Samsung, SK Hynix, Micron Technology Inc., and others are some of the major players operating in this industry. These companies are engaged in making investments for manufacturing processes that use dicing machines with high efficiency levels.
Growth Factors:
- Increasing demand for semiconductor devices in consumer electronics and telecommunications sectors
- Rising number of wafer fabrication plants across the globe
- Proliferation of 3D IC technology and miniaturization of semiconductor devices
- Growing trend of outsourcing manufacturing processes to reduce overall production cost
- Emergence of new applications such as MEMS, power ICs, and LED lighting
Scope Of The Report
Report Attributes
Report Details
Report Title
Wafer Dicing Machines Market Research Report
By Type
Laser Dicing, Blades Dicing
By Application
Photovoltaic, Semiconductor
By Companies
Accretech, DISCO Corporation, Advanced Dicing Technology, Loadpoint, Dynatex, 3D-Micromac AG, Wuhan Huagong Laser Engineering Co, Accretech
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
212
Number of Tables & Figures
149
Customization Available
Yes, the report can be customized as per your need.
Global Wafer Dicing Machines Market Report Segments:
The global Wafer Dicing Machines market is segmented on the basis of:
Types
Laser Dicing, Blades Dicing
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Photovoltaic, Semiconductor
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Accretech
- DISCO Corporation
- Advanced Dicing Technology
- Loadpoint
- Dynatex
- 3D-Micromac AG
- Wuhan Huagong Laser Engineering Co
- Accretech
Highlights of The Wafer Dicing Machines Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Laser Dicing
- Blades Dicing
- By Application:
- Photovoltaic
- Semiconductor
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Wafer Dicing Machines Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Wafer dicing machines are used to cut wafers into small pieces. They can be used in a variety of industries, including semiconductor and computer manufacturing.
Some of the key players operating in the wafer dicing machines market are Accretech, DISCO Corporation, Advanced Dicing Technology, Loadpoint, Dynatex, 3D-Micromac AG, Wuhan Huagong Laser Engineering Co, Accretech.
The wafer dicing machines market is expected to grow at a compound annual growth rate of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Wafer Dicing Machines Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Wafer Dicing Machines Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Wafer Dicing Machines Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Wafer Dicing Machines Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Wafer Dicing Machines Market Size & Forecast, 2018-2028
4.5.1 Wafer Dicing Machines Market Size and Y-o-Y Growth
4.5.2 Wafer Dicing Machines Market Absolute $ Opportunity
Chapter 5 Global Wafer Dicing Machines Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Wafer Dicing Machines Market Size Forecast by Type
5.2.1 Laser Dicing
5.2.2 Blades Dicing
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Wafer Dicing Machines Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Wafer Dicing Machines Market Size Forecast by Applications
6.2.1 Photovoltaic
6.2.2 Semiconductor
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Wafer Dicing Machines Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Wafer Dicing Machines Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Wafer Dicing Machines Analysis and Forecast
9.1 Introduction
9.2 North America Wafer Dicing Machines Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Wafer Dicing Machines Market Size Forecast by Type
9.6.1 Laser Dicing
9.6.2 Blades Dicing
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Wafer Dicing Machines Market Size Forecast by Applications
9.10.1 Photovoltaic
9.10.2 Semiconductor
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Wafer Dicing Machines Analysis and Forecast
10.1 Introduction
10.2 Europe Wafer Dicing Machines Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Wafer Dicing Machines Market Size Forecast by Type
10.6.1 Laser Dicing
10.6.2 Blades Dicing
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Wafer Dicing Machines Market Size Forecast by Applications
10.10.1 Photovoltaic
10.10.2 Semiconductor
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Wafer Dicing Machines Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Wafer Dicing Machines Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Wafer Dicing Machines Market Size Forecast by Type
11.6.1 Laser Dicing
11.6.2 Blades Dicing
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Wafer Dicing Machines Market Size Forecast by Applications
11.10.1 Photovoltaic
11.10.2 Semiconductor
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Wafer Dicing Machines Analysis and Forecast
12.1 Introduction
12.2 Latin America Wafer Dicing Machines Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Wafer Dicing Machines Market Size Forecast by Type
12.6.1 Laser Dicing
12.6.2 Blades Dicing
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Wafer Dicing Machines Market Size Forecast by Applications
12.10.1 Photovoltaic
12.10.2 Semiconductor
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Wafer Dicing Machines Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Wafer Dicing Machines Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Wafer Dicing Machines Market Size Forecast by Type
13.6.1 Laser Dicing
13.6.2 Blades Dicing
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Wafer Dicing Machines Market Size Forecast by Applications
13.10.1 Photovoltaic
13.10.2 Semiconductor
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Wafer Dicing Machines Market: Competitive Dashboard
14.2 Global Wafer Dicing Machines Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Accretech
14.3.2 DISCO Corporation
14.3.3 Advanced Dicing Technology
14.3.4 Loadpoint
14.3.5 Dynatex
14.3.6 3D-Micromac AG
14.3.7 Wuhan Huagong Laser Engineering Co
14.3.8 Accretech
