Market Overview:
The global wafer packaging material market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The market growth can be attributed to the increasing demand for semiconductor devices and rising trend of miniaturization in electronics products. In addition, the growing adoption of advanced packaging technologies is also propelling the growth of this market. Based on type, the global wafer packaging material market can be segmented into lead frame, package substrate, ceramic packaging materials, bonding wire, and die attach materials. The lead frame segment is expected to account for a major share of this market in 2018 owing to its high usage in semiconductor packages. By application, IDM (integrated device manufacturers) and OSAT (outsourced semiconductor assembly and test companies) are two key segments that are anticipated to drive demand for wafer packaging materials during the forecast period. North America accounted for a leading share of this market in 2017 due to technological advancements and presence of major players such as Intel Corporation (U.S.) and Taiwan Semiconductor Manufacturing Company Ltd.(Taiwan).
Product Definition:
A wafer is a thin slice of semiconductor material, such as silicon, used in the manufacture of integrated circuits and solar cells.
Lead Frame:
Lead frame is a major raw material used in the manufacturing of wafer packaging materials. It has high demand as it is used for providing electrical connectivity to circuit boards and also provides mechanical stability to the packaged device. The growth factor for lead frame is approximately 2 over the past years, which can be attributed to growing demand from electronic devices industry owing to its superior properties such as high thermal conductivity & heat resistance along with low weight & small size.
Package Substrate:
Substrate is a material that is used for the fabrication of integrated circuits (IC). The substrate can be made of various materials such as glass, silicon wafers, and non-wafer materials. A single IC may have more than one sub-assembly or package. In case of multi IC packaging there are different types of substrates available depending upon the type or class of the packaged product.
Application Insights:
IDM application segment led the global wafer packaging material market in 2017 and is projected to expand at a CAGR of XX% over the forecast period. Growing demand for semiconductors from various industries, such as telecommunication & IT, consumer electronics, medical equipment and appliances, automotive and transportation is anticipated to propel industry growth over the coming years.
The growing popularity of smart cities project across several countries in Latin America is expected to positively impact industry growth over the next few years. In addition, favorable government policies related to research & development activities are anticipated to augment product demand in this region soon.
OSAT companies are increasingly using ceramic substrates for manufacturing their products as they offer better thermal management capabilities along with enhanced aesthetic appeal than other materials used till date for OSATs production purposes (such as metal or plastic).
Regional Analysis:
Asia Pacific region dominated the global market in 2017 and is expected to continue its dominance over the forecast period. The growth of this region can be attributed to rising demand for electronic products, particularly smartphones and computer chips. China is a major consumer of these materials in this region owing to cheap labor costs as well as government subsidies on chip manufacturing equipment.
The Asia Pacific regional market was followed by Europe, which accounted for over 28% of the total revenue share in 2017 owing to growing demand from smartphone manufacturers such as Samsung Electronics Co., Ltd., Foxconn Technology Group, and Mediamarkt Digital Media & Marketing GmbH & Co KG. In addition, increasing military expenditure by governments across countries including Russia has led them requiring more advanced electronics products that are manufactured using die attach materials such as wire bonding wires or ceramic packaging material with high reliability standards; hence driving the overall industry growth across this region during the forecast period.
Growth Factors:
- Increasing demand for semiconductor devices: The global semiconductor market is expected to grow at a CAGR of 6.5% from 2016 to 2020, reaching a value of USD 333.8 billion by 2020. This is primarily attributed to the increasing demand for semiconductor devices in consumer electronics, automotive, and industrial sectors.
- Rising demand for miniaturized and high-performance electronic devices: With the growing trend of miniaturization and performance enhancement in electronic devices, there is an increased demand for advanced wafer packaging materials that can provide better performance and smaller form factors.
- Proliferation of 3D IC technology: 3D IC technology offers several advantages over traditional 2D ICs such as improved performance, higher packing density, reduced power consumption, and enhanced thermal management capabilities. This is driving its adoption among leading chipmakers worldwide which is consequently fueling the growth of the wafer packaging material market .
- , reaching a valueof USD 48 billion by 2020 This presents lucrative opportunitiesfor wafer packagingmaterial manufacturers as this segment requires advanced materials that offer superior performanceand small form factor benefits .
