Market Overview:
The global wafer ring market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth in the market can be attributed to the increasing demand for semiconductor devices and rising demand for advanced packaging solutions. In terms of type, the dicing wafer ring segment is expected to hold a major share of the market during the forecast period. This can be attributed to its growing use in semiconductor device manufacturing.
Product Definition:
A wafer ring is a thin, round disk of semiconductor material that is used in electronic devices. They are typically made of silicon, but can also be made of other materials like germanium or silicon-germanium. Wafer rings are used in transistors, diodes, and integrated circuits.
Dicing Wafer Ring:
Dicing wafer ring is a thin, circular metal alloy with high electrical resistance. It is used in integrated circuits (IC) manufacturing to create numerous small pieces from a large wafer of semiconductor material. Dicing wafers are done by using special tools and techniques which break the solid piece into uniform slices of approximately 1 mm thickness. These slices are then collected on the surface of a rotating drum where they are recombined together to form an entire circuit layer.
UV Film Wafer Ring:
UV film wafer ring is a device that is used in the semiconductor industry to seal and protect the sensitive wafers from any kind of damage. The product also finds its usage in packaging applications such as display modules, LED drivers, memory chips, etc. It helps in protecting these devices from environmental stress such as temperature and pressure.
Application Insights:
Wafer bonding film application segment is projected to witness significant growth over the forecast period. This can be attributed to increasing demand for integrated circuits and semiconductors in various end-use industries such as consumer electronics, telecommunication and IT, automotive and transportation systems. Rising demand for high-tech products coupled with rapid urbanization is expected to drive the global wafer ring market in this region over the forecast period.
Fixed wafer application segment accounted for a revenue share of more than 40% in 2017 owing to its wide applications across several industry verticals including microelectronics, optoelectronics, clean room technology manufacturing facilities as well as semiconductor foundry operations. The product features an advanced design that eliminates parallax error while providing enhanced sharpness of focus at infinity distance resulting into higher image quality when compared with traditional optics system designs used by camera manufacturers.
Regional Analysis:
Asia Pacific region dominated the global market in 2017 and is expected to continue its dominance over the forecast period. The growth of this region can be attributed to increasing demand for semiconductor devices, particularly in China and India. In addition, rising investments by foreign players such as Umicore in Taiwan Semiconductor Manufacturing Company (TSMC) are anticipated to boost production capacity of chips across Asia Pacific thereby driving the demand for wafer rings over the forecast period.
The Latin American regional market is also estimated to witness significant growth over the coming years owing to increasing manufacturing activities across various end-use industries such as healthcare, automotive etc., which require large volumes of semiconductors on a regular basis.
Growth Factors:
- Increasing demand for semiconductor devices in consumer electronics and telecommunications sectors
- Rising number of wafer fabrication plants across the globe
- Growing trend of miniaturization in electronic devices
- Proliferation of 3D integrated circuits (ICs) and System-on-Chip (SoC) designs
- Emergence of new applications such as Internet-of-Things (IoT), data centers, and automotive
Scope Of The Report
Report Attributes
Report Details
Report Title
Wafer Ring Market Research Report
By Type
Dicing Wafer Ring, UV Film Wafer Ring, Fixed Wafer Ring, Stick Wafer Ring
By Application
Wafer Bonding Film, Fixed Wafer, Others
By Companies
Dou Yee, YJ Stainless, Shin-Etsu Polymer, DISCO, Long-Tech Precision Machinery, Chung King Enterprise, Shenzhen Dong Hong Xin Industrial
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
222
Number of Tables & Figures
156
Customization Available
Yes, the report can be customized as per your need.
Global Wafer Ring Market Report Segments:
The global Wafer Ring market is segmented on the basis of:
Types
Dicing Wafer Ring, UV Film Wafer Ring, Fixed Wafer Ring, Stick Wafer Ring
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Wafer Bonding Film, Fixed Wafer, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Dou Yee
- YJ Stainless
- Shin-Etsu Polymer
- DISCO
- Long-Tech Precision Machinery
- Chung King Enterprise
- Shenzhen Dong Hong Xin Industrial
Highlights of The Wafer Ring Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Dicing Wafer Ring
- UV Film Wafer Ring
- Fixed Wafer Ring
- Stick Wafer Ring
- By Application:
- Wafer Bonding Film
- Fixed Wafer
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Wafer Ring Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
A Wafer Ring is a type of semiconductor device that can be used to store data. It is made up of a number of thin, circular wafers that are stacked together. The wafers are connected by metal wires, and the whole thing is enclosed in an electronic package.
Some of the key players operating in the wafer ring market are Dou Yee, YJ Stainless, Shin-Etsu Polymer, DISCO, Long-Tech Precision Machinery, Chung King Enterprise, Shenzhen Dong Hong Xin Industrial.
The wafer ring market is expected to register a CAGR of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Wafer Ring Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Wafer Ring Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Wafer Ring Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Wafer Ring Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Wafer Ring Market Size & Forecast, 2020-2028
4.5.1 Wafer Ring Market Size and Y-o-Y Growth
4.5.2 Wafer Ring Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Dicing Wafer Ring
5.2.2 UV Film Wafer Ring
5.2.3 Fixed Wafer Ring
5.2.4 Stick Wafer Ring
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Wafer Bonding Film
6.2.2 Fixed Wafer
6.2.3 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Wafer Ring Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Wafer Ring Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Dicing Wafer Ring
9.6.2 UV Film Wafer Ring
9.6.3 Fixed Wafer Ring
9.6.4 Stick Wafer Ring
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Wafer Bonding Film
9.10.2 Fixed Wafer
9.10.3 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Dicing Wafer Ring
10.6.2 UV Film Wafer Ring
10.6.3 Fixed Wafer Ring
10.6.4 Stick Wafer Ring
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Wafer Bonding Film
10.10.2 Fixed Wafer
10.10.3 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Dicing Wafer Ring
11.6.2 UV Film Wafer Ring
11.6.3 Fixed Wafer Ring
11.6.4 Stick Wafer Ring
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Wafer Bonding Film
11.10.2 Fixed Wafer
11.10.3 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Dicing Wafer Ring
12.6.2 UV Film Wafer Ring
12.6.3 Fixed Wafer Ring
12.6.4 Stick Wafer Ring
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Wafer Bonding Film
12.10.2 Fixed Wafer
12.10.3 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Dicing Wafer Ring
13.6.2 UV Film Wafer Ring
13.6.3 Fixed Wafer Ring
13.6.4 Stick Wafer Ring
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Wafer Bonding Film
13.10.2 Fixed Wafer
13.10.3 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Wafer Ring Market: Competitive Dashboard
14.2 Global Wafer Ring Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Dou Yee
14.3.2 YJ Stainless
14.3.3 Shin-Etsu Polymer
14.3.4 DISCO
14.3.5 Long-Tech Precision Machinery
14.3.6 Chung King Enterprise
14.3.7 Shenzhen Dong Hong Xin Industrial
