The global gold bonding wires market is expected to grow at a CAGR of 3.5% during the forecast period, to reach USD 1.2 billion by 2030. The growth of this market is driven by the increasing demand for gold bonding wires in various applications such as IC, LSI and transistor. Gold bonding wires are used in semiconductor devices for connecting different components on a circuit board and are also used in other electronic devices such as computers, mobile phones, etc, which has led to an increase in demand for these products over the past few years.
The global gold bonding wire market is segmented based on type (by purity), application (IC, LSI and transistor) and region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa). Based on type of purity available in the market; pure gold wire segment accounted for more than 50% share of total revenue generated from this market during 2017-2030. Pure gold wire segment accounted for more than 50% share due to its high conductivity properties which make it suitable for use as a conductor material in electronics industry applications such as ICs or LSIs where high conductivity properties are required.
Some Of The Growth Factors Of This Market:
- The increasing demand for gold bonding wires is a major factor driving the growth of the market.
- The increasing number of new product launches in the market is also a major factor driving the growth of this market.
- The growing need for gold bonding wires in various industries such as automotive, aerospace, and medical is also a major factor driving the growth of this market.
- Increasing investments by key players in research and development activities to develop new products are also a major factor driving the growth of this market.
- Increasing awareness about gold bonding wires among end-users is another key driver for this market.
Industry Growth Insights published a new data on “Gold Bonding Wires Market”. The research report is titled “Gold Bonding Wires Market research by Types (By Purity, By Diameter), By Applications (IC, LSI, Transistor, Other), By Players/Companies Heraeus Electronics, Tanaka, Inseto, AMETEK, MKE, K&S, APT, Microbonds”.
Scope Of The Report
Report Attributes
Report Details
Report Title
Gold Bonding Wires Market Research Report
By Type
By Purity, By Diameter
By Application
IC, LSI, Transistor, Other
By Companies
Heraeus Electronics, Tanaka, Inseto, AMETEK, MKE, K&S, APT, Microbonds
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
236
Number of Tables & Figures
166
Customization Available
Yes, the report can be customized as per your need.
Global Gold Bonding Wires Market Report Segments:
The global Gold Bonding Wires market is segmented on the basis of:
Types
By Purity, By Diameter
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
IC, LSI, Transistor, Other
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Heraeus Electronics
- Tanaka
- Inseto
- AMETEK
- MKE
- K&S
- APT
- Microbonds
Highlights of The Gold Bonding Wires Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- By Purity
- By Diameter
- By Application:
- IC
- LSI
- Transistor
- Other
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Gold Bonding Wires Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
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- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Gold bonding wires are a type of wire that is made from a mixture of gold and other metals. They are used to create jewelry, tools, and other objects. Gold bonding wires are flexible and can be easily shaped into different objects.
Some of the major players in the gold bonding wires market are Heraeus Electronics, Tanaka, Inseto, AMETEK, MKE, K&S, APT, Microbonds.
The gold bonding wires market is expected to grow at a compound annual growth rate of 3.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Gold Bonding Wires Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Gold Bonding Wires Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Gold Bonding Wires Market - Supply Chain
4.5. Global Gold Bonding Wires Market Forecast
4.5.1. Gold Bonding Wires Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Gold Bonding Wires Market Size (000 Units) and Y-o-Y Growth
4.5.3. Gold Bonding Wires Market Absolute $ Opportunity
5. Global Gold Bonding Wires Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Gold Bonding Wires Market Size and Volume Forecast by Type
5.3.1. By Purity
5.3.2. By Diameter
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Gold Bonding Wires Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Gold Bonding Wires Market Size and Volume Forecast by Application
6.3.1. IC
6.3.2. LSI
6.3.3. Transistor
6.3.4. Other
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Gold Bonding Wires Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Gold Bonding Wires Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Gold Bonding Wires Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Gold Bonding Wires Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Gold Bonding Wires Demand Share Forecast, 2019-2026
9. North America Gold Bonding Wires Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Gold Bonding Wires Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Gold Bonding Wires Market Size and Volume Forecast by Application
9.4.1. IC
9.4.2. LSI
9.4.3. Transistor
9.4.4. Other
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Gold Bonding Wires Market Size and Volume Forecast by Type
9.7.1. By Purity
9.7.2. By Diameter
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Gold Bonding Wires Demand Share Forecast, 2019-2026
10. Latin America Gold Bonding Wires Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Gold Bonding Wires Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Gold Bonding Wires Market Size and Volume Forecast by Application
10.4.1. IC
10.4.2. LSI
10.4.3. Transistor
10.4.4. Other
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Gold Bonding Wires Market Size and Volume Forecast by Type
10.7.1. By Purity
10.7.2. By Diameter
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Gold Bonding Wires Demand Share Forecast, 2019-2026
11. Europe Gold Bonding Wires Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Gold Bonding Wires Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Gold Bonding Wires Market Size and Volume Forecast by Application
11.4.1. IC
11.4.2. LSI
11.4.3. Transistor
11.4.4. Other
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Gold Bonding Wires Market Size and Volume Forecast by Type
11.7.1. By Purity
11.7.2. By Diameter
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Gold Bonding Wires Demand Share, 2019-2026
12. Asia Pacific Gold Bonding Wires Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Gold Bonding Wires Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Gold Bonding Wires Market Size and Volume Forecast by Application
12.4.1. IC
12.4.2. LSI
12.4.3. Transistor
12.4.4. Other
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Gold Bonding Wires Market Size and Volume Forecast by Type
12.7.1. By Purity
12.7.2. By Diameter
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Gold Bonding Wires Demand Share, 2019-2026
13. Middle East & Africa Gold Bonding Wires Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Gold Bonding Wires Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Gold Bonding Wires Market Size and Volume Forecast by Application
13.4.1. IC
13.4.2. LSI
13.4.3. Transistor
13.4.4. Other
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Gold Bonding Wires Market Size and Volume Forecast by Type
13.7.1. By Purity
13.7.2. By Diameter
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Gold Bonding Wires Demand Share, 2019-2026
14. Competition Landscape
14.1. Global Gold Bonding Wires Market: Market Share Analysis
14.2. Gold Bonding Wires Distributors and Customers
14.3. Gold Bonding Wires Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. Heraeus Electronics
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. Tanaka
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. Inseto
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. AMETEK
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. MKE
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. K&S
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. APT
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. Microbonds
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. COMPANY9
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. COMPANY 10
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. COMPANY 11
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. COMPANY 12
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. COMPANY 13
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. COMPANY 14
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. COMPANY 15
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. COMPANY 16
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
