Latest Update: Impact of current COVID-19 situation has been considered in this report while making the analysis.
Global Wafer & Packaged Device ATE Market by Type (Wafer ATE, Packaged Device ATE), By Application (Automotive Electronics, Consumer Electronics, Communications, Computer, Industrial/Medical, Military/Aviation) and Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast From 2022 To 2030-report

Global Wafer & Packaged Device ATE Market by Type (Wafer ATE, Packaged Device ATE), By Application (Automotive Electronics, Consumer Electronics, Communications, Computer, Industrial/Medical, Military/Aviation) and Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast From 2022 To 2030

Report ID: 372131 4200 Machinery & Equipment 377 175 Pages 4.6 (32)
                                          

Market Overview:


The global wafer and packaged device ATE market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for semiconductor devices in automotive, consumer electronics, communication, computer, industrial/medical and military/aviation applications. Additionally, the growing trend of miniaturization is also contributing to the growth of this market.


Global Wafer & Packaged Device ATE Industry Outlook


Product Definition:


Wafers are made by depositing a layer of semiconductor material over a substrate and then patterning that layer into the desired shape. Integrated circuits are manufactured by etching away unwanted portions of the wafer to create the desired circuit patterns. MEMS devices are fabricated by bonding together individual micromachined structures that have been etched from different parts of a single wafer.


Packaged devices are those integrated circuits that have been assembled into finished products such as computer chips, cell phone processors, and memory modules. Packaged device ATE is test equipment specifically designed to test these finished products. The importance of packaged device ATE lies in its ability to verify the performance and functionality of these complex electronic assemblies under real-world conditions.


Wafer ATE:


Wafer ATE is a type of advanced technology equipment used to handle wafers during the manufacturing process. It offers several benefits such as reduced time, increased yield and throughput, improved quality & reliability in production. The major driver for this market is the growing demand for integrated circuits (IC) from various end-use industries such as consumer electronics & appliances, automotive industry etc.


Packaged Device ATE:


Packaged device ATE (PDA TE) is a technology that enables the manufacturing of integrated circuits (ICs) on an assembly line. It offers several benefits such as reduced capital costs, increased process efficiency, and low inventory levels which in turn helps to lower the product cost. The technology also allows for higher yields and faster time to market with better quality products.


Application Insights:


The application segment is segregated into seven sub-segments, namely automotive electronics, consumer electronics, communications, computer & IT/ semiconductor industry applications, industrial/medical and military aviation. In 2017 the automotive electronics segment accounted for over 40% of the revenue share. The growth can be attributed to increasing demand for packaged devices in automobiles across all regions coupled with growing usage of microcontrollers in various automobile systems such as HVAC (heating ventilation and cooling), electronic stability control and engine control units.


The consumer electronics segment is expected to witness significant growth over the forecast period owing to rapid product adoption in smartwatches along with other wearable technologies such as fitness bands and smart glasses that are increasingly being adopted by a large global customer base. Rising demand for advanced technology products from a wide range of end-use industries including healthcare & medical equipment are also expected to boost overall market growth during the forecast period.


Regional Analysis:


Asia Pacific region is expected to emerge as the fastest-growing regional market over the forecast period. The growth can be attributed to increasing demand for packaged devices from various end-use industries, such as consumer electronics and computer. Increasing disposable income levels in emerging economies of Asia Pacific, such as China and India are also expected to drive the global market during the forecast period.


The European region accounted for a significant share of revenue in 2017 owing to early adoption of advanced technologies by leading manufacturers coupled with high spending capabilities of consumers on quality products made using latest technology. However, slow economic growth in Europe may hinder industry expansion over next few years which will result into lesser number or closure of facilities operating within this region thereby affecting overall industry growth rate negatively in near future.


Latin America is anticipated to witness steady growth due its rapid industrialization along with growing investments by multinational players looking for cost effective labor force.


