Latest Update: Impact of current COVID-19 situation has been considered in this report while making the analysis.
Global IC Packaging Market by Type (DIP, SOP, QFP, QFN, BGA, CSP, LGA, WLP, FC, Others), By Application (CIS, MEMS, Others) And By Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast From 2022 To 2030-report

Global IC Packaging Market by Type (DIP, SOP, QFP, QFN, BGA, CSP, LGA, WLP, FC, Others), By Application (CIS, MEMS, Others) And By Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast From 2022 To 2030

Report ID: 139490 3300 Electronics & Semiconductor 377 245 Pages 4.9 (42)
                                          

Industry Growth Insights published a new data on “IC Packaging Market”. The research report is titled “IC Packaging Market research by Types (DIP, SOP, QFP, QFN, BGA, CSP, LGA, WLP, FC, Others), By Applications (CIS, MEMS, Others), By Players/Companies ASE, Amkor, SPIL, STATS ChipPac, Powertech Technology, J-devices, UTAC, JECT, ChipMOS, Chipbond”.

Scope Of The Report

Report Attributes

Report Details

Report Title

IC Packaging Market Research Report

By Type

DIP, SOP, QFP, QFN, BGA, CSP, LGA, WLP, FC, Others

By Application

CIS, MEMS, Others

By Companies

ASE, Amkor, SPIL, STATS ChipPac, Powertech Technology, J-devices, UTAC, JECT, ChipMOS, Chipbond

Regions Covered

North America, Europe, APAC, Latin America, MEA

Base Year

2021

Historical Year

2019 to 2020 (Data from 2010 can be provided as per availability)

Forecast Year

2030

Number of Pages

245

Number of Tables & Figures

172

Customization Available

Yes, the report can be customized as per your need.


Global IC Packaging Industry Outlook


Global IC Packaging Market Report Segments:

The global IC Packaging market is segmented on the basis of:

Types

DIP, SOP, QFP, QFN, BGA, CSP, LGA, WLP, FC, Others

The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.

Applications

CIS, MEMS, Others

The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.

Some of the companies that are profiled in this report are:

  1. ASE
  2. Amkor
  3. SPIL
  4. STATS ChipPac
  5. Powertech Technology
  6. J-devices
  7. UTAC
  8. JECT
  9. ChipMOS
  10. Chipbond

Global IC Packaging Market Overview


Highlights of The IC Packaging Market Report:

  1. The market structure and projections for the coming years.
  2. Drivers, restraints, opportunities, and current trends of market.
  3. Historical data and forecast.
  4. Estimations for the forecast period 2030.
  5. Developments and trends in the market.
  6. By Type:

    1. DIP
    2. SOP
    3. QFP
    4. QFN
    5. BGA
    6. CSP
    7. LGA
    8. WLP
    9. FC
    10. Others
  1. By Application:

    1. CIS
    2. MEMS
    3. Others
  1. Market scenario by region, sub-region, and country.
  2. Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
  3. Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
  4. Government Policies, Macro & Micro economic factors are also included in the report.

We have studied the IC Packaging Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.

Regional Analysis

  • North America
  • Europe
  • Asia Pacific
  • Middle East & Africa
  • Latin America

Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.

The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.

How you may use our products:

  • Correctly Positioning New Products
  • Market Entry Strategies
  • Business Expansion Strategies
  • Consumer Insights
  • Understanding Competition Scenario
  • Product & Brand Management
  • Channel & Customer Management
  • Identifying Appropriate Advertising Appeals

Global IC Packaging Market Statistics

8 Reasons to Buy This Report

  1. Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
  2. Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
  3. Implemented Robust Methodology to Prepare the Report
  4. Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
  5. Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
  6. Provides Information About the Top-winning Strategies Implemented by Industry Players.
  7. In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
  8. Customization of the Report Available

Frequently Asked Questions?


IC packaging is a type of plastic packaging that uses integrated circuits. The ICs are placed on the outside of the package, and they allow manufacturers to create more complex and colorful packages.

Some of the major companies in the ic packaging market are ASE, Amkor, SPIL, STATS ChipPac, Powertech Technology, J-devices, UTAC, JECT, ChipMOS, Chipbond.

