Latest Update: Impact of current COVID-19 situation has been considered in this report while making the analysis.
Global Wafer Fab Equipment(WFE) Market by Type (150 Mm Wafer, 200 Mm Wafer, 300 Mm Wafer, Others), By Application (Electronics, Automobile, Manufacture, Others) and Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast From 2022 To 2030-report

Global Wafer Fab Equipment(WFE) Market by Type (150 Mm Wafer, 200 Mm Wafer, 300 Mm Wafer, Others), By Application (Electronics, Automobile, Manufacture, Others) and Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast From 2022 To 2030

Report ID: 308327 4200 Machinery & Equipment 377 146 Pages 4.9 (36)
                                          

Market Overview:


The global wafer fab equipment (WFE) market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The growth in the market can be attributed to the increasing demand for semiconductor devices across different applications, such as electronics, automobiles, and others. In addition, the growing demand for miniaturization of electronic devices is also fueling the growth of this market. Furthermore, technological advancements in WFE are also contributing to the growth of this market.


Global Wafer Fab Equipment(WFE) Industry Outlook


Product Definition:


Wafer Fab Equipment (WFE) is the collective name for the machines used in semiconductor manufacturing to create integrated circuits on silicon wafers. WFE includes deposition, etching, and cleaning systems; lithography systems; and metrology and inspection tools. The importance of WFE is that it enables manufacturers to fabricate semiconductors with increasingly smaller feature sizes, which in turn leads to more powerful and efficient electronic devices.


150 Mm Wafer:


150 mm Wafer, also known as 150mm diameter wafer or 150mm-diameter semiconductor wafer, is a type of semiconductor device manufacturing substrate. It has the size and shape of a standard silicon chip. The thickness of these substrates can be varied from company to company depending on their requirements. These substrates are used in electronic devices such as mobile phones and personal computers among others depending upon its application which may change over time owing to technological advancements in the industry.


200 Mm Wafer:


200 mm Wafer is the largest wafer that can be handled by a single wafer fabber. It is also called as large-sized wafers and it’s size roughly equivalent to 200 microns. The 200 mm diameter includes the thickness of both silicon nitride and silicon dioxide layers which form a protective layer over the device.


Application Insights:


The electronics segment accounted for the largest market share in 2017 and is projected to expand at a CAGR of XX% from 2018 to 2030. The growth can be attributed to the increasing demand for semiconductors across various applications including smartphones, wearable devices, networking equipment, etc. Furthermore, technological advancements such as high-density circuit board (HDCB) manufacturing are further expected to drive the industry growth over the forecast period.


Automobile application segment is estimated to grow at a significant rate owingto rising demand for automobiles across all regions coupled with technological advancements in automobile manufacturing process such as High-K Metal Gate (HKMG). Furthermore, other emerging applications include aerospace & defense and medical equipment which are majorly used in electronic appliances or medical imaging systems.  Increasing use of Wafer Fab Equipment (WFE) by manufacturers of consumer electronics products including smartphones and wearable devices is expected fuel market growth during the forecast period.


Regional Analysis:


Asia Pacific region dominated the global market in 2017 and is expected to continue its dominance over the forecast period. The growth of this region can be attributed to increasing demand for electronic products, particularly smartphones and tablets, along with rising investments by foreign players in China. In addition, favorable government policies promoting manufacturing activities are also expected to drive regional growth over the forecast period.


The electronics industry is one of the significant sectors contributing towards economic development in Asia Pacific countries such as India and South Korea owing to rapid technological advancements coupled with low production cost as compared to developed regions. This has ledto an increasein equipment investment by major players suchas Samsung Electronics Co., Ltd., SK Hynix Semiconductor Inc., Micron Technology Inc.; etc.


Growth Factors:


  • Increasing demand for semiconductor devices: The growth of the semiconductor industry is one of the primary drivers for the WFE market. The increasing demand for semiconductor devices, such as smartphones, tablets, and automotive electronics is expected to drive the growth of WFE market in coming years.
  • Growing number of fabs: There has been a significant increase in the number of fabs over last few years due to advancement in technology and increase in demand for semiconductors. This is expected to be another major driver for WFE market in coming years.
  • Shift towards 300mm wafers: The shift towards 300mm wafers is another key trend that is expected to drive the growth of WFE market during forecast period. This shift is mainly driven by increased demand from high-end applications such as smartphones and tablets segments..

