Latest Update: Impact of current COVID-19 situation has been considered in this report while making the analysis.
Global Integrated Circuit Packaging Market by Type (Metal, Ceramics, Glass), By Application (Analog Circuits, Digital Circuits, RF Circuits, Sensors, Others) And By Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast From 2022 To 2030-report

Global Integrated Circuit Packaging Market by Type (Metal, Ceramics, Glass), By Application (Analog Circuits, Digital Circuits, RF Circuits, Sensors, Others) And By Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast From 2022 To 2030

Report ID: 131781 3300 Electronics & Semiconductor 377 237 Pages 4.6 (42)
                                          

The global integrated circuit packaging market is expected to grow at a CAGR of 5.5% during the forecast period, from 2021 to 2030. The market is driven by the increasing demand for high-performance and low-power integrated circuits in various applications such as analog circuits, digital circuits, RF circuits, and sensors. The increasing demand for high-performance and low-power integrated circuits in various applications such as analog circuits, digital circuits, RF circuits, and sensors is driving the growth of this market. The metal type segment accounted for the largest share of the global integrated circuit packaging market in 2018 owing to its ability to provide better thermal conductivity than other types of materials used in IC packaging. Ceramics type segment accounted for a significant share due to its ability to provide better thermal conductivity than other types of materials used in IC packaging. Glass type segment accounted for a significant share due to its ability by providing better thermal conductivity than other types of materials used in IC packaging.

Some Of The Growth Factors Of This Market:

  1. The increasing demand for smartphones and tablets has led to an increase in the number of ICs being used in these devices, which will also drive the IC packaging market growth.
  2. The increasing need for high-speed data transmission and storage is driving the need for faster and more efficient chips, which will also drive the IC packaging market growth.
  3. The growing use of IoT devices such as smart meters, smart homes, and wearables are driving the need for more efficient chips that can handle large amounts of data.
  4. Increasing investments by governments in research & development activities related to semiconductors are expected to fuel this market.

Industry Growth Insights published a new data on “Integrated Circuit Packaging Market”. The research report is titled “Integrated Circuit Packaging Market research by Types (Metal, Ceramics, Glass), By Applications (Analog Circuits, Digital Circuits, RF Circuits, Sensors, Others), By Players/Companies Ibiden, STATS ChipPAC, Linxens, Toppan Photomasks, AMKOR, ASE, Cadence Design Systems, Atotech Deutschland GmbH, SHINKO”.

Scope Of The Report

Report Attributes

Report Details

Report Title

Integrated Circuit Packaging Market Research Report

By Type

Metal, Ceramics, Glass

By Application

Analog Circuits, Digital Circuits, RF Circuits, Sensors, Others

By Companies

Ibiden, STATS ChipPAC, Linxens, Toppan Photomasks, AMKOR, ASE, Cadence Design Systems, Atotech Deutschland GmbH, SHINKO

Regions Covered

North America, Europe, APAC, Latin America, MEA

Base Year

2021

Historical Year

2019 to 2020 (Data from 2010 can be provided as per availability)

Forecast Year

2030

Number of Pages

237

Number of Tables & Figures

166

Customization Available

Yes, the report can be customized as per your need.


Global Integrated Circuit Packaging Industry Outlook


Global Integrated Circuit Packaging Market Report Segments:

The global Integrated Circuit Packaging market is segmented on the basis of:

Types

Metal, Ceramics, Glass

The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.

Applications

Analog Circuits, Digital Circuits, RF Circuits, Sensors, Others

The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.

Some of the companies that are profiled in this report are:

  1. Ibiden
  2. STATS ChipPAC
  3. Linxens
  4. Toppan Photomasks
  5. AMKOR
  6. ASE
  7. Cadence Design Systems
  8. Atotech Deutschland GmbH
  9. SHINKO

Global Integrated Circuit Packaging Market Overview


Highlights of The Integrated Circuit Packaging Market Report:

  1. The market structure and projections for the coming years.
  2. Drivers, restraints, opportunities, and current trends of market.
  3. Historical data and forecast.
  4. Estimations for the forecast period 2030.
  5. Developments and trends in the market.
  6. By Type:

    1. Metal
    2. Ceramics
    3. Glass
  1. By Application:

    1. Analog Circuits
    2. Digital Circuits
    3. RF Circuits
    4. Sensors
    5. Others
  1. Market scenario by region, sub-region, and country.
  2. Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
  3. Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
  4. Government Policies, Macro & Micro economic factors are also included in the report.

