Market Overview:
The global wafer scribing machine market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for semiconductor and solar energy products. Additionally, the growing demand for miniaturized and high-performance electronic devices is also contributing to the growth of this market.
Product Definition:
A wafer scribing machine is a device used to cut or score semiconductor wafers. This is done in order to separate the individual wafers from the parent substrate. The importance of a wafer scribing machine lies in its ability to produce clean and accurate cuts, which are necessary for subsequent processing steps.
Semi-automatic:
Semi-automatic wafer scribing machine is a tool that performs the function of drawing lines on wafers during the manufacturing process. The semi-automatic machines are used in various semiconductor industries such as MEMS, foundry, and solar among others.
The growth factor for semi-automated market is attributed to factors such as growing demand for integrated circuits (IC) from varied industry verticals along with technological advancements in fabrication processes leading to higher yield.
Full-automatic:
Full-automatic wafer scribing machine is a tool that performs all the steps of normal automatic wafer scribing process without any intervention of human. It has been designed to overcome the limitations of semi-automatic and manual wafer scribing machines. The full-automatic system can produce high quality WSM with constant edge accuracy irrespective of the number or size of wafers in a batch.
Application Insights:
The semiconductor application segment accounted for the largest share of over 40.0% in 2017 and is projected to witness significant growth over the forecast period. The growing demand for integrated circuits, primarily from electronic devices such as smartphones and computers is expected to drive the product demand in this segment.
The solar energy application segment accounted for a significant market share in terms of revenue as well as volume in 2017 owing to rising need for clean energy generation coupled with increasing government support towards renewable sources of energy generation such as solar power plants across various regions including North America, Europe, Asia Pacific and Middle East & Africa. Increasing product adoption by leading manufacturers SolarWorld AG (Wetzell), REC Silicon (Santa Clara) are some of the key factors driving industry growth across various regions globally.
Regional Analysis:
Asia Pacific region dominated the global market in 2017 and is expected to continue its dominance over the forecast period. The growth of this region can be attributed to increasing demand for electronic products such as smartphones and laptops, which has led to a rise in manufacturing activities across various sectors including automotive, aerospace & defense, consumer electronics among others. This scenario is likely to drive the demand for wafer scribing machines over the next eight years.
The Asia Pacific regional market was followed by Europe with a share of around 25% in 2017 owing to growing semiconductor industry mainly from Germany, France and Russia coupled with high investments towards research & development activities within this sector. Moreover European solar energy sector also witnessed significant growth due to rising installations of photovoltaic systems on account of growing environmental concerns regarding carbon emissions resulting into higher adoption rate for these systems which will further boost product demand over the forecast period.
Growth Factors:
- Increasing demand for semiconductor devices: The global semiconductor market is expected to grow at a CAGR of 6.5% from 2016 to 2020, reaching a value of USD 333.8 billion by 2020. This growth can be attributed to the increasing demand for semiconductor devices in consumer electronics, automotive, and industrial applications.
- Rising demand for miniaturized and high-performance electronic devices: With the growing trend of miniaturization in electronic devices, there is an increased demand for smaller and more powerful chipsets that can handle greater functionality within a limited space. This has led to an increase in the adoption of wafer scribing machines that offer high precision and accuracy while reducing manufacturing time and costs.
- Technological advancements in wafer scribing machines: Wafer scribing machine manufacturers are constantly making advancements in their products through R&D efforts, which has resulted in better performance capabilities such as higher throughputs and reduced scrap rates. This is helping fuel the growth of the market as more companies adopt these advanced machines into their production lines..
Scope Of The Report
Report Attributes
Report Details
Report Title
Wafer Scribing Machine Market Research Report
By Type
Semi-automatic, Full-automatic
By Application
Semiconductor, Solar Energy, Other
By Companies
Dynatex International, Loomis Industries, Minitron Elektronik GmbH, Tecdia, ADT, IPG Photonics, MDI, HGLaser, Genesem, Dynasoft Electronics, Dynatex International, BSET EQ, Loadpoint, Accretech, DISCO, 3D-Micromac AG
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
242
Number of Tables & Figures
170
Customization Available
Yes, the report can be customized as per your need.