Scope Of The Report

Report Attributes

Report Details

Report Title

Wafer Fab Equipment(WFE) Market Research Report

By Type

150 Mm Wafer, 200 Mm Wafer, 300 Mm Wafer, Others

By Application

Electronics, Automobile, Manufacture, Others

By Companies

Applied Materials, ASML, KLA-Tencor, Lam Research, TEL, Dainippon Screen Manufacturing, Hitachi High Technologies, Nikon, Hitachi Kokusai Electric, Applied Materials

Regions Covered

North America, Europe, APAC, Latin America, MEA

Base Year

2021

Historical Year

2019 to 2020 (Data from 2010 can be provided as per availability)

Forecast Year

2030

Number of Pages

146

Number of Tables & Figures

103

Customization Available

Yes, the report can be customized as per your need.


Global Wafer Fab Equipment(WFE) Market Report Segments:

The global Wafer Fab Equipment(WFE) market is segmented on the basis of:

Types

150 Mm Wafer, 200 Mm Wafer, 300 Mm Wafer, Others

The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.

Applications

Electronics, Automobile, Manufacture, Others

The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.

Some of the companies that are profiled in this report are:

  1. Applied Materials
  2. ASML
  3. KLA-Tencor
  4. Lam Research
  5. TEL
  6. Dainippon Screen Manufacturing
  7. Hitachi High Technologies
  8. Nikon
  9. Hitachi Kokusai Electric
  10. Applied Materials

Global Wafer Fab Equipment(WFE) Market Overview


Highlights of The Wafer Fab Equipment(WFE) Market Report:

  1. The market structure and projections for the coming years.
  2. Drivers, restraints, opportunities, and current trends of market.
  3. Historical data and forecast.
  4. Estimations for the forecast period 2030.
  5. Developments and trends in the market.
  6. By Type:

    1. 150 Mm Wafer
    2. 200 Mm Wafer
    3. 300 Mm Wafer
    4. Others
  1. By Application:

    1. Electronics
    2. Automobile
    3. Manufacture
    4. Others
  1. Market scenario by region, sub-region, and country.
  2. Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
  3. Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
  4. Government Policies, Macro & Micro economic factors are also included in the report.

We have studied the Wafer Fab Equipment(WFE) Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.

Regional Analysis

  • North America
  • Europe
  • Asia Pacific
  • Middle East & Africa
  • Latin America

Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.

The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.

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Global Wafer Fab Equipment(WFE) Market Statistics

8 Reasons to Buy This Report

  1. Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
  2. Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
  3. Implemented Robust Methodology to Prepare the Report
  4. Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
  5. Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
  6. Provides Information About the Top-winning Strategies Implemented by Industry Players.
  7. In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
  8. Customization of the Report Available

Frequently Asked Questions?


Wafer fab equipment is a type of semiconductor manufacturing equipment that uses thin wafers as the basic element for semiconductor chips. The process begins by depositing a layer of silicon on top of a substrate, which is then cut into small pieces and patterned with circuits.

Some of the major players in the wafer fab equipment(wfe) market are Applied Materials, ASML, KLA-Tencor, Lam Research, TEL, Dainippon Screen Manufacturing, Hitachi High Technologies, Nikon, Hitachi Kokusai Electric, Applied Materials.

The wafer fab equipment(wfe) market is expected to grow at a compound annual growth rate of 6.5%.

                                            
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Wafer Fab Equipment(WFE) Market Overview    4.1 Introduction       4.1.1 Market Taxonomy       4.1.2 Market Definition       4.1.3 Macro-Economic Factors Impacting the Market Growth    4.2 Wafer Fab Equipment(WFE) Market Dynamics       4.2.1 Market Drivers       4.2.2 Market Restraints       4.2.3 Market Opportunity    4.3 Wafer Fab Equipment(WFE) Market - Supply Chain Analysis       4.3.1 List of Key Suppliers       4.3.2 List of Key Distributors       4.3.3 List of Key Consumers    4.4 Key Forces Shaping the Wafer Fab Equipment(WFE) Market       4.4.1 Bargaining Power of Suppliers       4.4.2 Bargaining Power of Buyers       4.4.3 Threat of Substitution       4.4.4 Threat of New Entrants       4.4.5 Competitive Rivalry    4.5 Global Wafer Fab Equipment(WFE) Market Size & Forecast, 2020-2028       4.5.1 Wafer Fab Equipment(WFE) Market Size and Y-o-Y Growth       4.5.2 Wafer Fab Equipment(WFE) Market Absolute $ Opportunity

