Market Overview:
The global wafer grinding machine market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for semiconductor devices and rising investments in the semiconductor industry. The market is segmented on the basis of type, application, and region. On the basis of type, it is divided into semi-automatic and full-automatic machines. By application, it is classified into ＜4 inch, 4-8 inch, 8-12 inch, and others (including >12 inch). Regionally speaking, North America dominates this market followed by Europe and Asia Pacific respectively.
Product Definition:
A wafer grinding machine is a device that uses a rotating abrasive disc to remove material from the surface of semiconductor wafers. The importance of this type of machine is that it allows for precise control over the thickness and uniformity of the wafers, which is necessary for their subsequent use in manufacturing microchips.
Semi-automatic:
Semi-automatic wafer grinding machine is a type of automated machinery used for processing semiconductor materials such as silicon wafers into very fine pieces. The process involves two major operations, namely rotating and grinding. Semi-automatic machines are capable of performing these two functions at the same time; however, they lack the ability to perform different operations depending on the material being processed.
The global semi-automatic wafer grinding machine market was valued at USD 1,849.
Full-automatic:
Full-automatic wafer grinding machine is a fully automatic system for manufacturing semiconductor devices. It includes various components such as sensors, motors, controllers and other electronic systems. The major application areas of full-automatic wafer grinding machine include consumer electronics & telecommunication equipment and automotive industry among others.
Application Insights:
The global wafer grinding machine market has been segmented on the basis of application into semiconductors, display technologies, solar products, and others. The semiconductor application segment accounted for a major share in 2017 and is projected to witness significant growth over the forecast period. This can be attributed to increasing demand for integrated circuits from various end-use industries such as telecommunication & IT, automotive & transportation systems among others.
Moreover, technological advancements coupled with high product demand are expected to drive industry growth over the coming years. For instance, introduction of advanced semi-automatic or fully automatic machines along with an automated tracking system will further boost industry penetration across several applications globally.
Regional Analysis:
Asia Pacific region dominated the global market in 2017 and is expected to continue its dominance over the forecast period. The growth of this region can be attributed to increasing demand for electronic products such as smartphones, tablets, personal computers, etc. Rising disposable income coupled with expanding manufacturing sector in developing economies including China and India are anticipated to drive the regional market over the forecast period.
The Asia Pacific regional market is also characterized by presence of key electronic product manufacturers such as Wistron Corporation; Quanta Computer Inc.; Compal Electronics Inc.; Inventec Corporation; Foxconn Technology Group; Pegatron Corp.; and Hon Hai Precision Industry Company Ltd., among others. These players are focusing on expansion strategies through establishment of new plants or joint ventures with foreign companies that would enable them to meet growing demand from end-users across Asia Pacific region at competitive prices.
Growth Factors:
- Increasing demand for semiconductor devices: The global semiconductor market is expected to grow at a CAGR of 6.5% from 2016 to 2020, reaching a value of USD 333.8 billion by 2020. This is primarily attributed to the increasing demand for semiconductor devices in consumer electronics, automotive, and industrial sectors.
- Growing demand for miniaturized and energy-efficient electronic devices: With the growing trend of miniaturization and increased focus on energy efficiency, the need for advanced wafer grinding machines that can provide high accuracy and precision is also increasing.
- Rising number of fabless companies: The number of fabless companies is rising rapidly due to advancements in technology that have made it possible for them to outsource manufacturing processes instead of setting up their own fabrication facilities (“fab”). This is resulting in an increase in demand for wafer grinding machines from contract manufacturers catering to these companies.
Scope Of The Report
Report Attributes
Report Details
Report Title
Wafer Grinding Machine Market Research Report
By Type
Semi-automatic, Full-automatic
By Application
＜4 inch, 4-8 inch, 8-12 inch, Others
By Companies
DISCO, ACCRETECH, CETGC, Suzhou Delphi Laser Co. Ltd., SPTS Technologies Limited, Plasma-Therm LLC, Han's Laser Technology Industry Group Co. Ltd., ASM Laser Separation International (ALSI) B.V., N-TEC Corp, DISCO
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
190
Number of Tables & Figures
133
Customization Available
Yes, the report can be customized as per your need.
Global Wafer Grinding Machine Market Report Segments:
The global Wafer Grinding Machine market is segmented on the basis of:
Types
Semi-automatic, Full-automatic
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
＜4 inch, 4-8 inch, 8-12 inch, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- DISCO
- ACCRETECH
- CETGC
- Suzhou Delphi Laser Co. Ltd.