                                            
1. Executive Summary

2. Assumptions and Acronyms Used

3. Research Methodology

4. IC Packaging Market Overview
   4.1. Introduction
      4.1.1. Market Taxonomy
      4.1.2. Market Definition
   4.2. Macro-Economic Factors
      4.2.1. Industry Outlook
   4.3. IC Packaging Market Dynamics
      4.3.1. Market Drivers
      4.3.2. Market Restraints
      4.3.3. Opportunity
      4.3.4. Market Trends
   4.4. IC Packaging Market - Supply Chain
   4.5. Global IC Packaging Market Forecast
      4.5.1. IC Packaging Market Size (US$ Mn) and Y-o-Y Growth
      4.5.2. IC Packaging Market Size (000’ Units) and Y-o-Y Growth
      4.5.3. IC Packaging Market Absolute $ Opportunity

5. Global IC Packaging Market Analysis and Forecast by Type
   5.1. Market Trends
   5.2. Introduction
      5.2.1. Basis Point Share (BPS) Analysis by Type
      5.2.2. Y-o-Y Growth Projections by Type
   5.3. IC Packaging Market Size and Volume Forecast by Type
      5.3.1. DIP
      5.3.2. SOP
      5.3.3. QFP
      5.3.4. QFN
      5.3.5. BGA
      5.3.6. CSP
      5.3.7. LGA
      5.3.8. WLP
      5.3.9. FC
      5.3.10.   Others
   5.4. Absolute $ Opportunity Assessment by Type
   5.5. Market Attractiveness/Growth Potential Analysis by Type

6. Global IC Packaging Market Analysis and Forecast by Application
   6.1. Market Trends
   6.2. Introduction
      6.2.1. Basis Point Share (BPS) Analysis by Application
      6.2.2. Y-o-Y Growth Projections by Application
   6.3. IC Packaging Market Size and Volume Forecast by Application
      6.3.1. CIS
      6.3.2. MEMS
      6.3.3. Others
   6.4. Absolute $ Opportunity Assessment by Application
   6.5. Market Attractiveness/Growth Potential Analysis by Application

7. Global IC Packaging Market Analysis and Forecast by Sales Channel
   7.1. Market Trends
   7.2. Introduction
      7.2.1. Basis Point Share (BPS) Analysis by Sales Channel 
      7.2.2. Y-o-Y Growth Projections by Sales Channel
   7.3. IC Packaging Market Size and Volume Forecast by Sales Channel 
      7.3.1. Manufacturer/Distributor/Service Provider
      7.3.2. Aftermarket
   7.4. Absolute $ Opportunity Assessment by Sales Channel
   7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel

8. Global IC Packaging Market Analysis and Forecast by Region
   8.1. Market Trends
   8.2. Introduction
      8.2.1. Basis Point Share (BPS) Analysis by Region
      8.2.2. Y-o-Y Growth Projections by Region
   8.3. IC Packaging Market Size and Volume Forecast by Region
      8.3.1. North America
      8.3.2. Latin America
      8.3.3. Europe
      8.3.4. Asia Pacific
      8.3.5. Middle East and Africa (MEA)
   8.4. Absolute $ Opportunity Assessment by Region
   8.5. Market Attractiveness/Growth Potential Analysis by Region
   8.6. Global IC Packaging Demand Share Forecast, 2019-2029

9. North America IC Packaging Market Analysis and Forecast
   9.1. Introduction
      9.1.1. Basis Point Share (BPS) Analysis by Country
      9.1.2. Y-o-Y Growth Projections by Country
   9.2. North America IC Packaging Market Size and Volume Forecast by Country
      9.2.1. U.S.
      9.2.2. Canada
   9.3. Absolute $ Opportunity Assessment by Country
   9.4. North America IC Packaging Market Size and Volume Forecast by Application
      9.4.1. CIS
      9.4.2. MEMS
      9.4.3. Others
   9.5. Basis Point Share (BPS) Analysis by Application
   9.6. Y-o-Y Growth Projections by Application
   9.7. North America IC Packaging Market Size and Volume Forecast by Type
      9.7.1. DIP
      9.7.2. SOP
      9.7.3. QFP
      9.7.4. QFN
      9.7.5. BGA
      9.7.6. CSP
      9.7.7. LGA
      9.7.8. WLP
      9.7.9. FC
      9.7.10.   Others
   9.8. Basis Point Share (BPS) Analysis by Type
   9.9. Y-o-Y Growth Projections by Type
   9.10. Market Attractiveness/Growth Potential Analysis
      9.10.1. By Country
      9.10.2. By Product Type
      9.10.3. By Application
      9.10.4. By Sales Channel
   9.11. North America IC Packaging Demand Share Forecast, 2019-2029

