Market Overview:
The global wafer saw machines market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for semiconductor and solar products, and the growing trend of miniaturization in electronic devices. In terms of type, the laser dicing machines segment is expected to grow at a higher CAGR than the blades dicing machine segment during the forecast period. This can be attributed to factors such as technological advancements in laser technology and its ability to provide high accuracy and precision results. In terms of application, the solar segment is expected to grow at a higher CAGR than other segments during the forecast period.
Product Definition:
A wafer saw machine is a device used to cut semiconductor wafers into thin slices. The importance of wafer saw machines is that they allow for the precise and even cutting of semiconductor materials, which is necessary for the production of electronic components.
Laser Dicing Machines:
Laser dicing machines are used for cutting wafers into pieces of desired size and shape. The laser beam is used for cutting the material by vaporization of material at a high speed. Dicing machines are widely used in foundries, electronic equipment manufacturing, glass fabrication, and tooling industries.
Blades Dicing Machine:
Blades dicing machine is used in wafer saw machines for cutting of chips from a block of material. It's an advanced version of the traditional wafer saw which uses a high speed steel blade to cut the blocks into pieces. The blades are mounted on a shaft which can be spun by an electric motor or driven by another mechanical device like chain drives or belts.
Application Insights:
The global wafer saw machines market has been segmented on the basis of application into solar, semiconductor and others. The solar sector dominated the overall industry in terms of revenue in 2017 owing to rising demand for clean energy coupled with an increase in installations across utility-scale projects.
Semiconductor emerged as the second-largest segment and is expected to witness significant growth over the forecast period due to a rise in demand for integrated circuits from various end-use industries such as telecommunication, computing and electronics. Moreover, technological advancements coupled with high product adoption are anticipated to drive growth over the coming years.
Regional Analysis:
Asia Pacific region dominated the global market in 2017 and is expected to continue its dominance over the forecast period. The growth of this region can be attributed to increasing demand for electronic products such as smartphones and laptops, which has led to a rise in manufacturing activities across various sectors including consumer electronics, automotive, computing & laptops. This trend is projected to drive the demand for wafer saw machines over the forecast period.
The Latin American regional market also held a significant share owing to growing investments by key players in countries such as Brazil and Mexico that are major producers of semiconductors along with other electronic devices. In addition, rising awareness regarding energy conservation coupled with stringent environmental regulations by regulatory bodies such as RoW Association (Rio Organization of Wafer-based Industries) are anticipated to further boost industry growth across this region during the forecast period.
Growth Factors:
- Increasing demand for semiconductor devices in consumer electronics and telecommunications sectors
- Rising number of wafer fabrication plants across the globe
- Proliferation of nanotechnology and MEMS (micro-electromechanical systems) applications
- Growing popularity of 3D integrated circuits (ICs)
- Advent of new materials such as graphene and silicon carbide
Scope Of The Report
Report Attributes
Report Details
Report Title
Wafer Saw Machines Market Research Report
By Type
Laser Dicing Machines, Blades Dicing Machine
By Application
Solar, Semiconductor, Others
By Companies
Accretech, DISCO Corporation, Advanced Dicing Technology, Loadpoint, Dynatex International, 3D-Micromac AG, Shenzhen tensun industrial equipment, Beijing Dianke Electronic Equipment, HEYAN TECHNOLOGY, SUNIC SOLAR, HGLASER
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
241
Number of Tables & Figures
169
Customization Available
Yes, the report can be customized as per your need.
Global Wafer Saw Machines Market Report Segments:
The global Wafer Saw Machines market is segmented on the basis of:
Types
Laser Dicing Machines, Blades Dicing Machine
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Solar, Semiconductor, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Accretech
- DISCO Corporation
- Advanced Dicing Technology
- Loadpoint
- Dynatex International
- 3D-Micromac AG
- Shenzhen tensun industrial equipment
- Beijing Dianke Electronic Equipment
- HEYAN TECHNOLOGY
- SUNIC SOLAR
- HGLASER
Highlights of The Wafer Saw Machines Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Laser Dicing Machines
- Blades Dicing Machine
- By Application:
- Solar
- Semiconductor
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Wafer Saw Machines Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Wafer saw machines are used to cut thin sheets of material by using a very sharp blade that moves across the surface of the workpiece.
