Market Overview:
The global wafer polishing plate market is expected to grow at a CAGR of 5.5% from 2018 to 2030. The growth in the market can be attributed to the increasing demand for semiconductor devices and rising investments in the semiconductor industry. In terms of type, the alumina wafer polishing plate segment is expected to dominate the market during the forecast period. This can be attributed to its properties such as high wear resistance and low coefficient of friction. In terms of application, the wafer polishing segment is expected to account for a major share of the global market duringthe forecast period.
Product Definition:
A wafer polishing plate is a flat, circular piece of metal or plastic that is used to polish semiconductor wafers. The polishing plate helps to remove defects and smooth out the surface of the wafer.
Alumina Wafer Polishing Plate:
Alumina Wafer Polishing Plate, also called Aluminum Wafer or Aluminum Foam is a type of polishing plate used in the semiconductor industry for wafers during the manufacturing process. The primary function of alumina is to provide an abrasive surface on which polishing compounds can be applied. It has applications in both semi-synthetic and natural wafers depending upon its composition and structure.
Silicon Carbide Wafer Polishing Plate:
Silicon carbide (SiC) wafer polishing plate is used in the semiconductor industry to smooth and finish the surface of silicon carbide wafers.
Application Insights:
The global wafer polishing plate market by application is segmented into Wafer Polishing, Chemical Mechanical Planarization (CMP) process and others. In 2017, the CMP process held the largest share in terms of revenue as well as volume. The growth can be attributed to growing demand for microelectronics from various sectors such as consumer electronics, telecommunication and IT industries. Moreover, increasing investments in R&D for developing advanced semiconductor products with higher performance is expected to drive the segment over the forecast period.
Wafer polishing is used for planarizing surface finish irregularities (if any), removal of residual chemicals on a wafer surface after deposition or annealing/growing operation, reduction of scratches & defects caused during exposure to high vacuum or oxygen environment during device packaging or unpackaging operations etc.
Regional Analysis:
Asia Pacific dominated the global market in 2017 and is expected to continue its dominance over the forecast period. The growth of this region can be attributed to increasing demand for semiconductor devices, particularly in China and India. In addition, rising investments by foreign players such as Umicore in Taiwan for manufacturing wafers on a large scale are anticipated to drive the regional market further.
The Latin American regional market is also estimated to witness significant growth over the coming years owing to rapid development of microelectronics and nanoelectronics across countries such as Brazil, Mexico, Argentina etc. Moreover, growing use of advanced technologies such as 3D-stacked ICs will drive product demand further. Rising awareness regarding environment-friendly polishing processes will also augment industry size over the next eight years or so.
Europe was estimated at USD X million in 2017.
Growth Factors:
- Increasing demand for semiconductor devices: The global semiconductor market is expected to grow at a CAGR of 6.5% from 2016 to 2020. This is due to the increasing demand for miniaturized and more powerful electronic devices such as smartphones, tablets, and laptops. Semiconductors are used in these devices to control and manage their operations.
- Growing popularity of 3D printing: 3D printing is a process of creating three-dimensional objects from a digital model using additive processes. It has gained popularity in recent years due to its ability to produce customized products quickly and cheaply. The use of wafer polishing plates in 3D printing helps improve the accuracy and quality of the final product.
Scope Of The Report
Report Attributes
Report Details
Report Title
Wafer Polishing Plate Market Research Report
By Type
Alumina Wafer Polishing Plate, Silicon Carbide Wafer Polishing Plate
By Application
Wafer Polishing, CMP process
By Companies
Kyocera, CoorsTek, Johncera, XMCERA, Chemshun Ceramics, Farcera
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
204
Number of Tables & Figures
143
Customization Available
Yes, the report can be customized as per your need.
