High-density interconnect (HDI) PCBs are a type of printed circuit board that is used in the manufacturing of electronic devices. HDI PCBs are made up of copper layers and have a high density of copper traces. The number of layers in an HDI PCB varies depending on the application, but typically ranges from 6 to 10. The most common applications for HDI PCBs include automotive, computers, communication, and digital devices.
- The demand for HDI PCBs is expected to grow due to the increasing need for high-speed data transmission and storage.
- The demand of HDI PCBs will increase as more companies are adopting this technology in their products.
Industry Growth Insights published a new data on “High Density Interconnect (HDI) PCBs Market”. The research report is titled “High Density Interconnect (HDI) PCBs Market research by Types (4-6 Layers HDI PCBs, 8-10 Layer HDI PCBs, 10+ Layer HDI PCBs), By Applications (Automotive, Computers, Communication, Digital, Others), By Players/Companies IBIDEN Group, NCAB Group, Bittele Electronics, TTM Technologies, Unimicron, AT&S, SEMCO, Young Poong Group, ZDT, Unitech Printed Circuit Board, LG Innotek, Tripod Technology, Daeduck, HannStar Board, Nan Ya PCB, CMK Corporation, Kingboard, Ellington, Wuzhu Technology, Kinwong”.
Scope Of The Report
Report Attributes
Report Details
Report Title
High Density Interconnect (HDI) PCBs Market Research Report
By Type
4-6 Layers HDI PCBs, 8-10 Layer HDI PCBs, 10+ Layer HDI PCBs
By Application
Automotive, Computers, Communication, Digital, Others
By Companies
IBIDEN Group, NCAB Group, Bittele Electronics, TTM Technologies, Unimicron, AT&S, SEMCO, Young Poong Group, ZDT, Unitech Printed Circuit Board, LG Innotek, Tripod Technology, Daeduck, HannStar Board, Nan Ya PCB, CMK Corporation, Kingboard, Ellington, Wuzhu Technology, Kinwong
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
247
Number of Tables & Figures
173
Customization Available
Yes, the report can be customized as per your need.
 PCBs Industry Outlook.svg)
Global High Density Interconnect (HDI) PCBs Market Report Segments:
The global High Density Interconnect (HDI) PCBs market is segmented on the basis of:
Types
4-6 Layers HDI PCBs, 8-10 Layer HDI PCBs, 10+ Layer HDI PCBs
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Automotive, Computers, Communication, Digital, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- IBIDEN Group
- NCAB Group
- Bittele Electronics
- TTM Technologies
- Unimicron
- AT&S
- SEMCO
- Young Poong Group
- ZDT
- Unitech Printed Circuit Board
- LG Innotek
- Tripod Technology
- Daeduck
- HannStar Board
- Nan Ya PCB
- CMK Corporation
- Kingboard
- Ellington
- Wuzhu Technology
- Kinwong
 PCBs Market Overview.svg)
Highlights of The High Density Interconnect (HDI) PCBs Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- 4-6 Layers HDI PCBs
- 8-10 Layer HDI PCBs
- 10+ Layer HDI PCBs
- By Application:
- Automotive
- Computers
- Communication
- Digital
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the High Density Interconnect (HDI) PCBs Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
 PCBs Market Statistics.svg)
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
HDI PCBs are a type of printed circuit board that uses high density interconnections between the components. This allows for greater flexibility and efficiency in the design of the board, as well as improved performance.
