Market Overview:
The global laser dicing systems market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The market growth can be attributed to the increasing demand for semiconductor devices and miniaturization of electronic components. Laser dicing systems are used for cutting wafers into small pieces with high accuracy and precision, which is driving the demand for these systems in the semiconductor industry. The global laser dicing systems market by type is segmented into fully automatic type and semi-automatic type. The fully automatic type segment is expected to hold a larger share of the market during the forecast period, owing to its advantages such as high throughput and low cost of ownership. The global laser dicing systems market by application is segmented into pureplay foundries and IDMs (integrated device manufacturers). The pureplay foundries segment held a larger share of the market in 2017, owing to increased demand from fabless companies for advanced packaging solutions.
Product Definition:
Laser dicing systems are used to cut semiconductor wafers into individual dies. This is important because it allows for the production of smaller, more efficient devices.
Fully Automatic Type:
Fully automatic type is used in laser dicing systems for cutting different types of materials such as vegetables, fruits, meat and others. The fully automatic type has the ability to cut continuously without any manual intervention which makes it a popular choice among customers.
The factors that propel the growth of this segment are increasing demand from food processing industry and rising awareness about fully automated products in developing countries like India & China.
Semi-Automatic Type:
Semi-automatic type is also known as perishable goods or consumables lasing system. It’s a packaging technology that involves the use of optically active material to produce light for cutting and detection purposes. The major benefit associated with this technology is that it allows the user to adjust light intensity on demand, which helps in maintaining product quality during shipping and storage.
Application Insights:
The applications of the laser system are pureplay foundries, integrated device manufacturers (IDMs), and others. The pureplay foundry segment accounted for the largest market share in 2017 owing to increasing demand for metal cutting machines from various industries such as automotive, aerospace and defense among others.
The growing demand for semiconductors is also expected to have a positive impact on the industry growth over the forecast period. Semiconductor manufacturers use many different materials during their production process such as silicon, aluminum, copper among others which require different types of lasers depending upon their requirements.
Regional Analysis:
Asia Pacific regional market accounted for the largest revenue share in 2017 and is expected to continue its dominance over the forecast period. The growth can be attributed to increasing demand for laser dicing systems from foundries in China, Japan, and India. Asia Pacific is also home to several key players such as NEDCO Ltd., SEGWAY INC., Shanghai Zhenhua Heavy Industries Co., Ltd (Zhejiang Hidajia Metal Manufacturing Co.), and others who are actively promoting business in this region.
The Latin American regional market held a significant share of the industry due to growing demand from small-scale foundries that produce niche parts at relatively lower costs than their counterparts across other regions. Moreover, rising investments by major players such as Wistron Corporation; Quanta Computer Inc.; Inventec Corporation; Foxconn Technology Group; Compal Electronics Inc.; LG Electronics Inc.; Samsung Electro-Mechanics Co., Ltd.
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Rising demand from the semiconductor industry
- Growing popularity of laser dicing systems for solar cell manufacturing
- Increasing use of laser dicing systems in medical device manufacturing
- Proliferation of 3D printing technology
Scope Of The Report
Report Attributes
Report Details
Report Title
Laser Dicing Systems Market Research Report
By Type
Fully Automatic Type, Semi-Automatic Type
By Application
Pureplay Foundries, IDMs
By Companies
Synova S.A., Disco, ACCRETECH (Tokyo Seimitsu's brand), 3D-Micromac AG, Advanced Laser Separation International (ALSI) N.V.
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
245
Number of Tables & Figures
172
Customization Available
Yes, the report can be customized as per your need.
Global Laser Dicing Systems Market Report Segments:
The global Laser Dicing Systems market is segmented on the basis of:
Types
Fully Automatic Type, Semi-Automatic Type
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Pureplay Foundries, IDMs
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Synova S.A.
- Disco
- ACCRETECH (Tokyo Seimitsu's brand)
- 3D-Micromac AG
- Advanced Laser Separation International (ALSI) N.V.
Highlights of The Laser Dicing Systems Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Fully Automatic Type
- Semi-Automatic Type
- By Application:
- Pureplay Foundries
- IDMs
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Laser Dicing Systems Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
A laser cutting system is a machine that uses lasers to cut materials.
