Market Overview:
The global high layer count PCB market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for advanced electronic products, miniaturization of electronic devices, and rising demand for high-performance PCBs in various applications. Based on type, the global high layer count PCB market is segmented into 3-layer High Layer Count PCBs, 14-layer High Layer Count PCBs, 32-layer High Layer Count PCBs and others. The 3-layer High Layer Count PCBS segment is expected to account for the largest share of the global high layer count pcb market in 2018. This can be attributed to its low cost and easy manufacturing process as compared to other types of high layer count pcb boards. Based on application, the global high layer count pcbs market is segmented into consumer electronics, computer systems & peripherals, telecommunications equipment & networks infrastructure equipment), industrial/medical devices (including medical imaging systems), automotive electronics (including infotainment systems), military/aerospace electronics (including avionics) and others segments).
Product Definition:
A High Layer Count PCB is a printed circuit board with more than 6 layers. This type of PCB is used in more complex electronic systems, where higher performance and reliability are required.
3-layer High Layer Count PCB:
3-layer high layer count PCB is a type of double-sided printed circuit board (PDPCB) that has two layers of laminates, the bottom one is made from High Density Polyethylene (HDPE), the top one from Low Density Polyethylene (LDPE). The overall thickness of 3HLPCB can be up to 0.75mm less than 1/4 inch.
14-layer High Layer Count PCB:
14-layer high layer count PCB is a special type of circuit board that has more than one thousand (1000) layers. Such boards are used in electronic devices such as microchips, which have extremely small dimensions and need to be mounted on a large base in order to function properly.
Application Insights:
The consumer electronics segment accounted for the largest share in 2015 and is projected to continue its dominance over the forecast period. The growth of this application can be attributed to increasing demand for electronic devices across the globe. Countries such as China, India, and Japan are leading manufacturers of consumer electronics which has fueled high layer count PCB market growth in these regions. Moreover, with rising demand from other countries too will lead to an increase in production thus driving high layer count PCB market growth globally over the forecast period.
Highlayer ltd offers a wide range of 32lcd pcb products that meet various requirements including size flexibility.
Regional Analysis:
Asia Pacific region accounted for the largest market share in 2017 and is expected to continue its dominance over the forecast period. The growth can be attributed to increasing demand from end-use industries such as consumer electronics, computer, communication, industrial/medical and automotive.
The Asia Pacific regional market is characterized by a large number of local manufacturers that offer cost-effective products owing to low labor costs in countries such as China and India. Moreover, rising disposable income coupled with high population growth rates has resulted in an increased demand for electronic devices which will further boost the industry expansion over the next eight years.
Europe was another significant contributor towards global high layer count PCBs market share followed by North America due to presence of major players operating within each region along with well established manufacturing base for electrical equipment manufacturing companies including microelectronics manufacturers (MEMC), analog semiconductor devices manufacturer (ASD) and digital signal processing device manufacturer (DSP).
Growth Factors:
- Increasing demand for miniaturization in electronic products
- Proliferation of high-end applications across different industry verticals
- Rising demand for advanced PCBs from the automotive sector
- Growing popularity of LED lighting and other green technologies
- Emergence of new market players and technological advancements
Scope Of The Report
Report Attributes
Report Details
Report Title
High Layer Count PCB Market Research Report
By Type
3-layer High Layer Count PCB, 14-layer High Layer Count PCB, 32-layer High Layer Count PCB, Others
By Application
Consumer Electronics, Computer, Communications, Industrial/Medical, Automotive, Military/Aerospace, Others
By Companies
TTM Technologies, Meiko, PW Circuits, Tripod Technoloigy, KingBoard, AT&S, Nippon Mektron, Ellington Electronic Technology, Schweizer, Bomin Electronics, Ibiden, ZDT, Compeq
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
239
Number of Tables & Figures
168
Customization Available
Yes, the report can be customized as per your need.
Global High Layer Count PCB Market Report Segments:
The global High Layer Count PCB market is segmented on the basis of:
Types
3-layer High Layer Count PCB, 14-layer High Layer Count PCB, 32-layer High Layer Count PCB, Others
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Consumer Electronics, Computer, Communications, Industrial/Medical, Automotive, Military/Aerospace, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- TTM Technologies
- Meiko
- PW Circuits
- Tripod Technoloigy
- KingBoard
- AT&S
- Nippon Mektron
- Ellington Electronic Technology
- Schweizer
- Bomin Electronics
- Ibiden
- ZDT
- Compeq
Highlights of The High Layer Count PCB Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- 3-layer High Layer Count PCB
- 14-layer High Layer Count PCB
- 32-layer High Layer Count PCB
- Others
- By Application:
- Consumer Electronics
- Computer
- Communications
- Industrial/Medical
- Automotive
- Military/Aerospace
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the High Layer Count PCB Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
High layer count PCBs are boards with a high number of layers. This means that the board has more layers than traditional PCBs. The increased number of layers allows for better signal transmission and stability.
Some of the key players operating in the high layer count pcb market are TTM Technologies, Meiko, PW Circuits, Tripod Technoloigy, KingBoard, AT&S, Nippon Mektron, Ellington Electronic Technology, Schweizer, Bomin Electronics, Ibiden, ZDT, Compeq.
