Market Overview:
The global IC trays market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for electronic products and electronic parts, and the growing trend of miniaturization in electronics products. In terms of type, the plastic IC trays segment is expected to grow at a higher CAGR than the metal IC trays segment during the forecast period. This can be attributed to their low cost and lightweight nature as compared to metal IC trays. In terms of application, the electronic products segment is expected to account for a larger share of the global IC trays market than other segments duringthe forecast period.
Product Definition:
IC trays are small, rectangular containers used to store and organize integrated circuits (ICs). They have a number of pins or leads on each side that allow them to be plugged into a circuit board. IC trays can be made from a variety of materials, including plastic, metal, or ceramic.
The main purpose of an IC tray is to provide a safe and secure place for ICs to be stored. They also make it easy to transport and install the chips in electronic devices.
Plastic IC Trays:
Plastic IC trays are used to hold and protect integrated circuits during the manufacturing process. They are available in different forms such as plastic sheets, tubes, and trays. The product is widely used by original design manufacturers (ODMs) or OEMs for packaging of electronic products including microcontrollers, I2C &I3C modules among others in their mass production processes.
Metal IC Trays:
Metal IC trays are used in the packaging of integrated circuits to protect them from Electrostatic Dissipation (ESD), Electro Magnetic Interference (EMI) and Electromagnetic Pulse (EMP). Metal IC trays also help in providing mechanical strength, thermal conductivity, and electrical connectivity to the packaged device. The primary function of metal IC trays is to provide a protective shield around each chip as it is placed into its package.
Application Insights:
Electronic products application segment accounted for the largest share of over 60.0% in 2017. The increasing use of IC trays in electronic devices and other components is expected to drive the demand for IC trays over the forecast period. Electronic parts are used in various applications such as mobile phones, laptops, cameras, microwaves among others which is expected to propel market growth during the forecast period.
The medical equipment application segment was valued at USD 636.1 million in 2017 owing to rising demand from hospitals and healthcare centers for using advanced technology products while handling medical emergencies among other health-related issues that require attention with utmost precision and care during treatment procedures resulting into increased product usage across healthcare facilities thereby driving market growth on a positive note during the forecast period 2018 - 2030 ¢â‚¬â€œ2030 ¢â‚¬ >.
Regional Analysis:
Asia Pacific dominated the global market in 2017 and is expected to continue its dominance over the forecast period. The growth of this region can be attributed to rising investments by foreign players in China, India, South Korea, and Taiwan. In addition, increasing demand for IC trays from various end-use industries such as industrial electronics & automation, computing & laptops is anticipated to drive regional market growth over the forecast period.
The Asia Pacific region has witnessed a significant rise in electronic products manufacturing companies owing to low labor costs coupled with easy access to raw materials and components supply.
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Rising trend of using printed circuit boards in various applications
- Growing popularity of 3D printing technology
- Proliferation of the Internet-of-Things (IoT) and 5G networks
- Emergence of new materials and technologies
Scope Of The Report
Report Attributes
Report Details
Report Title
IC Trays Market Research Report
By Type
Plastic IC Trays, Metal IC Trays
By Application
Electronic Products, Electronic Parts, Others
By Companies
SHINON, TOMOE Engineering, HWA SHU, PERCO Plastics, Mishima Kosan Co.,Ltd., Kostat, ITW ECPS, Daewon, Hiner Advanced Materials, RH Murphy Company, IwakiCo,. LTD, Action Circuits, ePAK, YOUNGJIN TECH, Shiima Electronics, Peak International, Sunrise, Entegris, ASE Group
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
249
Number of Tables & Figures
175
Customization Available
Yes, the report can be customized as per your need.
Global IC Trays Market Report Segments:
The global IC Trays market is segmented on the basis of:
Types
Plastic IC Trays, Metal IC Trays
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Electronic Products, Electronic Parts, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- SHINON
- TOMOE Engineering
- HWA SHU
- PERCO Plastics
- Mishima Kosan Co.,Ltd.