- SPTS Technologies Limited
- Plasma-Therm LLC
- Han's Laser Technology Industry Group Co. Ltd.
- ASM Laser Separation International (ALSI) B.V.
- N-TEC Corp
- DISCO
Highlights of The Wafer Grinding Machine Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Semi-automatic
- Full-automatic
- By Application:
- ＜4 inch
- 4-8 inch
- 8-12 inch
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Wafer Grinding Machine Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
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- Product & Brand Management
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Wafer grinding machine is a type of industrial milling machine that is used to grind semiconductor wafers. It uses a rotating abrasive wheel to remove material from the wafer, which in turn reduces the size and thickness of the wafer.
Some of the major players in the wafer grinding machine market are DISCO, ACCRETECH, CETGC, Suzhou Delphi Laser Co. Ltd., SPTS Technologies Limited, Plasma-Therm LLC, Han's Laser Technology Industry Group Co. Ltd., ASM Laser Separation International (ALSI) B.V., N-TEC Corp, DISCO.
The wafer grinding machine market is expected to register a CAGR of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Wafer Grinding Machine Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Wafer Grinding Machine Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Wafer Grinding Machine Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Wafer Grinding Machine Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Wafer Grinding Machine Market Size & Forecast, 2018-2028
4.5.1 Wafer Grinding Machine Market Size and Y-o-Y Growth
4.5.2 Wafer Grinding Machine Market Absolute $ Opportunity
Chapter 5 Global Wafer Grinding Machine Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Wafer Grinding Machine Market Size Forecast by Type
5.2.1 Semi-automatic
5.2.2 Full-automatic
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Wafer Grinding Machine Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Wafer Grinding Machine Market Size Forecast by Applications
6.2.1 ＜4 inch
6.2.2 4-8 inch
6.2.3 8-12 inch
6.2.4 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Wafer Grinding Machine Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Wafer Grinding Machine Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Wafer Grinding Machine Analysis and Forecast
9.1 Introduction
9.2 North America Wafer Grinding Machine Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Wafer Grinding Machine Market Size Forecast by Type
9.6.1 Semi-automatic
9.6.2 Full-automatic
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Wafer Grinding Machine Market Size Forecast by Applications
9.10.1 ＜4 inch
9.10.2 4-8 inch
9.10.3 8-12 inch
9.10.4 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Wafer Grinding Machine Analysis and Forecast
10.1 Introduction
10.2 Europe Wafer Grinding Machine Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Wafer Grinding Machine Market Size Forecast by Type
10.6.1 Semi-automatic
10.6.2 Full-automatic
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Wafer Grinding Machine Market Size Forecast by Applications
10.10.1 ＜4 inch
10.10.2 4-8 inch
10.10.3 8-12 inch
10.10.4 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Wafer Grinding Machine Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Wafer Grinding Machine Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Wafer Grinding Machine Market Size Forecast by Type
11.6.1 Semi-automatic
11.6.2 Full-automatic
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Wafer Grinding Machine Market Size Forecast by Applications
11.10.1 ＜4 inch
11.10.2 4-8 inch
11.10.3 8-12 inch
11.10.4 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Wafer Grinding Machine Analysis and Forecast
12.1 Introduction
12.2 Latin America Wafer Grinding Machine Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Wafer Grinding Machine Market Size Forecast by Type
12.6.1 Semi-automatic
12.6.2 Full-automatic
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Wafer Grinding Machine Market Size Forecast by Applications
12.10.1 ＜4 inch
12.10.2 4-8 inch
12.10.3 8-12 inch
12.10.4 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Wafer Grinding Machine Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Wafer Grinding Machine Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Wafer Grinding Machine Market Size Forecast by Type
13.6.1 Semi-automatic
13.6.2 Full-automatic
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Wafer Grinding Machine Market Size Forecast by Applications
13.10.1 ＜4 inch
13.10.2 4-8 inch
13.10.3 8-12 inch
13.10.4 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Wafer Grinding Machine Market: Competitive Dashboard
14.2 Global Wafer Grinding Machine Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 DISCO
14.3.2 ACCRETECH
14.3.3 CETGC
14.3.4 Suzhou Delphi Laser Co. Ltd.
14.3.5 SPTS Technologies Limited
14.3.6 Plasma-Therm LLC
14.3.7 Han's Laser Technology Industry Group Co. Ltd.
14.3.8 ASM Laser Separation International (ALSI) B.V.
14.3.9 N-TEC Corp
14.3.10 DISCO