Growth Factors:


  • Increasing demand for semiconductor devices from consumer electronics and telecommunications sectors
  • Proliferation of 3D IC technology and wafer-level packaging (WLP)
  • Growing popularity of advanced packaging technologies such as 2.5D/3D integration, fan-out wafer-level packaging (FOWLP), and through silicon vias (TSVs)
  • Rising number of fabless companies and IDMs outsourcing their ATE requirements to contract manufacturers
  • Emergence of new market segments such as automotive, medical, industrial, and aerospace & defense

Scope Of The Report

Report Attributes

Report Details

Report Title

Wafer & Packaged Device ATE Market Research Report

By Type

Wafer ATE, Packaged Device ATE

By Application

Automotive Electronics, Consumer Electronics, Communications, Computer, Industrial/Medical, Military/Aviation

By Companies

Teradyne, Advantest (including Astronics), LTX-Credence, Cohu, Chroma, SPEA, Averna, Shibasoku, ChangChuan, Macrotest, Huafeng

Regions Covered

North America, Europe, APAC, Latin America, MEA

Base Year

2021

Historical Year

2019 to 2020 (Data from 2010 can be provided as per availability)

Forecast Year

2030

Number of Pages

175

Number of Tables & Figures

123

Customization Available

Yes, the report can be customized as per your need.


Global Wafer & Packaged Device ATE Market Report Segments:

The global Wafer & Packaged Device ATE market is segmented on the basis of:

Types

Wafer ATE, Packaged Device ATE

The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.

Applications

Automotive Electronics, Consumer Electronics, Communications, Computer, Industrial/Medical, Military/Aviation

The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.

Some of the companies that are profiled in this report are:

  1. Teradyne
  2. Advantest (including Astronics)
  3. LTX-Credence
  4. Cohu
  5. Chroma
  6. SPEA
  7. Averna
  8. Shibasoku
  9. ChangChuan
  10. Macrotest
  11. Huafeng

Global Wafer & Packaged Device ATE Market Overview


Highlights of The Wafer & Packaged Device ATE Market Report:

  1. The market structure and projections for the coming years.
  2. Drivers, restraints, opportunities, and current trends of market.
  3. Historical data and forecast.
  4. Estimations for the forecast period 2030.
  5. Developments and trends in the market.
  6. By Type:

    1. Wafer ATE
    2. Packaged Device ATE
  1. By Application:

    1. Automotive Electronics
    2. Consumer Electronics
    3. Communications
    4. Computer
    5. Industrial/Medical
    6. Military/Aviation
  1. Market scenario by region, sub-region, and country.
  2. Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
  3. Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
  4. Government Policies, Macro & Micro economic factors are also included in the report.

We have studied the Wafer & Packaged Device ATE Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.

Regional Analysis

  • North America
  • Europe
  • Asia Pacific
  • Middle East & Africa
  • Latin America

Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.

The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.

How you may use our products:

  • Correctly Positioning New Products
  • Market Entry Strategies
  • Business Expansion Strategies
  • Consumer Insights
  • Understanding Competition Scenario
  • Product & Brand Management
  • Channel & Customer Management
  • Identifying Appropriate Advertising Appeals

Global Wafer & Packaged Device ATE Market Statistics

8 Reasons to Buy This Report

  1. Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
  2. Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
  3. Implemented Robust Methodology to Prepare the Report
  4. Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
  5. Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
  6. Provides Information About the Top-winning Strategies Implemented by Industry Players.
  7. In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
  8. Customization of the Report Available

Frequently Asked Questions?


Wafer & Packaged Device ATE (W&P-ATE) is a technology that helps to improve the yield and reliability of semiconductor devices. W&P-ATE can help reduce the number of defective devices by identifying and correcting problems early in the manufacturing process.

Some of the key players operating in the wafer & packaged device ate market are Teradyne, Advantest (including Astronics), LTX-Credence, Cohu, Chroma, SPEA, Averna, Shibasoku, ChangChuan, Macrotest, Huafeng.

The wafer & packaged device ate market is expected to register a CAGR of 6.5%.

                                            
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Wafer & Packaged Device ATE Market Overview    4.1 Introduction       4.1.1 Market Taxonomy       4.1.2 Market Definition       4.1.3 Macro-Economic Factors Impacting the Market Growth    4.2 Wafer & Packaged Device ATE Market Dynamics       4.2.1 Market Drivers       4.2.2 Market Restraints       4.2.3 Market Opportunity    4.3 Wafer & Packaged Device ATE Market - Supply Chain Analysis       4.3.1 List of Key Suppliers       4.3.2 List of Key Distributors       4.3.3 List of Key Consumers    4.4 Key Forces Shaping the Wafer & Packaged Device ATE Market       4.4.1 Bargaining Power of Suppliers       4.4.2 Bargaining Power of Buyers       4.4.3 Threat of Substitution       4.4.4 Threat of New Entrants       4.4.5 Competitive Rivalry    4.5 Global Wafer & Packaged Device ATE Market Size & Forecast, 2020-2028       4.5.1 Wafer & Packaged Device ATE Market Size and Y-o-Y Growth       4.5.2 Wafer & Packaged Device ATE Market Absolute $ Opportunity