We have studied the Integrated Circuit Packaging Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.

Regional Analysis

  • North America
  • Europe
  • Asia Pacific
  • Middle East & Africa
  • Latin America

Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.

The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.

How you may use our products:

  • Correctly Positioning New Products
  • Market Entry Strategies
  • Business Expansion Strategies
  • Consumer Insights
  • Understanding Competition Scenario
  • Product & Brand Management
  • Channel & Customer Management
  • Identifying Appropriate Advertising Appeals

Global Integrated Circuit Packaging Market Statistics

8 Reasons to Buy This Report

  1. Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
  2. Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
  3. Implemented Robust Methodology to Prepare the Report
  4. Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
  5. Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
  6. Provides Information About the Top-winning Strategies Implemented by Industry Players.
  7. In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
  8. Customization of the Report Available
                                            
1. Executive Summary

2. Assumptions and Acronyms Used

3. Research Methodology

4. Integrated Circuit Packaging Market Overview
   4.1. Introduction
      4.1.1. Market Taxonomy
      4.1.2. Market Definition
   4.2. Macro-Economic Factors
      4.2.1. Industry Outlook
   4.3. Integrated Circuit Packaging Market Dynamics
      4.3.1. Market Drivers
      4.3.2. Market Restraints
      4.3.3. Opportunity
      4.3.4. Market Trends
   4.4. Integrated Circuit Packaging Market - Supply Chain
   4.5. Global Integrated Circuit Packaging Market Forecast
      4.5.1. Integrated Circuit Packaging Market Size (US$ Mn) and Y-o-Y Growth
      4.5.2. Integrated Circuit Packaging Market Size (000’ Units) and Y-o-Y Growth
      4.5.3. Integrated Circuit Packaging Market Absolute $ Opportunity

5. Global Integrated Circuit Packaging Market Analysis and Forecast by Type
   5.1. Market Trends
   5.2. Introduction
      5.2.1. Basis Point Share (BPS) Analysis by Type
      5.2.2. Y-o-Y Growth Projections by Type
   5.3. Integrated Circuit Packaging Market Size and Volume Forecast by Type
      5.3.1. Metal
      5.3.2. Ceramics
      5.3.3. Glass
   5.4. Absolute $ Opportunity Assessment by Type
   5.5. Market Attractiveness/Growth Potential Analysis by Type

6. Global Integrated Circuit Packaging Market Analysis and Forecast by Application
   6.1. Market Trends
   6.2. Introduction
      6.2.1. Basis Point Share (BPS) Analysis by Application
      6.2.2. Y-o-Y Growth Projections by Application
   6.3. Integrated Circuit Packaging Market Size and Volume Forecast by Application
      6.3.1. Analog Circuits
      6.3.2. Digital Circuits
      6.3.3. RF Circuits
      6.3.4. Sensors
      6.3.5. Others
   6.4. Absolute $ Opportunity Assessment by Application
   6.5. Market Attractiveness/Growth Potential Analysis by Application

7. Global Integrated Circuit Packaging Market Analysis and Forecast by Sales Channel
   7.1. Market Trends
   7.2. Introduction
      7.2.1. Basis Point Share (BPS) Analysis by Sales Channel 
      7.2.2. Y-o-Y Growth Projections by Sales Channel
   7.3. Integrated Circuit Packaging Market Size and Volume Forecast by Sales Channel 
      7.3.1. Manufacturer/Distributor/Service Provider
      7.3.2. Aftermarket
   7.4. Absolute $ Opportunity Assessment by Sales Channel
   7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel

8. Global Integrated Circuit Packaging Market Analysis and Forecast by Region
   8.1. Market Trends
   8.2. Introduction
      8.2.1. Basis Point Share (BPS) Analysis by Region
      8.2.2. Y-o-Y Growth Projections by Region
   8.3. Integrated Circuit Packaging Market Size and Volume Forecast by Region
      8.3.1. North America
      8.3.2. Latin America
      8.3.3. Europe
      8.3.4. Asia Pacific
      8.3.5. Middle East and Africa (MEA)
   8.4. Absolute $ Opportunity Assessment by Region
   8.5. Market Attractiveness/Growth Potential Analysis by Region
   8.6. Global Integrated Circuit Packaging Demand Share Forecast, 2019-2029

9. North America Integrated Circuit Packaging Market Analysis and Forecast
   9.1. Introduction
      9.1.1. Basis Point Share (BPS) Analysis by Country
      9.1.2. Y-o-Y Growth Projections by Country
   9.2. North America Integrated Circuit Packaging Market Size and Volume Forecast by Country
      9.2.1. U.S.
      9.2.2. Canada
   9.3. Absolute $ Opportunity Assessment by Country
   9.4. North America Integrated Circuit Packaging Market Size and Volume Forecast by Application
      9.4.1. Analog Circuits
      9.4.2. Digital Circuits
      9.4.3. RF Circuits
      9.4.4. Sensors
      9.4.5. Others
   9.5. Basis Point Share (BPS) Analysis by Application
   9.6. Y-o-Y Growth Projections by Application
   9.7. North America Integrated Circuit Packaging Market Size and Volume Forecast by Type
      9.7.1. Metal
      9.7.2. Ceramics
      9.7.3. Glass
   9.8. Basis Point Share (BPS) Analysis by Type
   9.9. Y-o-Y Growth Projections by Type
   9.10. Market Attractiveness/Growth Potential Analysis
      9.10.1. By Country
      9.10.2. By Product Type
      9.10.3. By Application
      9.10.4. By Sales Channel
   9.11. North America Integrated Circuit Packaging Demand Share Forecast, 2019-2029

10. Latin America Integrated Circuit Packaging Market Analysis and Forecast
   10.1. Introduction
      10.1.1. Basis Point Share (BPS) Analysis by Country
      10.1.2. Y-o-Y Growth Projections by Country
      10.1.3. Latin America Average Pricing Analysis
   10.2. Latin America Integrated Circuit Packaging Market Size and Volume Forecast by Country
      10.2.1. Brazil
      10.2.2. Mexico
      10.2.3. Rest of Latin America
   10.3. Absolute $ Opportunity Assessment by Country
   10.4. Latin America Integrated Circuit Packaging Market Size and Volume Forecast by Application
      10.4.1. Analog Circuits
      10.4.2. Digital Circuits
      10.4.3. RF Circuits
      10.4.4. Sensors
      10.4.5. Others
   10.5. Basis Point Share (BPS) Analysis by Application
   10.6. Y-o-Y Growth Projections by Application
   10.7. Latin America Integrated Circuit Packaging Market Size and Volume Forecast by Type
      10.7.1. Metal
      10.7.2. Ceramics
      10.7.3. Glass
   10.8. Basis Point Share (BPS) Analysis by Type
   10.9. Y-o-Y Growth Projections by Type
   10.10. Market Attractiveness/Growth Potential Analysis
      10.10.1. By Country
      10.10.2. By Product Type
      10.10.3. By Application
      10.10.4. By Sales Channel
   10.11. Latin America Integrated Circuit Packaging Demand Share Forecast, 2019-2029