Chapter 5 Global  Market Analysis and Forecast by Type
   5.1 Introduction
      5.1.1 Key Market Trends & Growth Opportunities by Type
      5.1.2 Basis Point Share (BPS) Analysis by Type
      5.1.3 Absolute $ Opportunity Assessment by Type
   5.2  Market Size Forecast by Type
      5.2.1 150 Mm Wafer
      5.2.2 200 Mm Wafer
      5.2.3 300 Mm Wafer
      5.2.4 Others
   5.3 Market Attractiveness Analysis by Type

Chapter 6 Global  Market Analysis and Forecast by Applications
   6.1 Introduction
      6.1.1 Key Market Trends & Growth Opportunities by Applications
      6.1.2 Basis Point Share (BPS) Analysis by Applications
      6.1.3 Absolute $ Opportunity Assessment by Applications
   6.2  Market Size Forecast by Applications
      6.2.1 Electronics
      6.2.2 Automobile
      6.2.3 Manufacture
      6.2.4 Others
   6.3 Market Attractiveness Analysis by Applications

Chapter 7 Global Wafer Fab Equipment(WFE) Market Analysis and Forecast by Region
   7.1 Introduction
      7.1.1 Key Market Trends & Growth Opportunities by Region
      7.1.2 Basis Point Share (BPS) Analysis by Region
      7.1.3 Absolute $ Opportunity Assessment by Region
   7.2 Wafer Fab Equipment(WFE) Market Size Forecast by Region
      7.2.1 North America
      7.2.2 Europe
      7.2.3 Asia Pacific
      7.2.4 Latin America
      7.2.5 Middle East & Africa (MEA)
   7.3 Market Attractiveness Analysis by Region

Chapter 8 Coronavirus Disease (COVID-19) Impact 
   8.1 Introduction 
   8.2 Current & Future Impact Analysis 
   8.3 Economic Impact Analysis 
   8.4 Government Policies 
   8.5 Investment Scenario

Chapter 9 North America  Analysis and Forecast
   9.1 Introduction
   9.2 North America  Market Size Forecast by Country
      9.2.1 U.S.
      9.2.2 Canada
   9.3 Basis Point Share (BPS) Analysis by Country
   9.4 Absolute $ Opportunity Assessment by Country
   9.5 Market Attractiveness Analysis by Country
   9.6 North America  Market Size Forecast by Type
      9.6.1 150 Mm Wafer
      9.6.2 200 Mm Wafer
      9.6.3 300 Mm Wafer
      9.6.4 Others
   9.7 Basis Point Share (BPS) Analysis by Type 
   9.8 Absolute $ Opportunity Assessment by Type 
   9.9 Market Attractiveness Analysis by Type
   9.10 North America  Market Size Forecast by Applications
      9.10.1 Electronics
      9.10.2 Automobile
      9.10.3 Manufacture
      9.10.4 Others
   9.11 Basis Point Share (BPS) Analysis by Applications 
   9.12 Absolute $ Opportunity Assessment by Applications 
   9.13 Market Attractiveness Analysis by Applications

Chapter 10 Europe  Analysis and Forecast
   10.1 Introduction
   10.2 Europe  Market Size Forecast by Country
      10.2.1 Germany
      10.2.2 France
      10.2.3 Italy
      10.2.4 U.K.
      10.2.5 Spain
      10.2.6 Russia
      10.2.7 Rest of Europe
   10.3 Basis Point Share (BPS) Analysis by Country
   10.4 Absolute $ Opportunity Assessment by Country
   10.5 Market Attractiveness Analysis by Country
   10.6 Europe  Market Size Forecast by Type
      10.6.1 150 Mm Wafer
      10.6.2 200 Mm Wafer
      10.6.3 300 Mm Wafer
      10.6.4 Others
   10.7 Basis Point Share (BPS) Analysis by Type 
   10.8 Absolute $ Opportunity Assessment by Type 
   10.9 Market Attractiveness Analysis by Type
   10.10 Europe  Market Size Forecast by Applications
      10.10.1 Electronics
      10.10.2 Automobile
      10.10.3 Manufacture
      10.10.4 Others
   10.11 Basis Point Share (BPS) Analysis by Applications 
   10.12 Absolute $ Opportunity Assessment by Applications 
   10.13 Market Attractiveness Analysis by Applications