Chapter 5 Global  Market Analysis and Forecast by Type
   5.1 Introduction
      5.1.1 Key Market Trends & Growth Opportunities by Type
      5.1.2 Basis Point Share (BPS) Analysis by Type
      5.1.3 Absolute $ Opportunity Assessment by Type
   5.2  Market Size Forecast by Type
      5.2.1 Wafer ATE
      5.2.2 Packaged Device ATE
   5.3 Market Attractiveness Analysis by Type

Chapter 6 Global  Market Analysis and Forecast by Applications
   6.1 Introduction
      6.1.1 Key Market Trends & Growth Opportunities by Applications
      6.1.2 Basis Point Share (BPS) Analysis by Applications
      6.1.3 Absolute $ Opportunity Assessment by Applications
   6.2  Market Size Forecast by Applications
      6.2.1 Automotive Electronics
      6.2.2 Consumer Electronics
      6.2.3 Communications
      6.2.4 Computer
      6.2.5 Industrial/Medical
      6.2.6 Military/Aviation
   6.3 Market Attractiveness Analysis by Applications

Chapter 7 Global Wafer & Packaged Device ATE Market Analysis and Forecast by Region
   7.1 Introduction
      7.1.1 Key Market Trends & Growth Opportunities by Region
      7.1.2 Basis Point Share (BPS) Analysis by Region
      7.1.3 Absolute $ Opportunity Assessment by Region
   7.2 Wafer & Packaged Device ATE Market Size Forecast by Region
      7.2.1 North America
      7.2.2 Europe
      7.2.3 Asia Pacific
      7.2.4 Latin America
      7.2.5 Middle East & Africa (MEA)
   7.3 Market Attractiveness Analysis by Region

Chapter 8 Coronavirus Disease (COVID-19) Impact 
   8.1 Introduction 
   8.2 Current & Future Impact Analysis 
   8.3 Economic Impact Analysis 
   8.4 Government Policies 
   8.5 Investment Scenario

Chapter 9 North America  Analysis and Forecast
   9.1 Introduction
   9.2 North America  Market Size Forecast by Country
      9.2.1 U.S.
      9.2.2 Canada
   9.3 Basis Point Share (BPS) Analysis by Country
   9.4 Absolute $ Opportunity Assessment by Country
   9.5 Market Attractiveness Analysis by Country
   9.6 North America  Market Size Forecast by Type
      9.6.1 Wafer ATE
      9.6.2 Packaged Device ATE
   9.7 Basis Point Share (BPS) Analysis by Type 
   9.8 Absolute $ Opportunity Assessment by Type 
   9.9 Market Attractiveness Analysis by Type
   9.10 North America  Market Size Forecast by Applications
      9.10.1 Automotive Electronics
      9.10.2 Consumer Electronics
      9.10.3 Communications
      9.10.4 Computer
      9.10.5 Industrial/Medical
      9.10.6 Military/Aviation
   9.11 Basis Point Share (BPS) Analysis by Applications 
   9.12 Absolute $ Opportunity Assessment by Applications 
   9.13 Market Attractiveness Analysis by Applications

Chapter 10 Europe  Analysis and Forecast
   10.1 Introduction
   10.2 Europe  Market Size Forecast by Country
      10.2.1 Germany
      10.2.2 France
      10.2.3 Italy
      10.2.4 U.K.
      10.2.5 Spain
      10.2.6 Russia
      10.2.7 Rest of Europe
   10.3 Basis Point Share (BPS) Analysis by Country
   10.4 Absolute $ Opportunity Assessment by Country
   10.5 Market Attractiveness Analysis by Country
   10.6 Europe  Market Size Forecast by Type
      10.6.1 Wafer ATE
      10.6.2 Packaged Device ATE
   10.7 Basis Point Share (BPS) Analysis by Type 
   10.8 Absolute $ Opportunity Assessment by Type 
   10.9 Market Attractiveness Analysis by Type
   10.10 Europe  Market Size Forecast by Applications
      10.10.1 Automotive Electronics
      10.10.2 Consumer Electronics
      10.10.3 Communications
      10.10.4 Computer
      10.10.5 Industrial/Medical
      10.10.6 Military/Aviation
   10.11 Basis Point Share (BPS) Analysis by Applications 
   10.12 Absolute $ Opportunity Assessment by Applications 
   10.13 Market Attractiveness Analysis by Applications

