Market Overview:
The global wire solder market is expected to grow at a CAGR of 5.5% from 2018 to 2030. The growth in the market can be attributed to the increasing demand for lead free solder wire and rising demand for semiconductor packaging. In terms of type, the lead free solder wire segment is expected to grow at a higher CAGR than the lead solder wire segment during the forecast period. This can be attributed to stringent environmental regulations regarding use of lead in various applications across different regions. In terms of application, SMT assembly is expected to hold a larger share of the global market than semiconductor packaging during the forecast period. This can be attributed to increasing demand for miniaturized electronic devices and rising trend of outsourcing PCB assembly services by Original Equipment Manufacturers (OEMs).
Product Definition:
A solder is a fusible metal alloy used tojoin two metals by melting and flowing between them. Solders are usually alloys of lead, tin and silver, but other materials such as bismuth, antimony and copper may be used to give different characteristics to the solder.
Lead Free Solder Wire:
Lead free solder wire is a special type of solder wire that contains no lead. It is widely used in electronics assembly owing to its several properties such as high thermal conductivity, corrosion resistance and ability to work at higher temperatures. Lead-free solder wires are also more robust than conventional ones which makes them suitable for heavy industrial usage.
The global market for lead-free solder wires was estimated at USD 1,10 billion in 2015.
Lead Solder Wire:
Lead solder wire is one of the most important components in the entire soldering process. It has a significant influence on various aspects such as mechanical properties, electrical characteristics, and performance of joints. Lead solder wire consists of tin lead (Sn) and lead-based alloy or pure metal with high thermal conductivity. The major applications include electronic assembly & repair, printed circuit boards (PCB), home appliances & consumer electronics among others.
Application Insights:
SMT assembly was the largest application segment and accounted for over 40% of the total revenue share in 2017. The demand for lead free solder wire in SMT assembly is expected to witness growth on account of its high reliability, durability, low melting temperature and superior electrical conductivity. Moreover, increasing use of reflow soldering techniques for SMT components is anticipated to further drive the product demand over the forecast period.
Semiconductor packaging was another prominent application segment accounting for a significant market share in 2017 owing to growing semiconductor industry across various regions including Asia Pacific and Latin America. Various electronic devices such as smartphones, laptops etc., contain numerous semiconductors which require precise dimensional tolerances when packaged together; this requires accurate measurement of distances between these components during manufacturing process leading to increased usage of wires with solder joints thereby supporting higher market penetration rate over the forecast period.
Regional Analysis:
Asia Pacific dominated the global wire solder market in 2017 and is expected to continue its dominance over the forecast period. The region comprises several emerging economies, such as China, India, and South Korea. Rapidly growing electronics manufacturing industry in these countries coupled with increasing foreign investments is anticipated to drive the regional market growth over the forecast period.
The Asia Pacific region has witnessed a significant rise in demand for lead free solder wire due to stringent government regulations regarding environmental pollution caused by leaded solders since 2010s. In addition, rising awareness about health hazards caused by exposure to toxic gases released during soldering operations are likely to propel product demand from SMT assembly applications segment of electronics industry over next eight years.
Europe was estimated as second-largest regional segment followed by North America on account of presence of major electronic manufacturers such as Siemens AG and Alstom Grid Ltd.
Growth Factors:
- Increasing demand from the automotive and electronics industries
- Growing popularity of miniaturized and high-density electronic devices
- Rising demand for lead-free solder products to meet environmental regulations
- Technological advancements that have led to the development of new applications for solder products
- The increasing use of contract manufacturing services in the electronics industry
Scope Of The Report
Report Attributes
Report Details
Report Title
Wire Solder Market Research Report
By Type
Lead Free Solder Wire, Lead Solder Wire
By Application
SMT Assembly, Semiconductor Packaging
By Companies
Alent (Alpha), Senju, Shengmao, Henkel, Indium, Kester(ITW), Inventec, KOKI, AIM, Nihon Superior
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
181
Number of Tables & Figures
127
Customization Available
Yes, the report can be customized as per your need.
