Latest Update: Impact of current COVID-19 situation has been considered in this report while making the analysis.
Global Wafer Pre Aligner Market by Type (Mechanical Type, Optical Type), By Application (100 mm Wafer, 150 mm Wafer, 200 mm Wafer, 300 mm Wafer, Other) and Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast From 2022 To 2030-report

Global Wafer Pre Aligner Market by Type (Mechanical Type, Optical Type), By Application (100 mm Wafer, 150 mm Wafer, 200 mm Wafer, 300 mm Wafer, Other) and Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast From 2022 To 2030

Report ID: 455986 4200 Machinery & Equipment 377 205 Pages 4.7 (39)
                                          

Market Overview:


The global wafer pre aligner market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for semiconductor devices and rising investments in the semiconductor industry. The market is segmented on the basis of type, application, and region. On the basis of type, it is divided into mechanical type and optical type. By application, it is classified into 100 mm wafer, 150 mm wafer, 200 mm Wafer 300mm Wafers and other applications. Geographically, it is analyzed across North America (U.S., Canada), Latin America (Mexico), Europe (Germany France Italy Spain U K Rest Of Europe), Asia Pacific (China Japan South Korea Taiwan India ASEAN Rest Of APAC) and Middle East & Africa(GCC Countries Israel Turkey Nigeria South Africa Rest Of MEA). Some of the key players operating in this market are ASML Holding NV (Netherlands), Nikon Corporation Ltd.(Japan), Canon Inc.(Japan) Hitachi Ltd.(Japan) Toshiba Corporation(Japan) Applied Materials Inc.(U S.), Lam Research Corporation(U S.), Tokyo Electron Limited(Tokyo Electron Limited)( Japan).


Global Wafer Pre Aligner Industry Outlook


Product Definition:


Wafer pre aligner is an important tool for the fabrication of semiconductor devices. It is used to accurately position and align wafers prior to their attachment to the process equipment. This ensures that the devices are fabricated correctly and with minimal defects.


Mechanical Type:


The mechanical type is used to align wafers in semiconductor industry. It’s major application includes foundry, solar, and LED industries. The growth factor for this market is high demand from the foundry industry as it helps in achieving higher precision during casting process.


Optical Type:


Optical type is a tool that helps in analyzing wafer pre-alignment. It works by detecting misalignment of wafers on a semiconductor chip and provides an output which can be used to re-align the wafers during manufacturing processes. Optical types are widely used in foundry, packaging, and electronics industries for various applications such as optical inspection systems, automated machine vision systems, 3D camera calibration system among others.


Application Insights:


The 300 mm wafer pre-aligner market is expected to witness significant growth over the forecast period. The growth can be attributed to increasing adoption of 300 mm wafers in various applications such as smartphones, wearable devices, and self-driving cars. In addition, technological advancements in 200 and 100 mm Wafer are also likely to propel demand for 200mm & 100mm Wafer Pre Aligner respectively.


The other segment includes semiconductor equipment used for processing silicon or sapphire substrates that do not require a precision alignment with the circuit patterns on the substrate surface. Growing usage of these products on sapphire substrates is anticipated to drive their demand over the forecast period since they offer high accuracy along with low cost compared to mechanical type alignment toolsets used for glass substrates.   -Precision Microsystems Group Inc., 2014  -.


Regional Analysis:


North America dominated the global market in 2017 owing to the presence of major players and increased adoption of advanced technologies. The region is expected to maintain its dominance over the forecast period due to increasing demand for integrated circuits. Asia Pacific is projected to be a lucrative regional market from 2018 to 2030 due primarily semiconductor manufacturing companies setting up their production facilities in this region, along with favorable government policies supporting electronics manufacturing industry growth. Moreover, rising investments by key players are anticipated to fuel product demand over the next eight years. For instance, In January 2016, UHJ Semiconductor invested USD X million for establishing a new facility in Taiwan Province aimed at developing advanced 3D-stacked ICs technology that will lead towards cost reduction and enhanced performance products suitable for high volume production.


The European wafer pre-aligner market was valued at USD X billion in 2017.