10. Latin America IC Packaging Market Analysis and Forecast
   10.1. Introduction
      10.1.1. Basis Point Share (BPS) Analysis by Country
      10.1.2. Y-o-Y Growth Projections by Country
      10.1.3. Latin America Average Pricing Analysis
   10.2. Latin America IC Packaging Market Size and Volume Forecast by Country
      10.2.1. Brazil
      10.2.2. Mexico
      10.2.3. Rest of Latin America
   10.3. Absolute $ Opportunity Assessment by Country
   10.4. Latin America IC Packaging Market Size and Volume Forecast by Application
      10.4.1. CIS
      10.4.2. MEMS
      10.4.3. Others
   10.5. Basis Point Share (BPS) Analysis by Application
   10.6. Y-o-Y Growth Projections by Application
   10.7. Latin America IC Packaging Market Size and Volume Forecast by Type
      10.7.1. DIP
      10.7.2. SOP
      10.7.3. QFP
      10.7.4. QFN
      10.7.5. BGA
      10.7.6. CSP
      10.7.7. LGA
      10.7.8. WLP
      10.7.9. FC
      10.7.10.   Others
   10.8. Basis Point Share (BPS) Analysis by Type
   10.9. Y-o-Y Growth Projections by Type
   10.10. Market Attractiveness/Growth Potential Analysis
      10.10.1. By Country
      10.10.2. By Product Type
      10.10.3. By Application
      10.10.4. By Sales Channel
   10.11. Latin America IC Packaging Demand Share Forecast, 2019-2029

11. Europe IC Packaging Market Analysis and Forecast
   11.1. Introduction
      11.1.1. Basis Point Share (BPS) Analysis by Country
      11.1.2. Y-o-Y Growth Projections by Country
      11.1.3. Europe Average Pricing Analysis
   11.2. Europe IC Packaging Market Size and Volume Forecast by Country
      11.2.1. Germany
      11.2.2. France
      11.2.3. Italy
      11.2.4. U.K.
      11.2.5. Spain
      11.2.6. Russia
      11.2.7. Rest of Europe
   11.3. Absolute $ Opportunity Assessment by Country
   11.4. Europe IC Packaging Market Size and Volume Forecast by Application
      11.4.1. CIS
      11.4.2. MEMS
      11.4.3. Others
   11.5. Basis Point Share (BPS) Analysis by Application
   11.6. Y-o-Y Growth Projections by Application
   11.7. Europe IC Packaging Market Size and Volume Forecast by Type
      11.7.1. DIP
      11.7.2. SOP
      11.7.3. QFP
      11.7.4. QFN
      11.7.5. BGA
      11.7.6. CSP
      11.7.7. LGA
      11.7.8. WLP
      11.7.9. FC
      11.7.10.   Others
   11.8. Basis Point Share (BPS) Analysis by Typ
   11.9. Y-o-Y Growth Projections by Type
   11.10. Market Attractiveness/Growth Potential Analysis
      11.10.1. By Country
      11.10.2. By Product Type
      11.10.3. By Application
      11.10.4. By Sales Channel
   11.11. Europe IC Packaging Demand Share, 2019-2029

12. Asia Pacific IC Packaging Market Analysis and Forecast
   12.1. Introduction
      12.1.1. Basis Point Share (BPS) Analysis by Country
      12.1.2. Y-o-Y Growth Projections by Country
      12.1.3. Asia Pacific Average Pricing Analysis
   12.2. Asia Pacific IC Packaging Market Size and Volume Forecast by Country
      12.2.1. China
      12.2.2. Japan
      12.2.3. South Korea
      12.2.4. India
      12.2.5. Australia
      12.2.6. Rest of Asia Pacific (APAC)
   12.3. Absolute $ Opportunity Assessment by Country
   12.4. Asia Pacific IC Packaging Market Size and Volume Forecast by Application
      12.4.1. CIS
      12.4.2. MEMS
      12.4.3. Others
   12.5. Basis Point Share (BPS) Analysis by Application
   12.6. Y-o-Y Growth Projections by Application
   12.7. Asia Pacific IC Packaging Market Size and Volume Forecast by Type
      12.7.1. DIP
      12.7.2. SOP
      12.7.3. QFP
      12.7.4. QFN
      12.7.5. BGA
      12.7.6. CSP
      12.7.7. LGA
      12.7.8. WLP
      12.7.9. FC
      12.7.10.   Others
   12.8. Basis Point Share (BPS) Analysis by Type
   12.9. Y-o-Y Growth Projections by Type
   12.10. Market Attractiveness/Growth Potential Analysis
      12.10.1. By Country
      12.10.2. By Product Type
      12.10.3. By Application
      12.10.4. By Sales Channel
   12.11. Asia Pacific IC Packaging Demand Share, 2019-2029