11. Europe Integrated Circuit Packaging Market Analysis and Forecast
   11.1. Introduction
      11.1.1. Basis Point Share (BPS) Analysis by Country
      11.1.2. Y-o-Y Growth Projections by Country
      11.1.3. Europe Average Pricing Analysis
   11.2. Europe Integrated Circuit Packaging Market Size and Volume Forecast by Country
      11.2.1. Germany
      11.2.2. France
      11.2.3. Italy
      11.2.4. U.K.
      11.2.5. Spain
      11.2.6. Russia
      11.2.7. Rest of Europe
   11.3. Absolute $ Opportunity Assessment by Country
   11.4. Europe Integrated Circuit Packaging Market Size and Volume Forecast by Application
      11.4.1. Analog Circuits
      11.4.2. Digital Circuits
      11.4.3. RF Circuits
      11.4.4. Sensors
      11.4.5. Others
   11.5. Basis Point Share (BPS) Analysis by Application
   11.6. Y-o-Y Growth Projections by Application
   11.7. Europe Integrated Circuit Packaging Market Size and Volume Forecast by Type
      11.7.1. Metal
      11.7.2. Ceramics
     11.7.3. Glass
   11.8. Basis Point Share (BPS) Analysis by Type
   11.9. Y-o-Y Growth Projections by Type
   11.10. Market Attractiveness/Growth Potential Analysis
      11.10.1. By Country
      11.10.2. By Product Type
      11.10.3. By Application
      11.10.4. By Sales Channel
   11.11. Europe Integrated Circuit Packaging Demand Share, 2019-2029

12. Asia Pacific Integrated Circuit Packaging Market Analysis and Forecast
   12.1. Introduction
      12.1.1. Basis Point Share (BPS) Analysis by Country
      12.1.2. Y-o-Y Growth Projections by Country
      12.1.3. Asia Pacific Average Pricing Analysis
   12.2. Asia Pacific Integrated Circuit Packaging Market Size and Volume Forecast by Country
      12.2.1. China
      12.2.2. Japan
      12.2.3. South Korea
      12.2.4. India
      12.2.5. Australia
      12.2.6. Rest of Asia Pacific (APAC)
   12.3. Absolute $ Opportunity Assessment by Country
   12.4. Asia Pacific Integrated Circuit Packaging Market Size and Volume Forecast by Application
      12.4.1. Analog Circuits
      12.4.2. Digital Circuits
      12.4.3. RF Circuits
      12.4.4. Sensors
      12.4.5. Others
   12.5. Basis Point Share (BPS) Analysis by Application
   12.6. Y-o-Y Growth Projections by Application
   12.7. Asia Pacific Integrated Circuit Packaging Market Size and Volume Forecast by Type
      12.7.1. Metal
      12.7.2. Ceramics
      12.7.3. Glass
   12.8. Basis Point Share (BPS) Analysis by Type
   12.9. Y-o-Y Growth Projections by Type
   12.10. Market Attractiveness/Growth Potential Analysis
      12.10.1. By Country
      12.10.2. By Product Type
      12.10.3. By Application
      12.10.4. By Sales Channel
   12.11. Asia Pacific Integrated Circuit Packaging Demand Share, 2019-2029

13. Middle East & Africa Integrated Circuit Packaging Market Analysis and Forecast
   13.1. Introduction
      13.1.1. Basis Point Share (BPS) Analysis by Country
      13.1.2. Y-o-Y Growth Projections by Country
      13.1.3. Asia Pacific Average Pricing Analysis
   13.2. Middle East & Africa Integrated Circuit Packaging Market Size and Volume Forecast by Country
      13.2.1. Saudi Arabia
      13.2.2. South Africa
      13.2.3. UAE
      13.2.4. Rest of Middle East & Africa (MEA)
   13.3. Absolute $ Opportunity Assessment by Country
   13.4. Middle East & Africa Integrated Circuit Packaging Market Size and Volume Forecast by Application
      13.4.1. Analog Circuits
      13.4.2. Digital Circuits
      13.4.3. RF Circuits
      13.4.4. Sensors
      13.4.5. Others
   13.5. Basis Point Share (BPS) Analysis by Application
   13.6. Y-o-Y Growth Projections by Application
   13.7. Middle East & Africa Integrated Circuit Packaging Market Size and Volume Forecast by Type
      13.7.1. Metal
      13.7.2. Ceramics
      13.7.3. Glass
   13.8. Basis Point Share (BPS) Analysis by Type
   13.9. Y-o-Y Growth Projections by Type
   13.10. Market Attractiveness/Growth Potential Analysis
      13.10.1. By Country
      13.10.2. By Product Type
      13.10.3. By Application
      13.10.4. By Sales Channel
   13.11. Middle East & Africa Integrated Circuit Packaging Demand Share, 2019-2029