Growth Factors:


  • Increasing demand for semiconductor devices: The global semiconductor market is expected to grow at a CAGR of 6.5% from 2016 to 2020, reaching a value of USD 333.8 billion by 2020. This growth can be attributed to the increasing demand for semiconductor devices across various applications such as consumer electronics, automotive, industrial and medical sectors.
  • Rising demand for miniaturization and higher performance: With the growing trend of miniaturization in electronic devices, there is an increased demand for smaller and faster chipsets that offer higher performance levels. This is driving the need for advanced wafer pre aligners that can provide better accuracy and alignment precision in order to meet these requirements.
  • Growing number of fabless companies: A fabless company refers to a company that outsources the manufacturing of its products to contract manufacturers (CM). There has been a significant increase in the number of fabless companies over the past few years due to advancements in technology and lower costs associated with outsourcing production overseas (especially in China). This is resulting in increased demand for wafer pre aligners from these companies as they look to improve their production efficiency and reduce manufacturing costs .

Scope Of The Report

Report Attributes

Report Details

Report Title

Wafer Pre Aligner Market Research Report

By Type

Mechanical Type, Optical Type

By Application

100 mm Wafer, 150 mm Wafer, 200 mm Wafer, 300 mm Wafer, Other

By Companies

Universal Semiconductor Technology, Kensington, Genmark Automation, Milara Inc., mechatronic systemtechnik, TEX E. G. CO., Brooks Automation, TAZMO, Hangzhou SIASUN Robot & Automation

Regions Covered

North America, Europe, APAC, Latin America, MEA

Base Year

2021

Historical Year

2019 to 2020 (Data from 2010 can be provided as per availability)

Forecast Year

2030

Number of Pages

205

Number of Tables & Figures

144

Customization Available

Yes, the report can be customized as per your need.


Global Wafer Pre Aligner Market Report Segments:

The global Wafer Pre Aligner market is segmented on the basis of:

Types

Mechanical Type, Optical Type

The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.

Applications

100 mm Wafer, 150 mm Wafer, 200 mm Wafer, 300 mm Wafer, Other

The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.

Some of the companies that are profiled in this report are:

  1. Universal Semiconductor Technology
  2. Kensington
  3. Genmark Automation
  4. Milara Inc.
  5. mechatronic systemtechnik
  6. TEX E. G. CO.
  7. Brooks Automation
  8. TAZMO
  9. Hangzhou SIASUN Robot & Automation

Global Wafer Pre Aligner Market Overview


Highlights of The Wafer Pre Aligner Market Report:

  1. The market structure and projections for the coming years.
  2. Drivers, restraints, opportunities, and current trends of market.
  3. Historical data and forecast.
  4. Estimations for the forecast period 2030.
  5. Developments and trends in the market.
  6. By Type:

    1. Mechanical Type
    2. Optical Type
  1. By Application:

    1. 100 mm Wafer
    2. 150 mm Wafer
    3. 200 mm Wafer
    4. 300 mm Wafer
    5. Other
  1. Market scenario by region, sub-region, and country.
  2. Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
  3. Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
  4. Government Policies, Macro & Micro economic factors are also included in the report.

We have studied the Wafer Pre Aligner Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.

Regional Analysis

  • North America
  • Europe
  • Asia Pacific
  • Middle East & Africa
  • Latin America

Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.

The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.

How you may use our products:

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Global Wafer Pre Aligner Market Statistics

8 Reasons to Buy This Report

  1. Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
  2. Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
  3. Implemented Robust Methodology to Prepare the Report
  4. Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
  5. Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
  6. Provides Information About the Top-winning Strategies Implemented by Industry Players.
  7. In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
  8. Customization of the Report Available

Frequently Asked Questions?


A Wafer Pre Aligner is a tool that helps to align wafers during the manufacturing process. It uses lasers and sensors to ensure that the wafers are properly placed on the printing plates, which can help to improve print quality.

Some of the major companies in the wafer pre aligner market are Universal Semiconductor Technology, Kensington, Genmark Automation, Milara Inc., mechatronic systemtechnik, TEX E. G. CO., Brooks Automation, TAZMO, Hangzhou SIASUN Robot & Automation.

The wafer pre aligner market is expected to grow at a compound annual growth rate of 5.5%.

                                            
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Wafer Pre Aligner Market Overview    4.1 Introduction       4.1.1 Market Taxonomy       4.1.2 Market Definition       4.1.3 Macro-Economic Factors Impacting the Market Growth    4.2 Wafer Pre Aligner Market Dynamics       4.2.1 Market Drivers       4.2.2 Market Restraints       4.2.3 Market Opportunity    4.3 Wafer Pre Aligner Market - Supply Chain Analysis       4.3.1 List of Key Suppliers       4.3.2 List of Key Distributors       4.3.3 List of Key Consumers    4.4 Key Forces Shaping the Wafer Pre Aligner Market       4.4.1 Bargaining Power of Suppliers       4.4.2 Bargaining Power of Buyers       4.4.3 Threat of Substitution       4.4.4 Threat of New Entrants       4.4.5 Competitive Rivalry    4.5 Global Wafer Pre Aligner Market Size & Forecast, 2020-2028       4.5.1 Wafer Pre Aligner Market Size and Y-o-Y Growth       4.5.2 Wafer Pre Aligner Market Absolute $ Opportunity

