Market Overview:
The global high density interconnect market is expected to grow at a CAGR of 5.5% from 2018 to 2030. The growth of the market can be attributed to the increasing demand for high density interconnects in automotive electronics, consumer electronics, and other electronic products. Additionally, the growing demand for miniaturization and higher performance in electronic devices is also contributing to the growth of the market. However, factors such as limited supply chain and lack of standardization are restraining the growth of this market.
Product Definition:
High Density Interconnect is a technology that allows for the connection of multiple devices on a single printed circuit board. This is important because it allows for more devices to be connected in a smaller area, which can lead to increased efficiency and reduced costs.
Single Panel:
Single-panel technology is a new approach to interconnect that uses one material for both the electrical conductors and the insulation. The single-panel technology has been around for about two decades, but it's only recently started gaining traction in high-density interconnect (HDI) markets.
The primary factor driving this market is cost reduction.
Double Panel:
Double panel is a construction term used to express two separate and distinct layers of circuit boards in an electronic device. The two PCB laminates are pressed together with the conductive ink facing each other, usually with a spacer or insulator between them. One of the major advantages of double panel devices is that they can be manufactured more quickly than single-panel devices; however, their use has been limited due to high manufacturing costs.
Application Insights:
The automotive electronics segment accounted for the largest revenue share in 2016 and is anticipated to continue its dominance over the forecast period. Automotive electronics include a wide range of applications including infotainment systems, body electronics, HVAC (heating, ventilation and cooling), lighting as well as safety systems. The increasing demand for advanced electronic devices with enhanced features has been driving the product demand in this application segment.
High-density interconnects provide low resistance path between integrated circuits thus improving signal transmission efficiency which results in improved performance of various electronic products such as mobile phones, laptops etcetera. Increasing usage of high-tech products has resulted in increased product demand across other end-use segments such as consumer appliances and other electronic products which are projected to drive growth over the forecast period.
Regional Analysis:
Asia Pacific dominated the global high density interconnect market in 2016 and is expected to continue its dominance over the forecast period. The growth of this region can be attributed to increasing demand for electronic products, such as smartphones and tablets, which require large scale production of semiconductors. Moreover, rising investments by governments in developing countries are anticipated to boost industry expansion over the next eight years.
The Asia Pacific was followed by North America that accounted for a revenue share of more than 20% in 2016 owing to growing demand from various end-use industries including automotive electronics and consumer electronics.
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Proliferation of high-performance computing and big data analytics
- Emergence of new applications in automotive, aerospace & defense, and medical industries
- Growing popularity of 3D printing technology
- Rising demand for advanced packaging solutions
Scope Of The Report
Report Attributes
Report Details
Report Title
High Density Interconnect Market Research Report
By Type
Single Panel, Double Panel, Others
By Application
Automotive Electronics, Consumer Electronics, Other Electronic Products
By Companies
IBIDEN Group, Unimicron, AT&S, SEMCO, NCAB Group, Young Poong Group, ZDT, Compeq, Unitech Printed Circuit Board Corp., LG Innotek, Tripod Technology, TTM Technologies, Daeduck, HannStar Board, Nan Ya PCB, CMK Corporation, Kingboard, Ellington, CCTC, Wuzhu Technology, Kinwong, Aoshikang, Sierra Circuits, Bittele Electronics, Epec, Würth Elektronik, NOD Electronics, San Francisco Circuits, PCBCart, Advanced Circuits
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
231
Number of Tables & Figures
162
Customization Available
Yes, the report can be customized as per your need.
Global High Density Interconnect Market Report Segments:
The global High Density Interconnect market is segmented on the basis of:
Types
Single Panel, Double Panel, Others
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Automotive Electronics, Consumer Electronics, Other Electronic Products
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- IBIDEN Group
- Unimicron
- AT&S
- SEMCO
- NCAB Group
- Young Poong Group
- ZDT
- Compeq
- Unitech Printed Circuit Board Corp.
- LG Innotek
- Tripod Technology
- TTM Technologies
- Daeduck
- HannStar Board
- Nan Ya PCB
- CMK Corporation
- Kingboard
- Ellington
- CCTC
- Wuzhu Technology
- Kinwong
- Aoshikang
- Sierra Circuits
- Bittele Electronics
- Epec
- Würth Elektronik
- NOD Electronics
- San Francisco Circuits
- PCBCart
- Advanced Circuits
Highlights of The High Density Interconnect Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Single Panel
- Double Panel
- Others
- By Application:
- Automotive Electronics
- Consumer Electronics
- Other Electronic Products
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the High Density Interconnect Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
High density interconnect is a type of electronic connector that allows for more connections between devices than traditional connectors. This can allow for faster data transfer and improved performance.
