Market Overview:
The global wafer-level manufacturing equipment market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for semiconductor devices and rising investments in the semiconductor industry. Wafer fab equipment held the largest share of the global wafer-level manufacturing equipment market in 2017 and is expected to maintain its dominance during the forecast period. This can be attributed to factors such as miniaturization of semiconductor devices, increase in demand for advanced packaging solutions, and growing trend of 3D integration.
Product Definition:
Wafer-level Manufacturing Equipment is a type of equipment used in the manufacturing process of semiconductor devices. It is used to fabricate semiconductor wafers, which are thin slices of silicon that serve as the foundation for microchips. Wafer-level Manufacturing Equipment is important because it allows manufacturers to produce large quantities of high quality semiconductor devices at a low cost.
Wafer Fab Equipment:
Wafer fab equipment is used to fabricate semiconductor wafers at the nanometer level. The primary function of these machines is to control and monitor the processes such as deposition, lithography, epitaxial growth, wet etching and dry etching. These machines are also capable of handling materials such as silicon nitride (Si3N4), silicon dioxide (SiO2) and hafnium oxide among others.
Wafer-Level Packaging And Assembly Equipment:
Wafer-level packaging and assembly equipment are used in the fabrication of integrated circuits (IC) at the wafer level. The major application areas include automotive, consumer electronics, telecommunications, computer hardware & software industry. Wafer-level packaging and assembly equipment is expected to witness significant growth owing to its increasing demand from these end-use industries over the forecast period.
Application Insights:
The electronics segment accounted for the largest revenue share in 2016 and is projected to continue its dominance over the forecast period. The growth of this segment can be attributed to increasing demand for semiconductors from various end-use industries such as telecommunication, consumer electronics, and automotive. Furthermore, technological advancements in semiconductor manufacturing have led to increased use of wafer-level manufacturing equipment by foundry processes such as mask writing and patterning.
The commercial application segment is expected witness significant growth during the forecast period owing to rising demand from medical equipment manufacturers worldwide. Medical equipment manufacturers are increasingly using wafer-level manufacturing technology due to high accuracy requirements for their products coupled with low costs associated with it compared with traditional methods used before WLMCE was introduced in production lines at a commercial level.
Regional Analysis:
Asia Pacific region accounted for the largest revenue share in 2017 and is expected to continue its dominance over the forecast period. The growth can be attributed to increasing demand for electronic products, particularly smartphones and tablets, along with rapid industrialization. China is projected to dominate this market owing to low manufacturing costs coupled with easy availability of labor & resources.
The Asia Pacific regional market was followed by Europe that accounted for a significant revenue share in 2017 owing to high demand from several industries including automotive, aerospace & defense, consumer electronics etc. In addition European Union (EU) has implemented several directives such as Electronics Product Directive (EPD), which demands product design consistent with safety & environmental standards set by EU member states thereby driving the industry growth across Europe region.
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Rising demand for semiconductor components in automotive and telecommunication industries
- Proliferation of 3D printing technology
- Growing trend of outsourcing manufacturing processes to reduce overall production cost
- Emergence of new applications such as flexible displays and sensors
Scope Of The Report
Report Attributes
Report Details
Report Title
Wafer-level Manufacturing Equipment Market Research Report
By Type
Wafer Fab Equipment, Wafer-Level Packaging And Assembly Equipment, Others
By Application
Electronics, Commercial, Others
By Companies
Applied Materials, ASML, TEL, Lam Research, KLA-Tencor, Dainippon, Advantest, Canon, Hitachi, JEOL, Applied Materials
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
164
Number of Tables & Figures
115
Customization Available
Yes, the report can be customized as per your need.
Global Wafer-level Manufacturing Equipment Market Report Segments:
The global Wafer-level Manufacturing Equipment market is segmented on the basis of:
Types
Wafer Fab Equipment, Wafer-Level Packaging And Assembly Equipment, Others
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Electronics, Commercial, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Applied Materials
- ASML
- TEL
- Lam Research
- KLA-Tencor
- Dainippon
- Advantest
- Canon
- Hitachi
- JEOL
- Applied Materials
Highlights of The Wafer-level Manufacturing Equipment Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Wafer Fab Equipment
- Wafer-Level Packaging And Assembly Equipment
- Others
- By Application:
- Electronics
- Commercial
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Wafer-level Manufacturing Equipment Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Wafer-level manufacturing equipment is a type of semiconductor fabrication equipment that uses very small pieces of silicon wafers as the foundation for creating electronic devices. The technology was first developed in the early 1990s and has since become an important part of the semiconductor industry.
Some of the key players operating in the wafer-level manufacturing equipment market are Applied Materials, ASML, TEL, Lam Research, KLA-Tencor, Dainippon, Advantest, Canon, Hitachi, JEOL, Applied Materials.
The wafer-level manufacturing equipment market is expected to register a CAGR of 6.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Wafer-level Manufacturing Equipment Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Wafer-level Manufacturing Equipment Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Wafer-level Manufacturing Equipment Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Wafer-level Manufacturing Equipment Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Wafer-level Manufacturing Equipment Market Size & Forecast, 2020-2028
4.5.1 Wafer-level Manufacturing Equipment Market Size and Y-o-Y Growth
4.5.2 Wafer-level Manufacturing Equipment Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Wafer Fab Equipment
5.2.2 Wafer-Level Packaging And Assembly Equipment
5.2.3 Others
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Electronics
6.2.2 Commercial
6.2.3 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Wafer-level Manufacturing Equipment Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Wafer-level Manufacturing Equipment Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Wafer Fab Equipment
9.6.2 Wafer-Level Packaging And Assembly Equipment
9.6.3 Others
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Electronics
9.10.2 Commercial
9.10.3 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Wafer Fab Equipment
10.6.2 Wafer-Level Packaging And Assembly Equipment
10.6.3 Others
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Electronics
10.10.2 Commercial
10.10.3 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Wafer Fab Equipment
11.6.2 Wafer-Level Packaging And Assembly Equipment
11.6.3 Others
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Electronics
11.10.2 Commercial
11.10.3 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Wafer Fab Equipment
12.6.2 Wafer-Level Packaging And Assembly Equipment
12.6.3 Others
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Electronics
12.10.2 Commercial
12.10.3 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Wafer Fab Equipment
13.6.2 Wafer-Level Packaging And Assembly Equipment
13.6.3 Others
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Electronics
13.10.2 Commercial
13.10.3 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Wafer-level Manufacturing Equipment Market: Competitive Dashboard
14.2 Global Wafer-level Manufacturing Equipment Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Applied Materials
14.3.2 ASML
14.3.3 TEL
14.3.4 Lam Research
14.3.5 KLA-Tencor
14.3.6 Dainippon
14.3.7 Advantest
14.3.8 Canon
14.3.9 Hitachi
14.3.10 JEOL
14.3.11 Applied Materials