14. Competition Landscape
   14.1. Global Integrated Circuit Packaging Market: Market Share Analysis
   14.2. Integrated Circuit Packaging Distributors and Customers
   14.3. Integrated Circuit Packaging Market: Competitive Dashboard
   14.4. Company Profiles (Details – Overview, Financials, Developments, Strategy) 
      14.4.1. Ibiden
         14.4.1.1. Overview
         14.4.1.2. Financials
         14.4.1.3. Developments
         14.4.1.4. Strategic Outlook
      14.4.2. STATS ChipPAC
         14.4.2.1. Overview
         14.4.2.2. Financials
         14.4.2.3. Developments
         14.4.2.4. Strategic Outlook
      14.4.3. Linxens
         14.4.3.1. Overview
         14.4.3.2. Financials
         14.4.3.3. Developments
         14.4.3.4. Strategic Outlook
      14.4.4. Toppan Photomasks
         14.4.4.1. Overview
         14.4.4.2. Financials
         14.4.4.3. Developments
         14.4.4.4. Strategic Outlook
      14.4.5. AMKOR
         14.4.5.1. Overview
         14.4.5.2. Financials
         14.4.5.3. Developments
         14.4.5.4. Strategic Outlook
      14.4.6. ASE
         14.4.6.1. Overview
         14.4.6.2. Financials
         14.4.6.3. Developments
         14.4.6.4. Strategic Outlook
      14.4.7. Cadence Design Systems
         14.4.7.1. Overview
         14.4.7.2. Financials
         14.4.7.3. Developments
         14.4.7.4. Strategic Outlook
      14.4.8. Atotech Deutschland GmbH
         14.4.8.1. Overview
         14.4.8.2. Financials
         14.4.8.3. Developments
         14.4.8.4. Strategic Outlook
      14.4.9. SHINKO
         14.4.9.1. Overview
         14.4.9.2. Financials
         14.4.9.3. Developments
         14.4.9.4. Strategic Outlook
      14.4.10. COMPANY 10
         14.4.10.1. Overview
         14.4.10.2. Financials
         14.4.10.3. Developments
         14.4.10.4. Strategic Outlook
      14.4.11. COMPANY 11
         14.4.11.1. Overview
         14.4.11.2. Financials
         14.4.11.3. Developments
         14.4.11.4. Strategic Outlook
      14.4.12. COMPANY 12
         14.4.12.1. Overview
         14.4.12.2. Financials
         14.4.12.3. Developments
         14.4.12.4. Strategic Outlook
      14.4.13. COMPANY 13
         14.4.13.1. Overview
         14.4.13.2. Financials
         14.4.13.3. Developments
         14.4.13.4. Strategic Outlook
      14.4.14. COMPANY 14
         14.4.14.1. Overview
         14.4.14.2. Financials
         14.4.14.3. Developments
         14.4.14.4. Strategic Outlook
      14.4.15. COMPANY 15
         14.4.15.1. Overview
         14.4.15.2. Financials
         14.4.15.3. Developments
         14.4.15.4. Strategic Outlook
      14.4.16. COMPANY 16
         14.4.16.1. Overview
         14.4.16.2. Financials
         14.4.16.3. Developments
         14.4.16.4. Strategic Outlook
      14.4.17. COMPANY 17
         14.4.17.1. Overview
         14.4.17.2. Financials
         14.4.17.3. Developments
         14.4.17.4. Strategic Outlook
      14.4.18. COMPANY 18
         14.4.18.1. Overview
         14.4.18.2. Financials
         14.4.18.3. Developments
         14.4.18.4. Strategic Outlook
      14.4.19. COMPANY 19
         14.4.19.1. Overview
         14.4.19.2. Financials
         14.4.19.3. Developments
         14.4.19.4. Strategic Outlook
      14.4.20. COMPANY 20
         14.4.20.1. Overview
         14.4.20.2. Financials
         14.4.20.3. Developments
         14.4.20.4. Strategic Outlook

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