Some of the major companies in the high density interconnect market are IBIDEN Group, Unimicron, AT&S, SEMCO, NCAB Group, Young Poong Group, ZDT, Compeq, Unitech Printed Circuit Board Corp., LG Innotek, Tripod Technology, TTM Technologies, Daeduck, HannStar Board, Nan Ya PCB, CMK Corporation, Kingboard, Ellington, CCTC, Wuzhu Technology, Kinwong, Aoshikang, Sierra Circuits, Bittele Electronics, Epec, WƒÂ¼rth Elektronik, NOD Electronics, San Francisco Circuits, PCBCart, Advanced Circuits.
The high density interconnect market is expected to register a CAGR of 5.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. High Density Interconnect Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. High Density Interconnect Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. High Density Interconnect Market - Supply Chain
4.5. Global High Density Interconnect Market Forecast
4.5.1. High Density Interconnect Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. High Density Interconnect Market Size (000 Units) and Y-o-Y Growth
4.5.3. High Density Interconnect Market Absolute $ Opportunity
5. Global High Density Interconnect Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. High Density Interconnect Market Size and Volume Forecast by Type
5.3.1. Single Panel
5.3.2. Double Panel
5.3.3. Others
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global High Density Interconnect Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. High Density Interconnect Market Size and Volume Forecast by Application
6.3.1. Automotive Electronics
6.3.2. Consumer Electronics
6.3.3. Other Electronic Products
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global High Density Interconnect Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. High Density Interconnect Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global High Density Interconnect Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. High Density Interconnect Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global High Density Interconnect Demand Share Forecast, 2019-2029
9. North America High Density Interconnect Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America High Density Interconnect Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America High Density Interconnect Market Size and Volume Forecast by Application
9.4.1. Automotive Electronics
9.4.2. Consumer Electronics
9.4.3. Other Electronic Products
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America High Density Interconnect Market Size and Volume Forecast by Type
9.7.1. Single Panel
9.7.2. Double Panel
9.7.3. Others
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America High Density Interconnect Demand Share Forecast, 2019-2029
10. Latin America High Density Interconnect Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America High Density Interconnect Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America High Density Interconnect Market Size and Volume Forecast by Application
10.4.1. Automotive Electronics
10.4.2. Consumer Electronics
10.4.3. Other Electronic Products
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America High Density Interconnect Market Size and Volume Forecast by Type
10.7.1. Single Panel
10.7.2. Double Panel
10.7.3. Others
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America High Density Interconnect Demand Share Forecast, 2019-2029
11. Europe High Density Interconnect Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe High Density Interconnect Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe High Density Interconnect Market Size and Volume Forecast by Application
11.4.1. Automotive Electronics
11.4.2. Consumer Electronics
11.4.3. Other Electronic Products
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe High Density Interconnect Market Size and Volume Forecast by Type
11.7.1. Single Panel
11.7.2. Double Panel
11.7.3. Others
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe High Density Interconnect Demand Share, 2019-2029
12. Asia Pacific High Density Interconnect Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific High Density Interconnect Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific High Density Interconnect Market Size and Volume Forecast by Application
12.4.1. Automotive Electronics
12.4.2. Consumer Electronics
12.4.3. Other Electronic Products
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific High Density Interconnect Market Size and Volume Forecast by Type
12.7.1. Single Panel
12.7.2. Double Panel
12.7.3. Others
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific High Density Interconnect Demand Share, 2019-2029
13. Middle East & Africa High Density Interconnect Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa High Density Interconnect Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa High Density Interconnect Market Size and Volume Forecast by Application
13.4.1. Automotive Electronics
13.4.2. Consumer Electronics
13.4.3. Other Electronic Products
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa High Density Interconnect Market Size and Volume Forecast by Type
13.7.1. Single Panel
13.7.2. Double Panel
13.7.3. Others
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa High Density Interconnect Demand Share, 2019-2029
14. Competition Landscape
14.1. Global High Density Interconnect Market: Market Share Analysis
14.2. High Density Interconnect Distributors and Customers
14.3. High Density Interconnect Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. IBIDEN Group
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. Unimicron
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. AT&S
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. SEMCO
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. NCAB Group
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. Young Poong Group
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. ZDT
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. Compeq
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. Unitech Printed Circuit Board Corp.
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. LG Innotek
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. Tripod Technology
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. TTM Technologies
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. Daeduck
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. HannStar Board
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. Nan Ya PCB
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. CMK Corporation
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. Kingboard
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. Ellington
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. CCTC
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. Wuzhu Technology
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
