Market Overview:
The global IC substrate packaging market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for miniaturization and higher performance in electronic devices, and the growing trend of using advanced packaging technologies for semiconductor devices. The metal segment is expected to hold the largest share of the global IC substrate packaging market by type during the forecast period. This can be attributed to its high thermal conductivity, low cost, and ease of manufacturing. The ceramics segment is projected to grow at a highest CAGR during the forecast period owing to its properties such as high strength, hardness, wear resistance, and insulation against heat and electricity. By application, analog circuits are estimated to account for majority share of global IC substrate packaging market by 2030 end followed by digital circuits segments respectively .
Product Definition:
An IC substrate is a type of packaging that holds an integrated circuit (IC) in place. It is typically made from a material like ceramic, glass, or silicon and has various features that help protect the IC and ensure its proper functioning. The most common type of IC substrate packaging is the chip carrier, which consists of a flat base with metal pins extending from it to hold the IC in place.
Metal:
Metal is an integral part of integrated circuit (IC) substrate packaging market. It has been observed that metal leads to better performance and reliability in ICs as compared to plastic & ceramic materials. In addition, it also helps in providing higher thermal conductivity which further improves the overall efficiency of the package.
Ceramics:
Ceramics are crystalline, inorganic and non-metals that are made from silica (SiO2) and alumina (Al2O3). They have properties such as high thermal stability, electrical insulation, mechanical strength and chemical inertness. Ceramic materials find application in electronics & telecommunication equipment manufacturing industry owing to their low power consumption characteristics. The growth of the global electronics market is expected to drive the demand for IC substrate packaging products over the forecast period.
Application Insights:
The analog circuit application segment accounted for the largest revenue share in 2016 and is projected to continue its dominance over the forecast period. Analog circuits are used in various applications such as mobile phones, communication devices, automotive electronics, and other consumer electronics products. These products need a large number of ICs; hence they require small packages to fit more components inside.
Digital circuit packaging is expected to grow at a significant rate over the forecast period owing to increasing demand for high-tech products from various end-use industries such as telecommunication & IT, medical & healthcare equipment manufacturing sectors. Digital circuits are used in computers (laptop/notebook etc), storage devices (such as hard disk drives), home appliances (such as refrigerators or washing machines) and other electronic gadgets that use microcontrollers or microprocessors chipsets respectively.
Regional Analysis:
Asia Pacific dominated the global market in 2017 and is expected to continue its dominance over the forecast period. The growth of this region can be attributed to rising demand from end-use industries such as telecommunication, computing, medical, military & aerospace. China accounts for a major share in Asia Pacific due to its large electronics industry. Moreover, India's electronics sector is also growing at a rapid pace owing to low labor costs and availability of skilled workforce in that country.
The North American market was valued at USD X billion in 2017 and is projected to grow at a CAGR of XX% from 2018 till 2030 owing high demand from consumer electronics along with other end-use sectors such as automotive and defense equipment manufacturing. The U.S.
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Rising demand from the automotive and telecommunication sectors
- Growing popularity of 3D IC packaging technology
- Proliferation of advanced packaging technologies such as 2.5D and 3D ICs
- Emergence of new applications such as Internet of Things (IoT) and 5G
Scope Of The Report
Report Attributes
Report Details
Report Title
IC Substrate Packaging Market Research Report
By Type
Metal, Ceramics, Glass
By Application
Analog Circuits, Digital Circuits, RF Circuit, Sensor, Others
By Companies
Ibiden, STATS ChipPAC, Linxens, Toppan Photomasks, AMKOR, ASE, Cadence Design Systems, Atotech Deutschland GmbH, SHINKO
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
238
Number of Tables & Figures
167
Customization Available
Yes, the report can be customized as per your need.
Global IC Substrate Packaging Market Report Segments:
The global IC Substrate Packaging market is segmented on the basis of:
Types
Metal, Ceramics, Glass
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Analog Circuits, Digital Circuits, RF Circuit, Sensor, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Ibiden
- STATS ChipPAC
- Linxens
- Toppan Photomasks
- AMKOR
- ASE
- Cadence Design Systems
- Atotech Deutschland GmbH
- SHINKO
Highlights of The IC Substrate Packaging Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Metal
- Ceramics
- Glass
- By Application:
- Analog Circuits
- Digital Circuits
- RF Circuit
- Sensor
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the IC Substrate Packaging Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
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- Product & Brand Management
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
IC substrate packaging is a type of electronic packaging that uses integrated circuit boards as the primary component. The IC substrate packaging process involves placing an IC board into a protective housing, and then adhering the housing to a printed circuit board (PCB). This type of packaging is used in applications such as mobile phones, tablets, gaming consoles, and other consumer electronics.