Chapter 5 Global  Market Analysis and Forecast by Type
   5.1 Introduction
      5.1.1 Key Market Trends & Growth Opportunities by Type
      5.1.2 Basis Point Share (BPS) Analysis by Type
      5.1.3 Absolute $ Opportunity Assessment by Type
   5.2  Market Size Forecast by Type
      5.2.1 Mechanical Type
      5.2.2 Optical Type
   5.3 Market Attractiveness Analysis by Type

Chapter 6 Global  Market Analysis and Forecast by Applications
   6.1 Introduction
      6.1.1 Key Market Trends & Growth Opportunities by Applications
      6.1.2 Basis Point Share (BPS) Analysis by Applications
      6.1.3 Absolute $ Opportunity Assessment by Applications
   6.2  Market Size Forecast by Applications
      6.2.1 100 mm Wafer
      6.2.2 150 mm Wafer
      6.2.3 200 mm Wafer
      6.2.4 300 mm Wafer
      6.2.5 Other
   6.3 Market Attractiveness Analysis by Applications

Chapter 7 Global Wafer Pre Aligner Market Analysis and Forecast by Region
   7.1 Introduction
      7.1.1 Key Market Trends & Growth Opportunities by Region
      7.1.2 Basis Point Share (BPS) Analysis by Region
      7.1.3 Absolute $ Opportunity Assessment by Region
   7.2 Wafer Pre Aligner Market Size Forecast by Region
      7.2.1 North America
      7.2.2 Europe
      7.2.3 Asia Pacific
      7.2.4 Latin America
      7.2.5 Middle East & Africa (MEA)
   7.3 Market Attractiveness Analysis by Region

Chapter 8 Coronavirus Disease (COVID-19) Impact 
   8.1 Introduction 
   8.2 Current & Future Impact Analysis 
   8.3 Economic Impact Analysis 
   8.4 Government Policies 
   8.5 Investment Scenario

Chapter 9 North America  Analysis and Forecast
   9.1 Introduction
   9.2 North America  Market Size Forecast by Country
      9.2.1 U.S.
      9.2.2 Canada
   9.3 Basis Point Share (BPS) Analysis by Country
   9.4 Absolute $ Opportunity Assessment by Country
   9.5 Market Attractiveness Analysis by Country
   9.6 North America  Market Size Forecast by Type
      9.6.1 Mechanical Type
      9.6.2 Optical Type
   9.7 Basis Point Share (BPS) Analysis by Type 
   9.8 Absolute $ Opportunity Assessment by Type 
   9.9 Market Attractiveness Analysis by Type
   9.10 North America  Market Size Forecast by Applications
      9.10.1 100 mm Wafer
      9.10.2 150 mm Wafer
      9.10.3 200 mm Wafer
      9.10.4 300 mm Wafer
      9.10.5 Other
   9.11 Basis Point Share (BPS) Analysis by Applications 
   9.12 Absolute $ Opportunity Assessment by Applications 
   9.13 Market Attractiveness Analysis by Applications

Chapter 10 Europe  Analysis and Forecast
   10.1 Introduction
   10.2 Europe  Market Size Forecast by Country
      10.2.1 Germany
      10.2.2 France
      10.2.3 Italy
      10.2.4 U.K.
      10.2.5 Spain
      10.2.6 Russia
      10.2.7 Rest of Europe
   10.3 Basis Point Share (BPS) Analysis by Country
   10.4 Absolute $ Opportunity Assessment by Country
   10.5 Market Attractiveness Analysis by Country
   10.6 Europe  Market Size Forecast by Type
      10.6.1 Mechanical Type
      10.6.2 Optical Type
   10.7 Basis Point Share (BPS) Analysis by Type 
   10.8 Absolute $ Opportunity Assessment by Type 
   10.9 Market Attractiveness Analysis by Type
   10.10 Europe  Market Size Forecast by Applications
      10.10.1 100 mm Wafer
      10.10.2 150 mm Wafer
      10.10.3 200 mm Wafer
      10.10.4 300 mm Wafer
      10.10.5 Other
   10.11 Basis Point Share (BPS) Analysis by Applications 
   10.12 Absolute $ Opportunity Assessment by Applications 
   10.13 Market Attractiveness Analysis by Applications