Some of the major players in the wafer saw machines market are Accretech, DISCO Corporation, Advanced Dicing Technology, Loadpoint, Dynatex International, 3D-Micromac AG, Shenzhen tensun industrial equipment, Beijing Dianke Electronic Equipment, HEYAN TECHNOLOGY, SUNIC SOLAR, HGLASER.
The wafer saw machines market is expected to register a CAGR of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Wafer Saw Machines Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Wafer Saw Machines Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Wafer Saw Machines Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Wafer Saw Machines Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Wafer Saw Machines Market Size & Forecast, 2018-2028
4.5.1 Wafer Saw Machines Market Size and Y-o-Y Growth
4.5.2 Wafer Saw Machines Market Absolute $ Opportunity
Chapter 5 Global Wafer Saw Machines Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Wafer Saw Machines Market Size Forecast by Type
5.2.1 Laser Dicing Machines
5.2.2 Blades Dicing Machine
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Wafer Saw Machines Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Wafer Saw Machines Market Size Forecast by Applications
6.2.1 Solar
6.2.2 Semiconductor
6.2.3 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Wafer Saw Machines Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Wafer Saw Machines Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Wafer Saw Machines Analysis and Forecast
9.1 Introduction
9.2 North America Wafer Saw Machines Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Wafer Saw Machines Market Size Forecast by Type
9.6.1 Laser Dicing Machines
9.6.2 Blades Dicing Machine
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Wafer Saw Machines Market Size Forecast by Applications
9.10.1 Solar
9.10.2 Semiconductor
9.10.3 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Wafer Saw Machines Analysis and Forecast
10.1 Introduction
10.2 Europe Wafer Saw Machines Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Wafer Saw Machines Market Size Forecast by Type
10.6.1 Laser Dicing Machines
10.6.2 Blades Dicing Machine
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Wafer Saw Machines Market Size Forecast by Applications
10.10.1 Solar
10.10.2 Semiconductor
10.10.3 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Wafer Saw Machines Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Wafer Saw Machines Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Wafer Saw Machines Market Size Forecast by Type
11.6.1 Laser Dicing Machines
11.6.2 Blades Dicing Machine
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Wafer Saw Machines Market Size Forecast by Applications
11.10.1 Solar
11.10.2 Semiconductor
11.10.3 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Wafer Saw Machines Analysis and Forecast
12.1 Introduction
12.2 Latin America Wafer Saw Machines Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Wafer Saw Machines Market Size Forecast by Type
12.6.1 Laser Dicing Machines
12.6.2 Blades Dicing Machine
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Wafer Saw Machines Market Size Forecast by Applications
12.10.1 Solar
12.10.2 Semiconductor
12.10.3 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Wafer Saw Machines Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Wafer Saw Machines Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Wafer Saw Machines Market Size Forecast by Type
13.6.1 Laser Dicing Machines
13.6.2 Blades Dicing Machine
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Wafer Saw Machines Market Size Forecast by Applications
13.10.1 Solar
13.10.2 Semiconductor
13.10.3 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Wafer Saw Machines Market: Competitive Dashboard
14.2 Global Wafer Saw Machines Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Accretech
14.3.2 DISCO Corporation
14.3.3 Advanced Dicing Technology
14.3.4 Loadpoint
14.3.5 Dynatex International
14.3.6 3D-Micromac AG
14.3.7 Shenzhen tensun industrial equipment
14.3.8 Beijing Dianke Electronic Equipment
14.3.9 HEYAN TECHNOLOGY
14.3.10 SUNIC SOLAR
14.3.11 HGLASER