- Kostat
- ITW ECPS
- Daewon
- Hiner Advanced Materials
- RH Murphy Company
- IwakiCo,. LTD
- Action Circuits
- ePAK
- YOUNGJIN TECH
- Shiima Electronics
- Peak International
- Sunrise
- Entegris
- ASE Group
Highlights of The IC Trays Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Plastic IC Trays
- Metal IC Trays
- By Application:
- Electronic Products
- Electronic Parts
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the IC Trays Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
IC Trays are a type of computer memory that can be inserted into a motherboard to improve performance.
Some of the major players in the ic trays market are SHINON, TOMOE Engineering, HWA SHU, PERCO Plastics, Mishima Kosan Co.,Ltd., Kostat, ITW ECPS, Daewon, Hiner Advanced Materials, RH Murphy Company, IwakiCo,. LTD, Action Circuits, ePAK, YOUNGJIN TECH, Shiima Electronics, Peak International, Sunrise, Entegris, ASE Group.
The ic trays market is expected to register a CAGR of 5.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. IC Trays Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. IC Trays Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. IC Trays Market - Supply Chain
4.5. Global IC Trays Market Forecast
4.5.1. IC Trays Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. IC Trays Market Size (000 Units) and Y-o-Y Growth
4.5.3. IC Trays Market Absolute $ Opportunity
5. Global IC Trays Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. IC Trays Market Size and Volume Forecast by Type
5.3.1. Plastic IC Trays
5.3.2. Metal IC Trays
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global IC Trays Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. IC Trays Market Size and Volume Forecast by Application
6.3.1. Electronic Products
6.3.2. Electronic Parts
6.3.3. Others
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global IC Trays Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. IC Trays Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global IC Trays Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. IC Trays Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global IC Trays Demand Share Forecast, 2019-2026
9. North America IC Trays Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America IC Trays Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America IC Trays Market Size and Volume Forecast by Application
9.4.1. Electronic Products
9.4.2. Electronic Parts
9.4.3. Others
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America IC Trays Market Size and Volume Forecast by Type
9.7.1. Plastic IC Trays
9.7.2. Metal IC Trays
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America IC Trays Demand Share Forecast, 2019-2026
10. Latin America IC Trays Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America IC Trays Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America IC Trays Market Size and Volume Forecast by Application
10.4.1. Electronic Products
10.4.2. Electronic Parts
10.4.3. Others
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America IC Trays Market Size and Volume Forecast by Type
10.7.1. Plastic IC Trays
10.7.2. Metal IC Trays
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America IC Trays Demand Share Forecast, 2019-2026
11. Europe IC Trays Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe IC Trays Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe IC Trays Market Size and Volume Forecast by Application
11.4.1. Electronic Products
11.4.2. Electronic Parts
11.4.3. Others
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe IC Trays Market Size and Volume Forecast by Type
11.7.1. Plastic IC Trays
11.7.2. Metal IC Trays
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe IC Trays Demand Share, 2019-2026
12. Asia Pacific IC Trays Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific IC Trays Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific IC Trays Market Size and Volume Forecast by Application
12.4.1. Electronic Products
12.4.2. Electronic Parts
12.4.3. Others
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific IC Trays Market Size and Volume Forecast by Type
12.7.1. Plastic IC Trays
12.7.2. Metal IC Trays
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific IC Trays Demand Share, 2019-2026
13. Middle East & Africa IC Trays Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa IC Trays Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa IC Trays Market Size and Volume Forecast by Application
13.4.1. Electronic Products
13.4.2. Electronic Parts
13.4.3. Others
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa IC Trays Market Size and Volume Forecast by Type
13.7.1. Plastic IC Trays
13.7.2. Metal IC Trays
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa IC Trays Demand Share, 2019-2026
14. Competition Landscape
14.1. Global IC Trays Market: Market Share Analysis
14.2. IC Trays Distributors and Customers
14.3. IC Trays Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. SHINON
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. TOMOE Engineering
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. HWA SHU
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. PERCO Plastics
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. Mishima Kosan Co.,Ltd.
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. Kostat
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. ITW ECPS
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. Daewon
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. Hiner Advanced Materials
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. RH Murphy Company
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. IwakiCo,. LTD
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. Action Circuits
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. ePAK
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. YOUNGJIN TECH
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. Shiima Electronics
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. Peak International
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. Sunrise
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. Entegris
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. ASE Group
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