13. Middle East & Africa IC Packaging Market Analysis and Forecast
   13.1. Introduction
      13.1.1. Basis Point Share (BPS) Analysis by Country
      13.1.2. Y-o-Y Growth Projections by Country
      13.1.3. Asia Pacific Average Pricing Analysis
   13.2. Middle East & Africa IC Packaging Market Size and Volume Forecast by Country
      13.2.1. Saudi Arabia
      13.2.2. South Africa
      13.2.3. UAE
      13.2.4. Rest of Middle East & Africa (MEA)
   13.3. Absolute $ Opportunity Assessment by Country
   13.4. Middle East & Africa IC Packaging Market Size and Volume Forecast by Application
      13.4.1. CIS
      13.4.2. MEMS
      13.4.3. Others
   13.5. Basis Point Share (BPS) Analysis by Application
   13.6. Y-o-Y Growth Projections by Application
   13.7. Middle East & Africa IC Packaging Market Size and Volume Forecast by Type
      13.7.1. DIP
      13.7.2. SOP
      13.7.3. QFP
      13.7.4. QFN
      13.7.5. BGA
      13.7.6. CSP
      13.7.7. LGA
      13.7.8. WLP
      13.7.9. FC
      13.7.10.   Others
   13.8. Basis Point Share (BPS) Analysis by Type
   13.9. Y-o-Y Growth Projections by Type
   13.10. Market Attractiveness/Growth Potential Analysis
      13.10.1. By Country
      13.10.2. By Product Type
      13.10.3. By Application
      13.10.4. By Sales Channel
   13.11. Middle East & Africa IC Packaging Demand Share, 2019-2029

14. Competition Landscape
   14.1. Global IC Packaging Market: Market Share Analysis
   14.2. IC Packaging Distributors and Customers
   14.3. IC Packaging Market: Competitive Dashboard
   14.4. Company Profiles (Details – Overview, Financials, Developments, Strategy) 
      14.4.1. ASE
         14.4.1.1. Overview
         14.4.1.2. Financials
         14.4.1.3. Developments
         14.4.1.4. Strategic Outlook
      14.4.2. Amkor
         14.4.2.1. Overview
         14.4.2.2. Financials
         14.4.2.3. Developments
         14.4.2.4. Strategic Outlook
      14.4.3. SPIL
         14.4.3.1. Overview
         14.4.3.2. Financials
         14.4.3.3. Developments
         14.4.3.4. Strategic Outlook
      14.4.4. STATS ChipPac
         14.4.4.1. Overview
         14.4.4.2. Financials
         14.4.4.3. Developments
         14.4.4.4. Strategic Outlook
      14.4.5. Powertech Technology
         14.4.5.1. Overview
         14.4.5.2. Financials
         14.4.5.3. Developments
         14.4.5.4. Strategic Outlook
      14.4.6. J-devices
         14.4.6.1. Overview
         14.4.6.2. Financials
         14.4.6.3. Developments
         14.4.6.4. Strategic Outlook
      14.4.7. UTAC
         14.4.7.1. Overview
         14.4.7.2. Financials
         14.4.7.3. Developments
         14.4.7.4. Strategic Outlook
      14.4.8. JECT
         14.4.8.1. Overview
         14.4.8.2. Financials
         14.4.8.3. Developments
         14.4.8.4. Strategic Outlook
      14.4.9. ChipMOS
         14.4.9.1. Overview
         14.4.9.2. Financials
         14.4.9.3. Developments
         14.4.9.4. Strategic Outlook
      14.4.10. Chipbond
         14.4.10.1. Overview
         14.4.10.2. Financials
         14.4.10.3. Developments
         14.4.10.4. Strategic Outlook
      14.4.11. COMPANY 11
         14.4.11.1. Overview
         14.4.11.2. Financials
         14.4.11.3. Developments
         14.4.11.4. Strategic Outlook
      14.4.12. COMPANY 12
         14.4.12.1. Overview
         14.4.12.2. Financials
         14.4.12.3. Developments
         14.4.12.4. Strategic Outlook
      14.4.13. COMPANY 13
         14.4.13.1. Overview
         14.4.13.2. Financials
         14.4.13.3. Developments
         14.4.13.4. Strategic Outlook
      14.4.14. COMPANY 14
         14.4.14.1. Overview
         14.4.14.2. Financials
         14.4.14.3. Developments
         14.4.14.4. Strategic Outlook
      14.4.15. COMPANY 15
         14.4.15.1. Overview
         14.4.15.2. Financials
         14.4.15.3. Developments
         14.4.15.4. Strategic Outlook
      14.4.16. COMPANY 16
         14.4.16.1. Overview
         14.4.16.2. Financials
         14.4.16.3. Developments
         14.4.16.4. Strategic Outlook
      14.4.17. COMPANY 17
         14.4.17.1. Overview
         14.4.17.2. Financials
         14.4.17.3. Developments
         14.4.17.4. Strategic Outlook
      14.4.18. COMPANY 18
         14.4.18.1. Overview
         14.4.18.2. Financials
         14.4.18.3. Developments
         14.4.18.4. Strategic Outlook
      14.4.19. COMPANY 19
         14.4.19.1. Overview
         14.4.19.2. Financials
         14.4.19.3. Developments
         14.4.19.4. Strategic Outlook
      14.4.20. COMPANY 20
         14.4.20.1. Overview
         14.4.20.2. Financials
         14.4.20.3. Developments
         14.4.20.4. Strategic Outlook

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