Chapter 11 Asia Pacific  Analysis and Forecast
   11.1 Introduction
   11.2 Asia Pacific  Market Size Forecast by Country
      11.2.1 China
      11.2.2 Japan
      11.2.3 South Korea
      11.2.4 India
      11.2.5 Australia
      11.2.6 South East Asia (SEA)
      11.2.7 Rest of Asia Pacific (APAC)
   11.3 Basis Point Share (BPS) Analysis by Country
   11.4 Absolute $ Opportunity Assessment by Country
   11.5 Market Attractiveness Analysis by Country
   11.6 Asia Pacific  Market Size Forecast by Type
      11.6.1 150 Mm Wafer
      11.6.2 200 Mm Wafer
      11.6.3 300 Mm Wafer
      11.6.4 Others
   11.7 Basis Point Share (BPS) Analysis by Type 
   11.8 Absolute $ Opportunity Assessment by Type 
   11.9 Market Attractiveness Analysis by Type
   11.10 Asia Pacific  Market Size Forecast by Applications
      11.10.1 Electronics
      11.10.2 Automobile
      11.10.3 Manufacture
      11.10.4 Others
   11.11 Basis Point Share (BPS) Analysis by Applications 
   11.12 Absolute $ Opportunity Assessment by Applications 
   11.13 Market Attractiveness Analysis by Applications

Chapter 12 Latin America  Analysis and Forecast
   12.1 Introduction
   12.2 Latin America  Market Size Forecast by Country
      12.2.1 Brazil
      12.2.2 Mexico
      12.2.3 Rest of Latin America (LATAM)
   12.3 Basis Point Share (BPS) Analysis by Country
   12.4 Absolute $ Opportunity Assessment by Country
   12.5 Market Attractiveness Analysis by Country
   12.6 Latin America  Market Size Forecast by Type
      12.6.1 150 Mm Wafer
      12.6.2 200 Mm Wafer
      12.6.3 300 Mm Wafer
      12.6.4 Others
   12.7 Basis Point Share (BPS) Analysis by Type 
   12.8 Absolute $ Opportunity Assessment by Type 
   12.9 Market Attractiveness Analysis by Type
   12.10 Latin America  Market Size Forecast by Applications
      12.10.1 Electronics
      12.10.2 Automobile
      12.10.3 Manufacture
      12.10.4 Others
   12.11 Basis Point Share (BPS) Analysis by Applications 
   12.12 Absolute $ Opportunity Assessment by Applications 
   12.13 Market Attractiveness Analysis by Applications

Chapter 13 Middle East & Africa (MEA)  Analysis and Forecast
   13.1 Introduction
   13.2 Middle East & Africa (MEA)  Market Size Forecast by Country
      13.2.1 Saudi Arabia
      13.2.2 South Africa
      13.2.3 UAE
      13.2.4 Rest of Middle East & Africa (MEA)
   13.3 Basis Point Share (BPS) Analysis by Country
   13.4 Absolute $ Opportunity Assessment by Country
   13.5 Market Attractiveness Analysis by Country
   13.6 Middle East & Africa (MEA)  Market Size Forecast by Type
      13.6.1 150 Mm Wafer
      13.6.2 200 Mm Wafer
      13.6.3 300 Mm Wafer
      13.6.4 Others
   13.7 Basis Point Share (BPS) Analysis by Type 
   13.8 Absolute $ Opportunity Assessment by Type 
   13.9 Market Attractiveness Analysis by Type
   13.10 Middle East & Africa (MEA)  Market Size Forecast by Applications
      13.10.1 Electronics
      13.10.2 Automobile
      13.10.3 Manufacture
      13.10.4 Others
   13.11 Basis Point Share (BPS) Analysis by Applications 
   13.12 Absolute $ Opportunity Assessment by Applications 
   13.13 Market Attractiveness Analysis by Applications

Chapter 14 Competition Landscape 
   14.1 Wafer Fab Equipment(WFE) Market: Competitive Dashboard
   14.2 Global Wafer Fab Equipment(WFE) Market: Market Share Analysis, 2019
   14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy) 
      14.3.1 Applied Materials
      14.3.2 ASML
      14.3.3 KLA-Tencor
      14.3.4 Lam Research
      14.3.5 TEL
      14.3.6 Dainippon Screen Manufacturing
      14.3.7 Hitachi High Technologies
      14.3.8 Nikon
      14.3.9 Hitachi Kokusai Electric
      14.3.10 Applied Materials

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