Market Overview:
The global wafer packaging inspection system market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for advanced semiconductor devices and rising demand for miniaturization of electronic devices. In addition, the growing trend of automation across various industries is also contributing to the growth of this market. Based on type, the global wafer packaging inspection system market can be segmented into optical based and infrared type systems. The optical based systems are further classified into visible light spectrum and ultraviolet (UV) spectrums. Of these, UV-based systems are expected to witness higher growth during the forecast period owing to their ability detect defects that are not visible under normal lighting conditions.
Product Definition:
A wafer packaging inspection system is a type of machine used to inspect the quality of semiconductor wafers. These machines are important because they help to ensure that the wafers being produced are of high quality and meet all necessary specifications.
Optical Based:
Optical-based wafer packaging inspection systems are used for monitoring the surface of packaged semiconductor wafers. These systems provide high resolution and contrast ratio images, which enable managers to make decisions regarding the quality of manufactured products. Optical-based inspection system has a number of advantages over traditional methods such as X-ray based or Electron Beam Melting (EBM) based inspection system in terms of size, cost and time consumed for performing an analysis on large volume production floor.
Infrared Type:
The global infrared type and it's usage in wafer packaging inspection system market size was valued at USD 6.5 million in 2016. The growing demand for advanced packaging technologies such as wafer handling systems is expected to drive the growth of this market during the forecast period.
Infrared (IR) based wafer inspection systems are used for non-destructive examination of packaged semiconductor devices, which helps detect defects such as oxidation, contamination.
Application Insights:
The global wafer packaging inspection system market is segmented by application into consumer electronics, automotive electronics, industrial, healthcare and other applications. The consumer electronics segment accounted for the largest market share in 2017 owing to increasing demand for smartphones and wearable devices across the globe. Automotive electronic products are highly dependent on semiconductor components which are packed in various layers of an integrated circuit (IC). Hence a defect inspection system can help detect and prevent such defects at source which will ultimately lead to higher product quality.
Industrial application is expected to witness significant growth over the forecast period due to rising demand from end-use industries including oil & gas, energy storage & power generation among others. Growing need for automation in order detection of surface mount device (SMD) defects has led manufacturers towards developing robust solutions that can efficiently handle large volumes with high accuracy levels over recent years.
Regional Analysis:
Asia Pacific region dominated the global market in 2017 and is expected to continue its dominance over the forecast period. The growth of this region can be attributed to increasing foreign investments in China, Taiwan, South Korea, Japan and India. In addition, rising disposable income coupled with growing demand for electronic products such as smartphones and laptops is anticipated to drive the regional market growth during the forecast period.
The Latin American regional market accounted for a significant share owing to increasing manufacturing activities across various end-use industries such as automotive electronics & lighting (AE&L), consumer electronics & appliances (CE&A), healthcare & medical devices (HMD) among others. Rising demand for packaged wafers from major semiconductor manufacturers located in countries including Brazil, Argentina and Chile is also expected favorably impact overall industry growth over the next eight years.
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Rising demand from the semiconductor industry
- Growing popularity of 3D integrated circuits (ICs)
- Proliferation of advanced packaging technologies
- Emergence of new applications
Scope Of The Report
Report Attributes
Report Details
Report Title
Wafer Packaging Inspection System Market Research Report
By Type
Optical Based, Infrared Type
By Application
Consumer Electronics, Automotive Electronics, Industrial, Healthcare, Others
By Companies
KLA-Tencor, Onto Innovation, Advanced Technology Inc., Cohu, Camtek, CyberOptics, Applied Materials, Hitachi, RSIC scientific instrument, Shanghai Precision Measurement Semiconductor Technology, Skyverse
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
129
Number of Tables & Figures
91
Customization Available
Yes, the report can be customized as per your need.
Global Wafer Packaging Inspection System Market Report Segments:
The global Wafer Packaging Inspection System market is segmented on the basis of:
Types
Optical Based, Infrared Type
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Consumer Electronics, Automotive Electronics, Industrial, Healthcare, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- KLA-Tencor
- Onto Innovation
- Advanced Technology Inc.
- Cohu
- Camtek
- CyberOptics
- Applied Materials
- Hitachi
- RSIC scientific instrument
- Shanghai Precision Measurement Semiconductor Technology
- Skyverse
Highlights of The Wafer Packaging Inspection System Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Optical Based
- Infrared Type
- By Application:
- Consumer Electronics
- Automotive Electronics
- Industrial
- Healthcare
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Wafer Packaging Inspection System Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
A Wafer Packaging Inspection System (WPIS) is a type of inspection system used to inspect semiconductor wafers for defects. WPIS systems are typically composed of a number of optical and scanning probe tools that can be used to detect defects on the surface of the wafers.
Some of the major players in the wafer packaging inspection system market are KLA-Tencor, Onto Innovation, Advanced Technology Inc., Cohu, Camtek, Cyber​​Optics, Applied Materials, Hitachi, RSIC scientific instrument, Shanghai Precision Measurement Semiconductor Technology, Skyverse.
The wafer packaging inspection system market is expected to grow at a compound annual growth rate of 6.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Wafer Packaging Inspection System Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Wafer Packaging Inspection System Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Wafer Packaging Inspection System Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Wafer Packaging Inspection System Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Wafer Packaging Inspection System Market Size & Forecast, 2020-2028
4.5.1 Wafer Packaging Inspection System Market Size and Y-o-Y Growth
4.5.2 Wafer Packaging Inspection System Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Optical Based
5.2.2 Infrared Type
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Consumer Electronics
6.2.2 Automotive Electronics
6.2.3 Industrial
6.2.4 Healthcare
6.2.5 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Wafer Packaging Inspection System Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Wafer Packaging Inspection System Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Optical Based
9.6.2 Infrared Type
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Consumer Electronics
9.10.2 Automotive Electronics
9.10.3 Industrial
9.10.4 Healthcare
9.10.5 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Optical Based
10.6.2 Infrared Type
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Consumer Electronics
10.10.2 Automotive Electronics
10.10.3 Industrial
10.10.4 Healthcare
10.10.5 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Optical Based
11.6.2 Infrared Type
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Consumer Electronics
11.10.2 Automotive Electronics
11.10.3 Industrial
11.10.4 Healthcare
11.10.5 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Optical Based
12.6.2 Infrared Type
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Consumer Electronics
12.10.2 Automotive Electronics
12.10.3 Industrial
12.10.4 Healthcare
12.10.5 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Optical Based
13.6.2 Infrared Type
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Consumer Electronics
13.10.2 Automotive Electronics
13.10.3 Industrial
13.10.4 Healthcare
13.10.5 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Wafer Packaging Inspection System Market: Competitive Dashboard
14.2 Global Wafer Packaging Inspection System Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 KLA-Tencor
14.3.2 Onto Innovation
14.3.3 Advanced Technology Inc.
14.3.4 Cohu
14.3.5 Camtek
14.3.6 CyberOptics
14.3.7 Applied Materials
14.3.8 Hitachi
14.3.9 RSIC scientific instrument
14.3.10 Shanghai Precision Measurement Semiconductor Technology
14.3.11 Skyverse
