Market Overview:
The global wafer level packaging market is expected to grow at a CAGR of 9.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for miniaturization and higher performance in electronic devices, rising demand for advanced packaging solutions in automotive and industrial applications, and growing adoption of 3D TSV technology. Based on type, the global wafer level packaging market is segmented into 3D TSV WLP, 2.5D TSV WLP, WLCSP (Wafer Level Chip Scale Package), Nano WLP (Near-Field Communication Chips), and others (2D TSV WLP and compliant WLP). The 3D TSV technology segment is expected to grow at the highest CAGR during the forecast period owing to its advantages such as high packing density, improved thermal performance, reduced footprint size, and low manufacturing cost as compared to other types of wafer level packaging technologies. Based on application, the global wafer level packaging market is segmented into electronics, IT & telecommunication equipment; industrial machinery; automotive components; aerospace & defense systems; medical devices & equipment; others (media & entertainment sector and non-conventional energy resources sector). The electronics application segment accounted for majority share of the global wafer level packaging market in 2017 due to increasing demand for miniaturized electronic devices across different end-use industries.
Product Definition:
A wafer level package (WLP) is a type of semiconductor package that uses a thin, single-crystal silicon wafer as the substrate. The term "wafer level" refers to the fact that the entire device is fabricated on a single wafer, which is then cut into individual packaged devices. Wafers can be packaged in either leaded or leadless packages.
3D TSV WLP:
3D TSV WLP is a new wafer level packaging technology that was introduced by the International Packaging Machinery Manufacturers Association (IPMMA) in 2017. It is an efficient method to produce high-quality semiconductor chips with reduced process times and increased yield. The 3D TSV wafer level package offers several benefits such as it enables higher yields, reduces die-to-wafer contact area, provides improved thermal management, and helps reduce or eliminate warpage.
2.5D TSV WLP:
2.5D Top-Sided Vias or 2.5D TSV is a type of via hole in wafer level packaging, which has two metal leads coming out of the top surface of the package and then connected by a wire to make an electrical connection inside the semiconductor device. The process allows for smaller package size along with lower power consumption as compared to 3D via technology, while also providing mechanical support for higher current applications (500 mA and above).
Application Insights:
The electronics segment accounted for the largest revenue share in 2016 and is projected to continue leading over the forecast period. The growth of this application segment can be attributed to increasing demand for integrated circuits from various end-use industries such as consumer electronics, telecommunication, and IT & ITeS. Furthermore, rapid growth of semiconductor industry coupled with high demand for packaging solutions is anticipated to boost product usage in electronic devices over the coming years.
IT & telecommunications followed next owing to increasing demand from data centers along with enterprise applications across different industry verticals such as healthcare and industrial automation systems. Solutions offered by WLP include multi-layer interposer between PCB layers or substrates which helps enhance signal quality while reducing electromagnetic interference (EMI).
Regional Analysis:
Asia Pacific region dominated the global market in 2017 and is expected to continue its dominance over the forecast period. The growth of this region can be attributed to increasing demand for electronic products, particularly smartphones and tablets, in countries such as China and India. Moreover, rising investments by various governments for developing advanced semiconductor technologies are anticipated to fuel industry growth over the next eight years.
The Asia Pacific regional market was followed by Europe that accounted for a share of more than 20% in 2017 owing to high demand from several major end-use industries across Germany, France, Italy, U.K., Russia among other Eastern European countries have been experiencing steady economic growth which has led them into adopting advanced technology products including semiconductors at their homes or workplaces thereby fueling industry expansion over the forecast period.
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Proliferation of 3D IC technology
- Growing trend of system-in-package (SiP) and heterogeneous integration
- Rising demand for advanced packaging technologies in automotive and aerospace industries
- Emergence of new applications such as 5G, Internet of Things (IoT), and artificial intelligence
Scope Of The Report
Report Attributes
Report Details
Report Title
Wafer Level Packaging Market Research Report
By Type
3D TSV WLP, 2.5D TSV WLP, WLCSP, Nano WLP, Others ( 2D TSV WLP and Compliant WLP)
By Application
Electronics, IT & Telecommunication, Industrial, Automotive, Aerospace & Defense, Healthcare, Others (Media & Entertainment and Non-Conventional Energy Resources)
By Companies
Amkor Technology Inc, Fujitsu Ltd, Jiangsu Changjiang Electronics, Deca Technologies, Qualcomm Inc, Toshiba Corp, Tokyo Electron Ltd, Applied Materials, Inc, ASML Holding NV, Lam Research Corp, Amkor Technology Inc, China Wafer Level CSP Co. Ltd, Marvell Technology Group Ltd, Siliconware Precision Industries, Nanium SA, STATS Chip, PAC Ltd
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
199
Number of Tables & Figures
140
Customization Available
Yes, the report can be customized as per your need.