Some of the major players in the high density interconnect (hdi) pcbs market are IBIDEN Group, NCAB Group, Bittele Electronics, TTM Technologies, Unimicron, AT&S, SEMCO, Young Poong Group, ZDT, Unitech Printed Circuit Board, LG Innotek, Tripod Technology, Daeduck, HannStar Board, Nan Ya PCB, CMK Corporation, Kingboard, Ellington, Wuzhu Technology, Kinwong.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. High Density Interconnect (HDI) PCBs Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. High Density Interconnect (HDI) PCBs Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. High Density Interconnect (HDI) PCBs Market - Supply Chain
4.5. Global High Density Interconnect (HDI) PCBs Market Forecast
4.5.1. High Density Interconnect (HDI) PCBs Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. High Density Interconnect (HDI) PCBs Market Size (000 Units) and Y-o-Y Growth
4.5.3. High Density Interconnect (HDI) PCBs Market Absolute $ Opportunity
5. Global High Density Interconnect (HDI) PCBs Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. High Density Interconnect (HDI) PCBs Market Size and Volume Forecast by Type
5.3.1. 4-6 Layers HDI PCBs
5.3.2. 8-10 Layer HDI PCBs
5.3.3. 10+ Layer HDI PCBs
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global High Density Interconnect (HDI) PCBs Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. High Density Interconnect (HDI) PCBs Market Size and Volume Forecast by Application
6.3.1. Automotive
6.3.2. Computers
6.3.3. Communication
6.3.4. Digital
6.3.5. Others
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global High Density Interconnect (HDI) PCBs Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. High Density Interconnect (HDI) PCBs Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global High Density Interconnect (HDI) PCBs Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. High Density Interconnect (HDI) PCBs Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global High Density Interconnect (HDI) PCBs Demand Share Forecast, 2019-2029
9. North America High Density Interconnect (HDI) PCBs Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America High Density Interconnect (HDI) PCBs Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America High Density Interconnect (HDI) PCBs Market Size and Volume Forecast by Application
9.4.1. Automotive
9.4.2. Computers
9.4.3. Communication
9.4.4. Digital
9.4.5. Others
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America High Density Interconnect (HDI) PCBs Market Size and Volume Forecast by Type
9.7.1. 4-6 Layers HDI PCBs
9.7.2. 8-10 Layer HDI PCBs
9.7.3. 10+ Layer HDI PCBs
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America High Density Interconnect (HDI) PCBs Demand Share Forecast, 2019-2029
10. Latin America High Density Interconnect (HDI) PCBs Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America High Density Interconnect (HDI) PCBs Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America High Density Interconnect (HDI) PCBs Market Size and Volume Forecast by Application
10.4.1. Automotive
10.4.2. Computers
10.4.3. Communication
10.4.4. Digital
10.4.5. Others
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America High Density Interconnect (HDI) PCBs Market Size and Volume Forecast by Type
10.7.1. 4-6 Layers HDI PCBs
10.7.2. 8-10 Layer HDI PCBs
10.7.3. 10+ Layer HDI PCBs
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America High Density Interconnect (HDI) PCBs Demand Share Forecast, 2019-2029
11. Europe High Density Interconnect (HDI) PCBs Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe High Density Interconnect (HDI) PCBs Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe High Density Interconnect (HDI) PCBs Market Size and Volume Forecast by Application
11.4.1. Automotive
11.4.2. Computers
11.4.3. Communication
11.4.4. Digital
11.4.5. Others
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe High Density Interconnect (HDI) PCBs Market Size and Volume Forecast by Type
11.7.1. 4-6 Layers HDI PCBs
11.7.2. 8-10 Layer HDI PCBs
11.7.3. 10+ Layer HDI PCBs
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe High Density Interconnect (HDI) PCBs Demand Share, 2019-2029
12. Asia Pacific High Density Interconnect (HDI) PCBs Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific High Density Interconnect (HDI) PCBs Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific High Density Interconnect (HDI) PCBs Market Size and Volume Forecast by Application
12.4.1. Automotive
12.4.2. Computers
12.4.3. Communication
12.4.4. Digital
12.4.5. Others
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific High Density Interconnect (HDI) PCBs Market Size and Volume Forecast by Type
12.7.1. 4-6 Layers HDI PCBs
12.7.2. 8-10 Layer HDI PCBs
12.7.3. 10+ Layer HDI PCBs
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific High Density Interconnect (HDI) PCBs Demand Share, 2019-2029
13. Middle East & Africa High Density Interconnect (HDI) PCBs Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa High Density Interconnect (HDI) PCBs Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa High Density Interconnect (HDI) PCBs Market Size and Volume Forecast by Application
13.4.1. Automotive
13.4.2. Computers
13.4.3. Communication
13.4.4. Digital
13.4.5. Others
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa High Density Interconnect (HDI) PCBs Market Size and Volume Forecast by Type
13.7.1. 4-6 Layers HDI PCBs
13.7.2. 8-10 Layer HDI PCBs
13.7.3. 10+ Layer HDI PCBs
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa High Density Interconnect (HDI) PCBs Demand Share, 2019-2029
14. Competition Landscape
14.1. Global High Density Interconnect (HDI) PCBs Market: Market Share Analysis
14.2. High Density Interconnect (HDI) PCBs Distributors and Customers
14.3. High Density Interconnect (HDI) PCBs Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. IBIDEN Group
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. NCAB Group
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. Bittele Electronics
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. TTM Technologies
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. Unimicron
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. AT&S
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. SEMCO
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. Young Poong Group
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. ZDT
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. Unitech Printed Circuit Board
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. LG Innotek
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. Tripod Technology
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. Daeduck
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. HannStar Board
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. Nan Ya PCB
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. CMK Corporation
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. Kingboard
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. Ellington
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. Wuzhu Technology
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. Kinwong
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