Scope Of The Report
Report Attributes
Report Details
Report Title
Wafer Packaging Material Market Research Report
By Type
Lead Frame, Package Substrate, Ceramic Packaging Materials, Bonding Wire, Packaging Materials, Die Attach Materials
By Application
IDM (Integrated Device Manufacturers), OSAT (Outsourced Semiconductor Assembly and Test Companies)
By Companies
Shin-Etsu Chemical, Sumitomo Chemical, Kyocera Chemical, Hitachi Chemical, Henkel, Dow Corning, DuPont, Alent
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
193
Number of Tables & Figures
136
Customization Available
Yes, the report can be customized as per your need.
Global Wafer Packaging Material Market Report Segments:
The global Wafer Packaging Material market is segmented on the basis of:
Types
Lead Frame, Package Substrate, Ceramic Packaging Materials, Bonding Wire, Packaging Materials, Die Attach Materials
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
IDM (Integrated Device Manufacturers), OSAT (Outsourced Semiconductor Assembly and Test Companies)
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Shin-Etsu Chemical
- Sumitomo Chemical
- Kyocera Chemical
- Hitachi Chemical
- Henkel
- Dow Corning
- DuPont
- Alent
Highlights of The Wafer Packaging Material Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Lead Frame
- Package Substrate
- Ceramic Packaging Materials
- Bonding Wire
- Packaging Materials
- Die Attach Materials
- By Application:
- IDM (Integrated Device Manufacturers)
- OSAT (Outsourced Semiconductor Assembly and Test Companies)
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Wafer Packaging Material Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
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- Consumer Insights
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- Product & Brand Management
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Wafer packaging material is a thin, protective sheet that is placed over the top of a wafer to protect it during shipping and storage.
Some of the major players in the wafer packaging material market are Shin-Etsu Chemical, Sumitomo Chemical, Kyocera Chemical, Hitachi Chemical, Henkel, Dow Corning, DuPont, Alent.
The wafer packaging material market is expected to grow at a compound annual growth rate of 6.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Wafer Packaging Material Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Wafer Packaging Material Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Wafer Packaging Material Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Wafer Packaging Material Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Wafer Packaging Material Market Size & Forecast, 2020-2028
4.5.1 Wafer Packaging Material Market Size and Y-o-Y Growth
4.5.2 Wafer Packaging Material Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Lead Frame
5.2.2 Package Substrate
5.2.3 Ceramic Packaging Materials
5.2.4 Bonding Wire
5.2.5 Packaging Materials
5.2.6 Die Attach Materials
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 IDM (Integrated Device Manufacturers)
6.2.2 OSAT (Outsourced Semiconductor Assembly and Test Companies)
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Wafer Packaging Material Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Wafer Packaging Material Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Lead Frame
9.6.2 Package Substrate
9.6.3 Ceramic Packaging Materials
9.6.4 Bonding Wire
9.6.5 Packaging Materials
9.6.6 Die Attach Materials
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 IDM (Integrated Device Manufacturers)
9.10.2 OSAT (Outsourced Semiconductor Assembly and Test Companies)
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Lead Frame
10.6.2 Package Substrate
10.6.3 Ceramic Packaging Materials
10.6.4 Bonding Wire
10.6.5 Packaging Materials
10.6.6 Die Attach Materials
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 IDM (Integrated Device Manufacturers)
10.10.2 OSAT (Outsourced Semiconductor Assembly and Test Companies)
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Lead Frame
11.6.2 Package Substrate
11.6.3 Ceramic Packaging Materials
11.6.4 Bonding Wire
11.6.5 Packaging Materials
11.6.6 Die Attach Materials
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 IDM (Integrated Device Manufacturers)
11.10.2 OSAT (Outsourced Semiconductor Assembly and Test Companies)
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Lead Frame
12.6.2 Package Substrate
12.6.3 Ceramic Packaging Materials
12.6.4 Bonding Wire
12.6.5 Packaging Materials
12.6.6 Die Attach Materials
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 IDM (Integrated Device Manufacturers)
12.10.2 OSAT (Outsourced Semiconductor Assembly and Test Companies)
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Lead Frame
13.6.2 Package Substrate
13.6.3 Ceramic Packaging Materials
13.6.4 Bonding Wire
13.6.5 Packaging Materials
13.6.6 Die Attach Materials
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 IDM (Integrated Device Manufacturers)
13.10.2 OSAT (Outsourced Semiconductor Assembly and Test Companies)
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Wafer Packaging Material Market: Competitive Dashboard
14.2 Global Wafer Packaging Material Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Shin-Etsu Chemical
14.3.2 Sumitomo Chemical
14.3.3 Kyocera Chemical
14.3.4 Hitachi Chemical
14.3.5 Henkel
14.3.6 Dow Corning
14.3.7 DuPont
14.3.8 Alent