Chapter 11 Asia Pacific  Analysis and Forecast
   11.1 Introduction
   11.2 Asia Pacific  Market Size Forecast by Country
      11.2.1 China
      11.2.2 Japan
      11.2.3 South Korea
      11.2.4 India
      11.2.5 Australia
      11.2.6 South East Asia (SEA)
      11.2.7 Rest of Asia Pacific (APAC)
   11.3 Basis Point Share (BPS) Analysis by Country
   11.4 Absolute $ Opportunity Assessment by Country
   11.5 Market Attractiveness Analysis by Country
   11.6 Asia Pacific  Market Size Forecast by Type
      11.6.1 Wafer ATE
      11.6.2 Packaged Device ATE
   11.7 Basis Point Share (BPS) Analysis by Type 
   11.8 Absolute $ Opportunity Assessment by Type 
   11.9 Market Attractiveness Analysis by Type
   11.10 Asia Pacific  Market Size Forecast by Applications
      11.10.1 Automotive Electronics
      11.10.2 Consumer Electronics
      11.10.3 Communications
      11.10.4 Computer
      11.10.5 Industrial/Medical
      11.10.6 Military/Aviation
   11.11 Basis Point Share (BPS) Analysis by Applications 
   11.12 Absolute $ Opportunity Assessment by Applications 
   11.13 Market Attractiveness Analysis by Applications

Chapter 12 Latin America  Analysis and Forecast
   12.1 Introduction
   12.2 Latin America  Market Size Forecast by Country
      12.2.1 Brazil
      12.2.2 Mexico
      12.2.3 Rest of Latin America (LATAM)
   12.3 Basis Point Share (BPS) Analysis by Country
   12.4 Absolute $ Opportunity Assessment by Country
   12.5 Market Attractiveness Analysis by Country
   12.6 Latin America  Market Size Forecast by Type
      12.6.1 Wafer ATE
      12.6.2 Packaged Device ATE
   12.7 Basis Point Share (BPS) Analysis by Type 
   12.8 Absolute $ Opportunity Assessment by Type 
   12.9 Market Attractiveness Analysis by Type
   12.10 Latin America  Market Size Forecast by Applications
      12.10.1 Automotive Electronics
      12.10.2 Consumer Electronics
      12.10.3 Communications
      12.10.4 Computer
      12.10.5 Industrial/Medical
      12.10.6 Military/Aviation
   12.11 Basis Point Share (BPS) Analysis by Applications 
   12.12 Absolute $ Opportunity Assessment by Applications 
   12.13 Market Attractiveness Analysis by Applications

Chapter 13 Middle East & Africa (MEA)  Analysis and Forecast
   13.1 Introduction
   13.2 Middle East & Africa (MEA)  Market Size Forecast by Country
      13.2.1 Saudi Arabia
      13.2.2 South Africa
      13.2.3 UAE
      13.2.4 Rest of Middle East & Africa (MEA)
   13.3 Basis Point Share (BPS) Analysis by Country
   13.4 Absolute $ Opportunity Assessment by Country
   13.5 Market Attractiveness Analysis by Country
   13.6 Middle East & Africa (MEA)  Market Size Forecast by Type
      13.6.1 Wafer ATE
      13.6.2 Packaged Device ATE
   13.7 Basis Point Share (BPS) Analysis by Type 
   13.8 Absolute $ Opportunity Assessment by Type 
   13.9 Market Attractiveness Analysis by Type
   13.10 Middle East & Africa (MEA)  Market Size Forecast by Applications
      13.10.1 Automotive Electronics
      13.10.2 Consumer Electronics
      13.10.3 Communications
      13.10.4 Computer
      13.10.5 Industrial/Medical
      13.10.6 Military/Aviation
   13.11 Basis Point Share (BPS) Analysis by Applications 
   13.12 Absolute $ Opportunity Assessment by Applications 
   13.13 Market Attractiveness Analysis by Applications

Chapter 14 Competition Landscape 
   14.1 Wafer & Packaged Device ATE Market: Competitive Dashboard
   14.2 Global Wafer & Packaged Device ATE Market: Market Share Analysis, 2019
   14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy) 
      14.3.1 Teradyne
      14.3.2 Advantest (including Astronics)
      14.3.3 LTX-Credence
      14.3.4 Cohu
      14.3.5 Chroma
      14.3.6 SPEA
      14.3.7 Averna
      14.3.8 Shibasoku
      14.3.9 ChangChuan
      14.3.10 Macrotest
      14.3.11 Huafeng

Our Trusted Clients

Contact Us