Market Overview:
The global wafer separation equipment market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The market growth can be attributed to the increasing demand for semiconductor devices and rising adoption of advanced technologies across different applications. In terms of type, the anti-static type segment is expected to hold the largest share in the global wafer separation equipment market during the forecast period. This can be attributed to its ability to protect sensitive electronic components from electrostatic discharge (ESD).
Product Definition:
Wafer separation equipment is a type of manufacturing equipment used to separate semiconductor wafers. It is an important tool in the semiconductor fabrication process, as it allows for the individual processing of each wafer.
Anti-static Type:
Anti-static type is a device used in wafer separation process to reduce the electric charges on wafers. It works by creating an electric field between two charged plates which attracts dust particles and prevents their adhesion to the surface of semiconductor devices.
The major factor responsible for high growth of this market is growing demand for integrated circuits among electronic devices such as mobile phones, personal computers, and other consumer electronics products.
Sterile Type:
Sterile type is used in wafer separation equipment to separate the wafers during the manufacturing of semiconductor devices. The process involves a lot of steps which include cleaning, aligning, disassembling and re-assempling. In addition to this, there are also other processes such as surface disinfection and sterilization that involve high level disinfectants and low dose radiation for killing microorganisms present on the surfaces.
Application Insights:
200mm wafer size application segment led the global wafer separation equipment market in 2017. The segment is projected to witness significant growth over the forecast period owing to its extensive use in semiconductor and IT industries. 200mm process offers various benefits including high throughput, low cost and high efficiency which makes it a preferred choice among several manufacturers globally.
The 300mm wafer size application segment is expected to witness substantial growth over the forecast period due to its increasing use in advanced manufacturing of chips for a variety of applications such as super capacitors, NAND flash memory devices, 3D integrated circuits and silicon photonics products among others. Increasing demand for 300 mm process from various sectors such as solar power generation, data centers & telecommunication has been driving the industry growth worldwide since past few years.
Regional Analysis:
North America dominated the global market in 2017. The growth is attributed to the presence of major players, high adoption rate of advanced technologies, and increasing demand for integrated circuits on account of rising computing power requirements from smartphones and other consumer electronics products. Asia Pacific is expected to be the fastest-growing regional market over the forecast period owing to rapid technological advancements in Taiwan Semiconductor Manufacturing Company (TSMC) and China National Nuclear Corporation (CNNC) that are manufacturing ICs using 300mm wafers. Moreover, growing investments by various governments for development of semiconductor industry will drive product demand further.
Growth Factors:
- Increasing demand for semiconductor devices in consumer electronics and telecommunications sectors
- Rising number of fabless companies and IDMs
- Proliferation of 3D IC technology
- Growing trend of miniaturization in semiconductor industry
- Emergence of new applications such as MEMS, power ICs, and LED
Scope Of The Report
Report Attributes
Report Details
Report Title
Wafer Separation Equipment Market Research Report
By Type
Anti-static Type, Sterile Type, Conductive Type
By Application
200mm Wafer Size, 300mm Wafer Size, Others
By Companies
DISCO Corporation, Meyer Burger, ASMPT, Decker, Daitron
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
229
Number of Tables & Figures
161
Customization Available
Yes, the report can be customized as per your need.
Global Wafer Separation Equipment Market Report Segments:
The global Wafer Separation Equipment market is segmented on the basis of:
Types
Anti-static Type, Sterile Type, Conductive Type
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
200mm Wafer Size, 300mm Wafer Size, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- DISCO Corporation
- Meyer Burger
- ASMPT
- Decker
- Daitron
Highlights of The Wafer Separation Equipment Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Anti-static Type
- Sterile Type
- Conductive Type
- By Application:
- 200mm Wafer Size
- 300mm Wafer Size
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Wafer Separation Equipment Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Wafer separation equipment is a machine that uses a series of sharp blades to cut wafers into small pieces. This equipment is used in the semiconductor and electronics industries to separate different types of chips.
Some of the major companies in the wafer separation equipment market are DISCO Corporation, Meyer Burger, ASMPT, Decker, Daitron.
The wafer separation equipment market is expected to register a CAGR of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Wafer Separation Equipment Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Wafer Separation Equipment Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Wafer Separation Equipment Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Wafer Separation Equipment Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Wafer Separation Equipment Market Size & Forecast, 2020-2028
4.5.1 Wafer Separation Equipment Market Size and Y-o-Y Growth
4.5.2 Wafer Separation Equipment Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Anti-static Type
5.2.2 Sterile Type
5.2.3 Conductive Type
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 200mm Wafer Size
6.2.2 300mm Wafer Size
6.2.3 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Wafer Separation Equipment Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Wafer Separation Equipment Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Anti-static Type
9.6.2 Sterile Type
9.6.3 Conductive Type
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 200mm Wafer Size
9.10.2 300mm Wafer Size
9.10.3 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Anti-static Type
10.6.2 Sterile Type
10.6.3 Conductive Type
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 200mm Wafer Size
10.10.2 300mm Wafer Size
10.10.3 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Anti-static Type
11.6.2 Sterile Type
11.6.3 Conductive Type
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 200mm Wafer Size
11.10.2 300mm Wafer Size
11.10.3 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Anti-static Type
12.6.2 Sterile Type
12.6.3 Conductive Type
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 200mm Wafer Size
12.10.2 300mm Wafer Size
12.10.3 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Anti-static Type
13.6.2 Sterile Type
13.6.3 Conductive Type
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 200mm Wafer Size
13.10.2 300mm Wafer Size
13.10.3 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Wafer Separation Equipment Market: Competitive Dashboard
14.2 Global Wafer Separation Equipment Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 DISCO Corporation
14.3.2 Meyer Burger
14.3.3 ASMPT
14.3.4 Decker
14.3.5 Daitron