Global Wafer Level Packaging Market Report Segments:
The global Wafer Level Packaging market is segmented on the basis of:
Types
3D TSV WLP, 2.5D TSV WLP, WLCSP, Nano WLP, Others ( 2D TSV WLP and Compliant WLP)
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Electronics, IT & Telecommunication, Industrial, Automotive, Aerospace & Defense, Healthcare, Others (Media & Entertainment and Non-Conventional Energy Resources)
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Amkor Technology Inc
- Fujitsu Ltd
- Jiangsu Changjiang Electronics
- Deca Technologies
- Qualcomm Inc
- Toshiba Corp
- Tokyo Electron Ltd
- Applied Materials, Inc
- ASML Holding NV
- Lam Research Corp
- Amkor Technology Inc
- China Wafer Level CSP Co. Ltd
- Marvell Technology Group Ltd
- Siliconware Precision Industries
- Nanium SA
- STATS Chip
- PAC Ltd
Highlights of The Wafer Level Packaging Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- 3D TSV WLP
- 2.5D TSV WLP
- WLCSP
- Nano WLP
- Others ( 2D TSV WLP and Compliant WLP)
- By Application:
- Electronics
- IT & Telecommunication
- Industrial
- Automotive
- Aerospace & Defense
- Healthcare
- Others (Media & Entertainment and Non-Conventional Energy Resources)
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Wafer Level Packaging Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Wafer level packaging is a type of electronic packaging in which semiconductor wafers are packaged on a single substrate. This type of packaging allows for more efficient use of space and reduces the number of parts that need to be assembled.
Some of the major players in the wafer level packaging market are Amkor Technology Inc, Fujitsu Ltd, Jiangsu Changjiang Electronics, Deca Technologies, Qualcomm Inc, Toshiba Corp, Tokyo Electron Ltd, Applied Materials, Inc, ASML Holding NV, Lam Research Corp, Amkor Technology Inc, China Wafer Level CSP Co. Ltd, Marvell Technology Group Ltd, Siliconware Precision Industries, Nanium SA, STATS Chip, PAC Ltd.
The wafer level packaging market is expected to grow at a compound annual growth rate of 9.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Wafer Level Packaging Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Wafer Level Packaging Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Wafer Level Packaging Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Wafer Level Packaging Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Wafer Level Packaging Market Size & Forecast, 2020-2028
4.5.1 Wafer Level Packaging Market Size and Y-o-Y Growth
4.5.2 Wafer Level Packaging Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 3D TSV WLP
5.2.2 2.5D TSV WLP
5.2.3 WLCSP
5.2.4 Nano WLP
5.2.5 Others ( 2D TSV WLP and Compliant WLP)
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Electronics
6.2.2 IT & Telecommunication
6.2.3 Industrial
6.2.4 Automotive
6.2.5 Aerospace & Defense
6.2.6 Healthcare
6.2.7 Others (Media & Entertainment and Non-Conventional Energy Resources)
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Wafer Level Packaging Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Wafer Level Packaging Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 3D TSV WLP
9.6.2 2.5D TSV WLP
9.6.3 WLCSP
9.6.4 Nano WLP
9.6.5 Others ( 2D TSV WLP and Compliant WLP)
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Electronics
9.10.2 IT & Telecommunication
9.10.3 Industrial
9.10.4 Automotive
9.10.5 Aerospace & Defense
9.10.6 Healthcare
9.10.7 Others (Media & Entertainment and Non-Conventional Energy Resources)
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 3D TSV WLP
10.6.2 2.5D TSV WLP
10.6.3 WLCSP
10.6.4 Nano WLP
10.6.5 Others ( 2D TSV WLP and Compliant WLP)
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Electronics
10.10.2 IT & Telecommunication
10.10.3 Industrial
10.10.4 Automotive
10.10.5 Aerospace & Defense
10.10.6 Healthcare
10.10.7 Others (Media & Entertainment and Non-Conventional Energy Resources)
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 3D TSV WLP
11.6.2 2.5D TSV WLP
11.6.3 WLCSP
11.6.4 Nano WLP
11.6.5 Others ( 2D TSV WLP and Compliant WLP)
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Electronics
11.10.2 IT & Telecommunication
11.10.3 Industrial
11.10.4 Automotive
11.10.5 Aerospace & Defense
11.10.6 Healthcare
11.10.7 Others (Media & Entertainment and Non-Conventional Energy Resources)
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 3D TSV WLP
12.6.2 2.5D TSV WLP
12.6.3 WLCSP
12.6.4 Nano WLP
12.6.5 Others ( 2D TSV WLP and Compliant WLP)
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Electronics
12.10.2 IT & Telecommunication
12.10.3 Industrial
12.10.4 Automotive
12.10.5 Aerospace & Defense
12.10.6 Healthcare
12.10.7 Others (Media & Entertainment and Non-Conventional Energy Resources)
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 3D TSV WLP
13.6.2 2.5D TSV WLP
13.6.3 WLCSP
13.6.4 Nano WLP
13.6.5 Others ( 2D TSV WLP and Compliant WLP)
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Electronics
13.10.2 IT & Telecommunication
13.10.3 Industrial
13.10.4 Automotive
13.10.5 Aerospace & Defense
13.10.6 Healthcare
13.10.7 Others (Media & Entertainment and Non-Conventional Energy Resources)
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Wafer Level Packaging Market: Competitive Dashboard
14.2 Global Wafer Level Packaging Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Amkor Technology Inc
14.3.2 Fujitsu Ltd
14.3.3 Jiangsu Changjiang Electronics
14.3.4 Deca Technologies
14.3.5 Qualcomm Inc
14.3.6 Toshiba Corp
14.3.7 Tokyo Electron Ltd
14.3.8 Applied Materials, Inc
14.3.9 ASML Holding NV
14.3.10 Lam Research Corp
14.3.11 Amkor Technology Inc
14.3.12 China Wafer Level CSP Co. Ltd
14.3.13 Marvell Technology Group Ltd
14.3.14 Siliconware Precision Industries
14.3.15 Nanium SA
14.3.16 STATS Chip
14.3.17 PAC Ltd