Global Wafer Polishing Plate Market Report Segments:
The global Wafer Polishing Plate market is segmented on the basis of:
Types
Alumina Wafer Polishing Plate, Silicon Carbide Wafer Polishing Plate
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Wafer Polishing, CMP process
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Kyocera
- CoorsTek
- Johncera
- XMCERA
- Chemshun Ceramics
- Farcera
Highlights of The Wafer Polishing Plate Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Alumina Wafer Polishing Plate
- Silicon Carbide Wafer Polishing Plate
- By Application:
- Wafer Polishing
- CMP process
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Wafer Polishing Plate Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
A Wafer Polishing Plate is a type of polishing plate used to remove scratches, blemishes and other imperfections from wafers.
Some of the major players in the wafer polishing plate market are Kyocera, CoorsTek, Johncera, XMCERA, Chemshun Ceramics, Farcera.
The wafer polishing plate market is expected to register a CAGR of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Wafer Polishing Plate Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Wafer Polishing Plate Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Wafer Polishing Plate Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Wafer Polishing Plate Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Wafer Polishing Plate Market Size & Forecast, 2018-2028
4.5.1 Wafer Polishing Plate Market Size and Y-o-Y Growth
4.5.2 Wafer Polishing Plate Market Absolute $ Opportunity
Chapter 5 Global Wafer Polishing Plate Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Wafer Polishing Plate Market Size Forecast by Type
5.2.1 Alumina Wafer Polishing Plate
5.2.2 Silicon Carbide Wafer Polishing Plate
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Wafer Polishing Plate Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Wafer Polishing Plate Market Size Forecast by Applications
6.2.1 Wafer Polishing
6.2.2 CMP process
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Wafer Polishing Plate Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Wafer Polishing Plate Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Wafer Polishing Plate Analysis and Forecast
9.1 Introduction
9.2 North America Wafer Polishing Plate Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Wafer Polishing Plate Market Size Forecast by Type
9.6.1 Alumina Wafer Polishing Plate
9.6.2 Silicon Carbide Wafer Polishing Plate
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Wafer Polishing Plate Market Size Forecast by Applications
9.10.1 Wafer Polishing
9.10.2 CMP process
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Wafer Polishing Plate Analysis and Forecast
10.1 Introduction
10.2 Europe Wafer Polishing Plate Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Wafer Polishing Plate Market Size Forecast by Type
10.6.1 Alumina Wafer Polishing Plate
10.6.2 Silicon Carbide Wafer Polishing Plate
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Wafer Polishing Plate Market Size Forecast by Applications
10.10.1 Wafer Polishing
10.10.2 CMP process
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Wafer Polishing Plate Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Wafer Polishing Plate Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Wafer Polishing Plate Market Size Forecast by Type
11.6.1 Alumina Wafer Polishing Plate
11.6.2 Silicon Carbide Wafer Polishing Plate
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Wafer Polishing Plate Market Size Forecast by Applications
11.10.1 Wafer Polishing
11.10.2 CMP process
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Wafer Polishing Plate Analysis and Forecast
12.1 Introduction
12.2 Latin America Wafer Polishing Plate Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Wafer Polishing Plate Market Size Forecast by Type
12.6.1 Alumina Wafer Polishing Plate
12.6.2 Silicon Carbide Wafer Polishing Plate
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Wafer Polishing Plate Market Size Forecast by Applications
12.10.1 Wafer Polishing
12.10.2 CMP process
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Wafer Polishing Plate Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Wafer Polishing Plate Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Wafer Polishing Plate Market Size Forecast by Type
13.6.1 Alumina Wafer Polishing Plate
13.6.2 Silicon Carbide Wafer Polishing Plate
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Wafer Polishing Plate Market Size Forecast by Applications
13.10.1 Wafer Polishing
13.10.2 CMP process
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Wafer Polishing Plate Market: Competitive Dashboard
14.2 Global Wafer Polishing Plate Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Kyocera
14.3.2 CoorsTek
14.3.3 Johncera
14.3.4 XMCERA
14.3.5 Chemshun Ceramics
14.3.6 Farcera