Global Wafer Scribing Machine Market Report Segments:
The global Wafer Scribing Machine market is segmented on the basis of:
Types
Semi-automatic, Full-automatic
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Semiconductor, Solar Energy, Other
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Dynatex International
- Loomis Industries
- Minitron Elektronik GmbH
- Tecdia
- ADT
- IPG Photonics
- MDI
- HGLaser
- Genesem
- Dynasoft Electronics
- Dynatex International
- BSET EQ
- Loadpoint
- Accretech
- DISCO
- 3D-Micromac AG
Highlights of The Wafer Scribing Machine Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Semi-automatic
- Full-automatic
- By Application:
- Semiconductor
- Solar Energy
- Other
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Wafer Scribing Machine Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
A wafer scribing machine is a type of lithography tool used to create patterns on semiconductor wafers. The patterning is done by etching the surface of the wafer with a series of narrow, deep cuts.
Some of the key players operating in the wafer scribing machine market are Dynatex International, Loomis Industries, Minitron Elektronik GmbH, Tecdia, ADT, IPG Photonics, MDI, HGLaser, Genesem, Dynasoft Electronics, Dynatex International, BSET EQ, Loadpoint, Accretech, DISCO, 3D-Micromac AG.
The wafer scribing machine market is expected to grow at a compound annual growth rate of 6.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Wafer Scribing Machine Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Wafer Scribing Machine Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Wafer Scribing Machine Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Wafer Scribing Machine Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Wafer Scribing Machine Market Size & Forecast, 2018-2028
4.5.1 Wafer Scribing Machine Market Size and Y-o-Y Growth
4.5.2 Wafer Scribing Machine Market Absolute $ Opportunity
Chapter 5 Global Wafer Scribing Machine Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Wafer Scribing Machine Market Size Forecast by Type
5.2.1 Semi-automatic
5.2.2 Full-automatic
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Wafer Scribing Machine Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Wafer Scribing Machine Market Size Forecast by Applications
6.2.1 Semiconductor
6.2.2 Solar Energy
6.2.3 Other
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Wafer Scribing Machine Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Wafer Scribing Machine Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Wafer Scribing Machine Analysis and Forecast
9.1 Introduction
9.2 North America Wafer Scribing Machine Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Wafer Scribing Machine Market Size Forecast by Type
9.6.1 Semi-automatic
9.6.2 Full-automatic
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Wafer Scribing Machine Market Size Forecast by Applications
9.10.1 Semiconductor
9.10.2 Solar Energy
9.10.3 Other
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Wafer Scribing Machine Analysis and Forecast
10.1 Introduction
10.2 Europe Wafer Scribing Machine Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Wafer Scribing Machine Market Size Forecast by Type
10.6.1 Semi-automatic
10.6.2 Full-automatic
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Wafer Scribing Machine Market Size Forecast by Applications
10.10.1 Semiconductor
10.10.2 Solar Energy
10.10.3 Other
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Wafer Scribing Machine Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Wafer Scribing Machine Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Wafer Scribing Machine Market Size Forecast by Type
11.6.1 Semi-automatic
11.6.2 Full-automatic
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Wafer Scribing Machine Market Size Forecast by Applications
11.10.1 Semiconductor
11.10.2 Solar Energy
11.10.3 Other
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Wafer Scribing Machine Analysis and Forecast
12.1 Introduction
12.2 Latin America Wafer Scribing Machine Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Wafer Scribing Machine Market Size Forecast by Type
12.6.1 Semi-automatic
12.6.2 Full-automatic
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Wafer Scribing Machine Market Size Forecast by Applications
12.10.1 Semiconductor
12.10.2 Solar Energy
12.10.3 Other
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Wafer Scribing Machine Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Wafer Scribing Machine Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Wafer Scribing Machine Market Size Forecast by Type
13.6.1 Semi-automatic
13.6.2 Full-automatic
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Wafer Scribing Machine Market Size Forecast by Applications
13.10.1 Semiconductor
13.10.2 Solar Energy
13.10.3 Other
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Wafer Scribing Machine Market: Competitive Dashboard
14.2 Global Wafer Scribing Machine Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Dynatex International
14.3.2 Loomis Industries
14.3.3 Minitron Elektronik GmbH
14.3.4 Tecdia
14.3.5 ADT
14.3.6 IPG Photonics
14.3.7 MDI
14.3.8 HGLaser
14.3.9 Genesem
14.3.10 Dynasoft Electronics
14.3.11 Dynatex International
14.3.12 BSET EQ
14.3.13 Loadpoint
14.3.14 Accretech
14.3.15 DISCO
14.3.16 3D-Micromac AG