Some of the major companies in the laser dicing systems market are Synova S.A., Disco, ACCRETECH (Tokyo Seimitsu's brand), 3D-Micromac AG, Advanced Laser Separation International (ALSI) N.V..
The laser dicing systems market is expected to grow at a compound annual growth rate of 6.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Laser Dicing Systems Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Laser Dicing Systems Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Laser Dicing Systems Market - Supply Chain
4.5. Global Laser Dicing Systems Market Forecast
4.5.1. Laser Dicing Systems Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Laser Dicing Systems Market Size (000 Units) and Y-o-Y Growth
4.5.3. Laser Dicing Systems Market Absolute $ Opportunity
5. Global Laser Dicing Systems Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Laser Dicing Systems Market Size and Volume Forecast by Type
5.3.1. Fully Automatic Type
5.3.2. Semi-Automatic Type
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Laser Dicing Systems Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Laser Dicing Systems Market Size and Volume Forecast by Application
6.3.1. Pureplay Foundries
6.3.2. IDMs
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Laser Dicing Systems Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Laser Dicing Systems Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Laser Dicing Systems Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Laser Dicing Systems Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Laser Dicing Systems Demand Share Forecast, 2019-2026
9. North America Laser Dicing Systems Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Laser Dicing Systems Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Laser Dicing Systems Market Size and Volume Forecast by Application
9.4.1. Pureplay Foundries
9.4.2. IDMs
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Laser Dicing Systems Market Size and Volume Forecast by Type
9.7.1. Fully Automatic Type
9.7.2. Semi-Automatic Type
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Laser Dicing Systems Demand Share Forecast, 2019-2026
10. Latin America Laser Dicing Systems Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Laser Dicing Systems Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Laser Dicing Systems Market Size and Volume Forecast by Application
10.4.1. Pureplay Foundries
10.4.2. IDMs
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Laser Dicing Systems Market Size and Volume Forecast by Type
10.7.1. Fully Automatic Type
10.7.2. Semi-Automatic Type
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Laser Dicing Systems Demand Share Forecast, 2019-2026
11. Europe Laser Dicing Systems Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Laser Dicing Systems Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Laser Dicing Systems Market Size and Volume Forecast by Application
11.4.1. Pureplay Foundries
11.4.2. IDMs
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Laser Dicing Systems Market Size and Volume Forecast by Type
11.7.1. Fully Automatic Type
11.7.2. Semi-Automatic Type
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potental Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Laser Dicing Systems Demand Share, 2019-2026
12. Asia Pacific Laser Dicing Systems Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Laser Dicing Systems Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Laser Dicing Systems Market Size and Volume Forecast by Application
12.4.1. Pureplay Foundries
12.4.2. IDMs
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Laser Dicing Systems Market Size and Volume Forecast by Type
12.7.1. Fully Automatic Type
12.7.2. Semi-Automatic Type
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Laser Dicing Systems Demand Share, 2019-2026
13. Middle East & Africa Laser Dicing Systems Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Laser Dicing Systems Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Laser Dicing Systems Market Size and Volume Forecast by Application
13.4.1. Pureplay Foundries
13.4.2. IDMs
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Laser Dicing Systems Market Size and Volume Forecast by Type
13.7.1. Fully Automatic Type
13.7.2. Semi-Automatic Type
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Laser Dicing Systems Demand Share, 2019-2026
14. Competition Landscape
14.1. Global Laser Dicing Systems Market: Market Share Analysis
14.2. Laser Dicing Systems Distributors and Customers
14.3. Laser Dicing Systems Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. Synova S.A.
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. Disco
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. ACCRETECH (Tokyo Seimitsu's brand)
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. 3D-Micromac AG
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. Advanced Laser Separation International (ALSI) N.V.
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. COMPANY6
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. COMPANY7
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. COMPANY8
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. COMPANY9
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. COMPANY 10
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. COMPANY 11
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. COMPANY 12
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. COMPANY 13
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. COMPANY 14
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. COMPANY 15
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. COMPANY 16
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