The high layer count pcb market is expected to register a CAGR of 6.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. High Layer Count PCB Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. High Layer Count PCB Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. High Layer Count PCB Market - Supply Chain
4.5. Global High Layer Count PCB Market Forecast
4.5.1. High Layer Count PCB Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. High Layer Count PCB Market Size (000 Units) and Y-o-Y Growth
4.5.3. High Layer Count PCB Market Absolute $ Opportunity
5. Global High Layer Count PCB Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. High Layer Count PCB Market Size and Volume Forecast by Type
5.3.1. 3-layer High Layer Count PCB
5.3.2. 14-layer High Layer Count PCB
5.3.3. 32-layer High Layer Count PCB
5.3.4. Others
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global High Layer Count PCB Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. High Layer Count PCB Market Size and Volume Forecast by Application
6.3.1. Consumer Electronics
6.3.2. Computer
6.3.3. Communications
6.3.4. Industrial/Medical
6.3.5. Automotive
6.3.6. Military/Aerospace
6.3.7. Others
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global High Layer Count PCB Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. High Layer Count PCB Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global High Layer Count PCB Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. High Layer Count PCB Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global High Layer Count PCB Demand Share Forecast, 2019-2026
9. North America High Layer Count PCB Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America High Layer Count PCB Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America High Layer Count PCB Market Size and Volume Forecast by Application
9.4.1. Consumer Electronics
9.4.2. Computer
9.4.3. Communications
9.4.4. Industrial/Medical
9.4.5. Automotive
9.4.6. Military/Aerospace
9.4.7. Others
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America High Layer Count PCB Market Size and Volume Forecast by Type
9.7.1. 3-layer High Layer Count PCB
9.7.2. 14-layer High Layer Count PCB
9.7.3. 32-layer High Layer Count PCB
9.7.4. Others
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America High Layer Count PCB Demand Share Forecast, 2019-2026
10. Latin America High Layer Count PCB Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America High Layer Count PCB Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America High Layer Count PCB Market Size and Volume Forecast by Application
10.4.1. Consumer Electronics
10.4.2. Computer
10.4.3. Communications
10.4.4. Industrial/Medical
10.4.5. Automotive
10.4.6. Military/Aerospace
10.4.7. Others
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America High Layer Count PCB Market Size and Volume Forecast by Type
10.7.1. 3-layer High Layer Count PCB
10.7.2. 14-layer High Layer Count PCB
10.7.3. 32-layer High Layer Count PCB
10.7.4. Others
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America High Layer Count PCB Demand Share Forecast, 2019-2026
11. Europe High Layer Count PCB Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe High Layer Count PCB Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe High Layer Count PCB Market Size and Volume Forecast by Application
11.4.1. Consumer Electronics
11.4.2. Computer
11.4.3. Communications
11.4.4. Industrial/Medical
11.4.5. Automotive
11.4.6. Military/Aerospace
11.4.7. Others
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe High Layer Count PCB Market Size and Volume Forecast by Type
11.7.1. 3-layer High Layer Count PCB
11.7.2. 14-layer High Layer Count PCB
11.7.3. 32-layer High Layer Count PCB
11.7.4. Others
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe High Layer Count PCB Demand Share, 2019-2026
12. Asia Pacific High Layer Count PCB Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific High Layer Count PCB Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific High Layer Count PCB Market Size and Volume Forecast by Application
12.4.1. Consumer Electronics
12.4.2. Computer
12.4.3. Communications
12.4.4. Industrial/Medical
12.4.5. Automotive
12.4.6. Military/Aerospace
12.4.7. Others
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific High Layer Count PCB Market Size and Volume Forecast by Type
12.7.1. 3-layer High Layer Count PCB
12.7.2. 14-layer High Layer Count PCB
12.7.3. 32-layer High Layer Count PCB
12.7.4. Others
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific High Layer Count PCB Demand Share, 2019-2026
13. Middle East & Africa High Layer Count PCB Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa High Layer Count PCB Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa High Layer Count PCB Market Size and Volume Forecast by Application
13.4.1. Consumer Electronics
13.4.2. Computer
13.4.3. Communications
13.4.4. Industrial/Medical
13.4.5. Automotive
13.4.6. Military/Aerospace
13.4.7. Others
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa High Layer Count PCB Market Size and Volume Forecast by Type
13.7.1. 3-layer High Layer Count PCB
13.7.2. 14-layer High Layer Count PCB
13.7.3. 32-layer High Layer Count PCB
13.7.4. Others
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa High Layer Count PCB Demand Share, 2019-2026
14. Competition Landscape
14.1. Global High Layer Count PCB Market: Market Share Analysis
14.2. High Layer Count PCB Distributors and Customers
14.3. High Layer Count PCB Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. TTM Technologies
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. Meiko
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. PW Circuits
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. Tripod Technoloigy
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. KingBoard
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. AT&S
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. Nippon Mektron
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. Ellington Electronic Technology
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. Schweizer
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. Bomin Electronics
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. Ibiden
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. ZDT
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. Compeq
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. COMPANY 14
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. COMPANY 15
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. COMPANY 16
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