Some of the major players in the ic substrate packaging market are Ibiden, STATS ChipPAC, Linxens, Toppan Photomasks, AMKOR, ASE, Cadence Design Systems, Atotech Deutschland GmbH, SHINKO.
The ic substrate packaging market is expected to register a CAGR of 6.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. IC Substrate Packaging Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. IC Substrate Packaging Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. IC Substrate Packaging Market - Supply Chain
4.5. Global IC Substrate Packaging Market Forecast
4.5.1. IC Substrate Packaging Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. IC Substrate Packaging Market Size (000 Units) and Y-o-Y Growth
4.5.3. IC Substrate Packaging Market Absolute $ Opportunity
5. Global IC Substrate Packaging Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. IC Substrate Packaging Market Size and Volume Forecast by Type
5.3.1. Metal
5.3.2. Ceramics
5.3.3. Glass
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global IC Substrate Packaging Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. IC Substrate Packaging Market Size and Volume Forecast by Application
6.3.1. Analog Circuits
6.3.2. Digital Circuits
6.3.3. RF Circuit
6.3.4. Sensor
6.3.5. Others
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global IC Substrate Packaging Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. IC Substrate Packaging Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global IC Substrate Packaging Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. IC Substrate Packaging Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global IC Substrate Packaging Demand Share Forecast, 2019-2026
9. North America IC Substrate Packaging Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America IC Substrate Packaging Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America IC Substrate Packaging Market Size and Volume Forecast by Application
9.4.1. Analog Circuits
9.4.2. Digital Circuits
9.4.3. RF Circuit
9.4.4. Sensor
9.4.5. Others
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America IC Substrate Packaging Market Size and Volume Forecast by Type
9.7.1. Metal
9.7.2. Ceramics
9.7.3. Glass
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America IC Substrate Packaging Demand Share Forecast, 2019-2026
10. Latin America IC Substrate Packaging Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America IC Substrate Packaging Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America IC Substrate Packaging Market Size and Volume Forecast by Application
10.4.1. Analog Circuits
10.4.2. Digital Circuits
10.4.3. RF Circuit
10.4.4. Sensor
10.4.5. Others
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America IC Substrate Packaging Market Size and Volume Forecast by Type
10.7.1. Metal
10.7.2. Ceramics
10.7.3. Glass
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America IC Substrate Packaging Demand Share Forecast, 2019-2026
11. Europe IC Substrate Packaging Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe IC Substrate Packaging Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe IC Substrate Packaging Market Size and Volume Forecast by Application
11.4.1. Analog Circuits
11.4.2. Digital Circuits
11.4.3. RF Circuit
11.4.4. Sensor
11.4.5. Others
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe IC Substrate Packaging Market Size and Volume Forecast by Type
11.7.1. Metal
11.7.2. Ceramics
11.7.3. Glass
11.8. Basis Point Share (BPS) nalysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe IC Substrate Packaging Demand Share, 2019-2026
12. Asia Pacific IC Substrate Packaging Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific IC Substrate Packaging Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific IC Substrate Packaging Market Size and Volume Forecast by Application
12.4.1. Analog Circuits
12.4.2. Digital Circuits
12.4.3. RF Circuit
12.4.4. Sensor
12.4.5. Others
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific IC Substrate Packaging Market Size and Volume Forecast by Type
12.7.1. Metal
12.7.2. Ceramics
12.7.3. Glass
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific IC Substrate Packaging Demand Share, 2019-2026
13. Middle East & Africa IC Substrate Packaging Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa IC Substrate Packaging Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa IC Substrate Packaging Market Size and Volume Forecast by Application
13.4.1. Analog Circuits
13.4.2. Digital Circuits
13.4.3. RF Circuit
13.4.4. Sensor
13.4.5. Others
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa IC Substrate Packaging Market Size and Volume Forecast by Type
13.7.1. Metal
13.7.2. Ceramics
13.7.3. Glass
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa IC Substrate Packaging Demand Share, 2019-2026
14. Competition Landscape
14.1. Global IC Substrate Packaging Market: Market Share Analysis
14.2. IC Substrate Packaging Distributors and Customers
14.3. IC Substrate Packaging Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. Ibiden
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. STATS ChipPAC
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. Linxens
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. Toppan Photomasks
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. AMKOR
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. ASE
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. Cadence Design Systems
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. Atotech Deutschland GmbH
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. SHINKO
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. COMPANY 10
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. COMPANY 11
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. COMPANY 12
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. COMPANY 13
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. COMPANY 14
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. COMPANY 15
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. COMPANY 16
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook