The global high-speed board connectors market is expected to grow at a CAGR of 5.5% during the forecast period, from 2021 to 2030. The growth of this market can be attributed to the increasing demand for high-speed data transmission and the need for faster data transfer rates in various applications such as transportation, consumer electronics, communications, industries, military and others.
High-speed board connectors are used in various applications such as transportation, consumer electronics, communications, industries and military among others. The demand for these connectors is increasing due to the need for faster data transfer rates in these applications. For instance, high-speed board connectors are used in automotive industry where they are required for connecting different electronic components on a vehicle's dashboard or other parts of a car's interior. These connectors allow fast data transmission between different electronic components which helps improve performance and efficiency of vehicles while reducing their weight by eliminating unnecessary wires that would otherwise be needed if low speed board connector were used instead.
Some Of The Growth Factors Of This Market:
- The need for high-speed data transfer is increasing due to the increase in the number of devices that are connected to networks.
Industry Growth Insights published a new data on “High-Speed Board-to-Board Connectors Market”. The research report is titled “High-Speed Board-to-Board Connectors Market research by Types (<1.00 mm, 1.00 mm-2.00 mm, > 2.00 mm), By Applications (Transportation, Consumer Electronics, Communications, Industries, Military, Other), By Players/Companies TE Connectivity, Samtec, Amphenol, Molex, Fujitsu, Hirose Electric, JST, Joint Admissions Exercise (JAE), Delphi, Harting, Foxconn, ERNI Electronics, Kyocera, Yamaichi Electronics, Advanced Interconnect, Unimicron Technology”.
Scope Of The Report
Report Attributes
Report Details
Report Title
High-Speed Board-to-Board Connectors Market Research Report
By Type
<1.00 mm, 1.00 mm-2.00 mm, > 2.00 mm
By Application
Transportation, Consumer Electronics, Communications, Industries, Military, Other
By Companies
TE Connectivity, Samtec, Amphenol, Molex, Fujitsu, Hirose Electric, JST, Joint Admissions Exercise (JAE), Delphi, Harting, Foxconn, ERNI Electronics, Kyocera, Yamaichi Electronics, Advanced Interconnect, Unimicron Technology
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
247
Number of Tables & Figures
173
Customization Available
Yes, the report can be customized as per your need.
Global High-Speed Board-to-Board Connectors Market Report Segments:
The global High-Speed Board-to-Board Connectors market is segmented on the basis of:
Types
<1.00 mm, 1.00 mm-2.00 mm, > 2.00 mm
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Transportation, Consumer Electronics, Communications, Industries, Military, Other
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- TE Connectivity
- Samtec
- Amphenol
- Molex
- Fujitsu
- Hirose Electric
- JST
- Joint Admissions Exercise (JAE)
- Delphi
- Harting
- Foxconn
- ERNI Electronics
- Kyocera
- Yamaichi Electronics
- Advanced Interconnect
- Unimicron Technology
Highlights of The High-Speed Board-to-Board Connectors Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- <1.00 mm
- 1.00 mm-2.00 mm
- > 2.00 mm
- By Application:
- Transportation
- Consumer Electronics
- Communications
- Industries
- Military
- Other
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the High-Speed Board-to-Board Connectors Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
High-speed board-to-board connectors are connectors that allow two boards to be connected together quickly and easily. They are often used in industrial applications, where speed is important.
Some of the major players in the high-speed board-to-board connectors market are TE Connectivity, Samtec, Amphenol, Molex, Fujitsu, Hirose Electric, JST, Joint Admissions Exercise (JAE), Delphi, Harting, Foxconn, ERNI Electronics, Kyocera, Yamaichi Electronics, Advanced Interconnect, Unimicron Technology.
The high-speed board-to-board connectors market is expected to register a CAGR of 5.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. High-Speed Board-to-Board Connectors Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. High-Speed Board-to-Board Connectors Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. High-Speed Board-to-Board Connectors Market - Supply Chain
4.5. Global High-Speed Board-to-Board Connectors Market Forecast
4.5.1. High-Speed Board-to-Board Connectors Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. High-Speed Board-to-Board Connectors Market Size (000 Units) and Y-o-Y Growth
4.5.3. High-Speed Board-to-Board Connectors Market Absolute $ Opportunity
5. Global High-Speed Board-to-Board Connectors Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. High-Speed Board-to-Board Connectors Market Size and Volume Forecast by Type
5.3.1. <1.00 mm
5.3.2. 1.00 mm-2.00 mm
5.3.3. > 2.00 mm
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global High-Speed Board-to-Board Connectors Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. High-Speed Board-to-Board Connectors Market Size and Volume Forecast by Application
6.3.1. Transportation
6.3.2. Consumer Electronics
6.3.3. Communications
6.3.4. Industries
6.3.5. Military
6.3.6. Other
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global High-Speed Board-to-Board Connectors Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. High-Speed Board-to-Board Connectors Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global High-Speed Board-to-Board Connectors Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. High-Speed Board-to-Board Connectors Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global High-Speed Board-to-Board Connectors Demand Share Forecast, 2019-2026
9. North America High-Speed Board-to-Board Connectors Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America High-Speed Board-to-Board Connectors Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America High-Speed Board-to-Board Connectors Market Size and Volume Forecast by Application
9.4.1. Transportation
9.4.2. Consumer Electronics
9.4.3. Communications
9.4.4. Industries
9.4.5. Military
9.4.6. Other
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America High-Speed Board-to-Board Connectors Market Size and Volume Forecast by Type
9.7.1. <1.00 mm
9.7.2. 1.00 mm-2.00 mm
9.7.3. > 2.00 mm
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America High-Speed Board-to-Board Connectors Demand Share Forecast, 2019-2026
10. Latin America High-Speed Board-to-Board Connectors Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America High-Speed Board-to-Board Connectors Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America High-Speed Board-to-Board Connectors Market Size and Volume Forecast by Application
10.4.1. Transportation
10.4.2. Consumer Electronics
10.4.3. Communications
10.4.4. Industries
10.4.5. Military
10.4.6. Other
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America High-Speed Board-to-Board Connectors Market Size and Volume Forecast by Type
10.7.1. <1.00 mm
10.7.2. 1.00 mm-2.00 mm
10.7.3. > 2.00 mm
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America High-Speed Board-to-Board Connectors Demand Share Forecast, 2019-2026
11. Europe High-Speed Board-to-Board Connectors Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe High-Speed Board-to-Board Connectors Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe High-Speed Board-to-Board Connectors Market Size and Volume Forecast by Application
11.4.1. Transportation
11.4.2. Consumer Electronics
11.4.3. Communications
11.4.4. Industries
11.4.5. Military
11.4.6. Other
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe High-Speed Board-to-Board Connectors Market Size and Volume Forecast by Type
11.7.1. <1.00 mm
11.7.2. 1.00 mm-2.00 mm
11.7.3. > 2.00 mm
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe High-Speed Board-to-Board Connectors Demand Share, 2019-2026
12. Asia Pacific High-Speed Board-to-Board Connectors Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific High-Speed Board-to-Board Connectors Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific High-Speed Board-to-Board Connectors Market Size and Volume Forecast by Application
12.4.1. Transportation
12.4.2. Consumer Electronics
12.4.3. Communications
12.4.4. Industries
12.4.5. Military
12.4.6. Other
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific High-Speed Board-to-Board Connectors Market Size and Volume Forecast by Type
12.7.1. <1.00 mm
12.7.2. 1.00 mm-2.00 mm
12.7.3. > 2.00 mm
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific High-Speed Board-to-Board Connectors Demand Share, 2019-2026
13. Middle East & Africa High-Speed Board-to-Board Connectors Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa High-Speed Board-to-Board Connectors Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa High-Speed Board-to-Board Connectors Market Size and Volume Forecast by Application
13.4.1. Transportation
13.4.2. Consumer Electronics
13.4.3. Communications
13.4.4. Industries
13.4.5. Military
13.4.6. Other
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa High-Speed Board-to-Board Connectors Market Size and Volume Forecast by Type
13.7.1. <1.00 mm
13.7.2. 1.00 mm-2.00 mm
13.7.3. > 2.00 mm
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa High-Speed Board-to-Board Connectors Demand Share, 2019-2026
14. Competition Landscape
14.1. Global High-Speed Board-to-Board Connectors Market: Market Share Analysis
14.2. High-Speed Board-to-Board Connectors Distributors and Customers
14.3. High-Speed Board-to-Board Connectors Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. TE Connectivity
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. Samtec
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. Amphenol
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. Molex
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. Fujitsu
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. Hirose Electric
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. JST
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. Joint Admissions Exercise (JAE)
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. Delphi
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. Harting
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. Foxconn
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. ERNI Electronics
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. Kyocera
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. Yamaichi Electronics
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. Advanced Interconnect
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. Unimicron Technology
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