Chapter 11 Asia Pacific  Analysis and Forecast
   11.1 Introduction
   11.2 Asia Pacific  Market Size Forecast by Country
      11.2.1 China
      11.2.2 Japan
      11.2.3 South Korea
      11.2.4 India
      11.2.5 Australia
      11.2.6 South East Asia (SEA)
      11.2.7 Rest of Asia Pacific (APAC)
   11.3 Basis Point Share (BPS) Analysis by Country
   11.4 Absolute $ Opportunity Assessment by Country
   11.5 Market Attractiveness Analysis by Country
   11.6 Asia Pacific  Market Size Forecast by Type
      11.6.1 Mechanical Type
      11.6.2 Optical Type
   11.7 Basis Point Share (BPS) Analysis by Type 
   11.8 Absolute $ Opportunity Assessment by Type 
   11.9 Market Attractiveness Analysis by Type
   11.10 Asia Pacific  Market Size Forecast by Applications
      11.10.1 100 mm Wafer
      11.10.2 150 mm Wafer
      11.10.3 200 mm Wafer
      11.10.4 300 mm Wafer
      11.10.5 Other
   11.11 Basis Point Share (BPS) Analysis by Applications 
   11.12 Absolute $ Opportunity Assessment by Applications 
   11.13 Market Attractiveness Analysis by Applications

Chapter 12 Latin America  Analysis and Forecast
   12.1 Introduction
   12.2 Latin America  Market Size Forecast by Country
      12.2.1 Brazil
      12.2.2 Mexico
      12.2.3 Rest of Latin America (LATAM)
   12.3 Basis Point Share (BPS) Analysis by Country
   12.4 Absolute $ Opportunity Assessment by Country
   12.5 Market Attractiveness Analysis by Country
   12.6 Latin America  Market Size Forecast by Type
      12.6.1 Mechanical Type
      12.6.2 Optical Type
   12.7 Basis Point Share (BPS) Analysis by Type 
   12.8 Absolute $ Opportunity Assessment by Type 
   12.9 Market Attractiveness Analysis by Type
   12.10 Latin America  Market Size Forecast by Applications
      12.10.1 100 mm Wafer
      12.10.2 150 mm Wafer
      12.10.3 200 mm Wafer
      12.10.4 300 mm Wafer
      12.10.5 Other
   12.11 Basis Point Share (BPS) Analysis by Applications 
   12.12 Absolute $ Opportunity Assessment by Applications 
   12.13 Market Attractiveness Analysis by Applications

Chapter 13 Middle East & Africa (MEA)  Analysis and Forecast
   13.1 Introduction
   13.2 Middle East & Africa (MEA)  Market Size Forecast by Country
      13.2.1 Saudi Arabia
      13.2.2 South Africa
      13.2.3 UAE
      13.2.4 Rest of Middle East & Africa (MEA)
   13.3 Basis Point Share (BPS) Analysis by Country
   13.4 Absolute $ Opportunity Assessment by Country
   13.5 Market Attractiveness Analysis by Country
   13.6 Middle East & Africa (MEA)  Market Size Forecast by Type
      13.6.1 Mechanical Type
      13.6.2 Optical Type
   13.7 Basis Point Share (BPS) Analysis by Type 
   13.8 Absolute $ Opportunity Assessment by Type 
   13.9 Market Attractiveness Analysis by Type
   13.10 Middle East & Africa (MEA)  Market Size Forecast by Applications
      13.10.1 100 mm Wafer
      13.10.2 150 mm Wafer
      13.10.3 200 mm Wafer
      13.10.4 300 mm Wafer
      13.10.5 Other
   13.11 Basis Point Share (BPS) Analysis by Applications 
   13.12 Absolute $ Opportunity Assessment by Applications 
   13.13 Market Attractiveness Analysis by Applications

Chapter 14 Competition Landscape 
   14.1 Wafer Pre Aligner Market: Competitive Dashboard
   14.2 Global Wafer Pre Aligner Market: Market Share Analysis, 2019
   14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy) 
      14.3.1 Universal Semiconductor Technology
      14.3.2 Kensington
      14.3.3 Genmark Automation
      14.3.4 Milara Inc.
      14.3.5 mechatronic systemtechnik
      14.3.6 TEX E. G. CO.
      14.3.7 Brooks Automation
      14.3.8 TAZMO
      14.3.9 Hangzhou SIASUN Robot & Automation

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