Global Wire Solder Market Report Segments:
The global Wire Solder market is segmented on the basis of:
Types
Lead Free Solder Wire, Lead Solder Wire
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
SMT Assembly, Semiconductor Packaging
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Alent (Alpha)
- Senju
- Shengmao
- Henkel
- Indium
- Kester(ITW)
- Inventec
- KOKI
- AIM
- Nihon Superior
Highlights of The Wire Solder Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Lead Free Solder Wire
- Lead Solder Wire
- By Application:
- SMT Assembly
- Semiconductor Packaging
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Wire Solder Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Wire solder is a type of soldering that uses thin wires to join two pieces of metal. The wires are heated until they melt, and then the melted wire is drawn through the holes in the first piece of metal and clamped down. This forms a strong connection between the two pieces.
Some of the major companies in the wire solder market are Alent (Alpha), Senju, Shengmao, Henkel, Indium, Kester(ITW), Inventec, KOKI, AIM, Nihon Superior.
The wire solder market is expected to grow at a compound annual growth rate of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Wire Solder Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Wire Solder Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Wire Solder Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Wire Solder Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Wire Solder Market Size & Forecast, 2018-2028
4.5.1 Wire Solder Market Size and Y-o-Y Growth
4.5.2 Wire Solder Market Absolute $ Opportunity
Chapter 5 Global Wire Solder Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Wire Solder Market Size Forecast by Type
5.2.1 Lead Free Solder Wire
5.2.2 Lead Solder Wire
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Wire Solder Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Wire Solder Market Size Forecast by Applications
6.2.1 SMT Assembly
6.2.2 Semiconductor Packaging
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Wire Solder Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Wire Solder Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Wire Solder Analysis and Forecast
9.1 Introduction
9.2 North America Wire Solder Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Wire Solder Market Size Forecast by Type
9.6.1 Lead Free Solder Wire
9.6.2 Lead Solder Wire
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Wire Solder Market Size Forecast by Applications
9.10.1 SMT Assembly
9.10.2 Semiconductor Packaging
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Wire Solder Analysis and Forecast
10.1 Introduction
10.2 Europe Wire Solder Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Wire Solder Market Size Forecast by Type
10.6.1 Lead Free Solder Wire
10.6.2 Lead Solder Wire
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Wire Solder Market Size Forecast by Applications
10.10.1 SMT Assembly
10.10.2 Semiconductor Packaging
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Wire Solder Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Wire Solder Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Wire Solder Market Size Forecast by Type
11.6.1 Lead Free Solder Wire
11.6.2 Lead Solder Wire
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Wire Solder Market Size Forecast by Applications
11.10.1 SMT Assembly
11.10.2 Semiconductor Packaging
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Wire Solder Analysis and Forecast
12.1 Introduction
12.2 Latin America Wire Solder Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Wire Solder Market Size Forecast by Type
12.6.1 Lead Free Solder Wire
12.6.2 Lead Solder Wire
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Wire Solder Market Size Forecast by Applications
12.10.1 SMT Assembly
12.10.2 Semiconductor Packaging
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Wire Solder Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Wire Solder Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Wire Solder Market Size Forecast by Type
13.6.1 Lead Free Solder Wire
13.6.2 Lead Solder Wire
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Wire Solder Market Size Forecast by Applications
13.10.1 SMT Assembly
13.10.2 Semiconductor Packaging
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Wire Solder Market: Competitive Dashboard
14.2 Global Wire Solder Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Alent (Alpha)
14.3.2 Senju
14.3.3 Shengmao
14.3.4 Henkel
14.3.5 Indium
14.3.6 Kester(ITW)
14.3.7 Inventec
14.3.8 KOKI
14.3.9 AIM
14.3.10 Nihon Superior
