Market Overview:
The global molded interconnect devices market is expected to grow at a CAGR of 7.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for miniaturized and lightweight electronic devices, rising demand for advanced medical implants, and growing adoption of 3D printing technology. Based on type, the global molded interconnect devices market is segmented into laser direct structuring (LDS), two-shot molding, and others. LDS held the largest share of the global molded interconnect devices market in 2017 owing to its ability to produce miniaturized electronic components with high accuracy and precision. Based on application, the automotive sector accounted for the largest share of the global molded interconnect devices market in 2017 due to increasing demand for electric vehicles across all regions.
Product Definition:
Molded Interconnect Devices (MIDs) are electronic components that are made by injection molding. They are used in a variety of applications, including smartphones and other consumer electronics. MIDs are important because they can be manufactured quickly and inexpensively, and they provide a reliable connection between electronic components.
Laser Direct Structuring (LDS):
Laser direct structuring (LDS) is a process of creating 3D structures by using laser beam. The process has wide applications in microelectronics industry and Molded Interconnect Devices (MID) market is one of them. MID devices are used in various electronic products such as mobile phones, computers, printers, etc., and they have replaceable cartridges for printing purposes.
Two-Shot Molding:
Two-shot molding is a process in which two pieces of plastic are melted together and then injected into a mold to create the desired shape. The process is used for manufacturing molded interconnect devices such as IC chips, connectors, and circuit boards among others.
The major advantage of this technique includes low material consumption along with high efficiency in terms of cost reduction.
Application Insights:
The automotive application segment accounted for the largest revenue share of over 30% in 2017. The growth can be attributed to increasing production of electric and hybrid vehicles, which require a high number of interconnect devices. Moreover, rising demand for passenger cars in developing countries such as India and China is expected to drive the market over the forecast period.
The consumer products application segment is anticipated to witness significant growth during the forecast period owing to increasing adoption of smart homes and wearable devices across developed nations such as U.S., Germany, U.K., Japan etcetera; coupled with a growing population in developing countries like Brazil, Mexico etcetera; will drive demand for molded interconnect devices over the forecast period significantly contributing towards industry growth during this time span.
Regional Analysis:
Asia Pacific region dominated the global molded interconnect devices market in 2016 and is expected to continue its dominance over the forecast period. The presence of key players such as Infineon technologies; Nidec Corporation; Fujitsu Ltd.; and Panasonic Corporation has resulted in high demand for advanced products. Moreover, rising investments by governments for developing infrastructure are anticipated to fuel industry growth over the next eight years.
The Asia Pacific region is characterized by increasing government spending on defense & aerospace, growing healthcare industry, expanding consumer electronics manufacturing base in India and China along with other Southeast Asian countries owing to low labor costs coupled with easy access to technology support. Furthermore, favorable trade agreements between various nations are expected to boost regional growth during the forecast period.
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Rising demand from the automotive industry
- Growing popularity of wearable electronics
- Proliferation of Internet of Things (IoT) devices
- Development of next-generation 5G networks
Scope Of The Report
Report Attributes
Report Details
Report Title
Molded Interconnect Devices Market Research Report
By Type
Laser Direct Structuring (LDS), Two-Shot Molding, Others
By Application
Automotive, Consumer Products, Healthcare, Industrial, Military & Aerospace, Telecommunication & Computing
By Companies
MacDermid Enthone, Molex, LPKF Laser & Electronics, TE Connectivity, Harting Mitronics AG, SelectConnect Technologies, RTP company
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
233
Number of Tables & Figures
164
Customization Available
Yes, the report can be customized as per your need.
Global Molded Interconnect Devices Market Report Segments:
The global Molded Interconnect Devices market is segmented on the basis of:
Types
Laser Direct Structuring (LDS), Two-Shot Molding, Others
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Automotive, Consumer Products, Healthcare, Industrial, Military & Aerospace, Telecommunication & Computing
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- MacDermid Enthone
- Molex
- LPKF Laser & Electronics
- TE Connectivity
- Harting Mitronics AG
- SelectConnect Technologies
- RTP company
Highlights of The Molded Interconnect Devices Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Laser Direct Structuring (LDS)
- Two-Shot Molding
- Others
- By Application:
- Automotive
- Consumer Products
- Healthcare
- Industrial
- Military & Aerospace
- Telecommunication & Computing
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Molded Interconnect Devices Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Molded interconnect devices are a type of electronic component that is manufactured using a mold. The molded part is made from plastic and metal, and it often has an intricate design. This type of component can be found in products such as smartphones, laptops, tablets, gaming consoles, and cars.
Some of the major companies in the molded interconnect devices market are MacDermid Enthone, Molex, LPKF Laser & Electronics, TE Connectivity, Harting Mitronics AG, SelectConnect Technologies, RTP company.
The molded interconnect devices market is expected to grow at a compound annual growth rate of 7.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Molded Interconnect Devices Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Molded Interconnect Devices Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Molded Interconnect Devices Market - Supply Chain
4.5. Global Molded Interconnect Devices Market Forecast
4.5.1. Molded Interconnect Devices Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Molded Interconnect Devices Market Size (000 Units) and Y-o-Y Growth
4.5.3. Molded Interconnect Devices Market Absolute $ Opportunity
5. Global Molded Interconnect Devices Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Molded Interconnect Devices Market Size and Volume Forecast by Type
5.3.1. Laser Direct Structuring (LDS)
5.3.2. Two-Shot Molding
5.3.3. Others
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Molded Interconnect Devices Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Molded Interconnect Devices Market Size and Volume Forecast by Application
6.3.1. Automotive
6.3.2. Consumer Products
6.3.3. Healthcare
6.3.4. Industrial
6.3.5. Military & Aerospace
6.3.6. Telecommunication & Computing
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Molded Interconnect Devices Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Molded Interconnect Devices Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Molded Interconnect Devices Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Molded Interconnect Devices Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Molded Interconnect Devices Demand Share Forecast, 2019-2026
9. North America Molded Interconnect Devices Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Molded Interconnect Devices Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Molded Interconnect Devices Market Size and Volume Forecast by Application
9.4.1. Automotive
9.4.2. Consumer Products
9.4.3. Healthcare
9.4.4. Industrial
9.4.5. Military & Aerospace
9.4.6. Telecommunication & Computing
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Molded Interconnect Devices Market Size and Volume Forecast by Type
9.7.1. Laser Direct Structuring (LDS)
9.7.2. Two-Shot Molding
9.7.3. Others
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Molded Interconnect Devices Demand Share Forecast, 2019-2026
10. Latin America Molded Interconnect Devices Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Molded Interconnect Devices Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Molded Interconnect Devices Market Size and Volume Forecast by Application
10.4.1. Automotive
10.4.2. Consumer Products
10.4.3. Healthcare
10.4.4. Industrial
10.4.5. Military & Aerospace
10.4.6. Telecommunication & Computing
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Molded Interconnect Devices Market Size and Volume Forecast by Type
10.7.1. Laser Direct Structuring (LDS)
10.7.2. Two-Shot Molding
10.7.3. Others
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Molded Interconnect Devices Demand Share Forecast, 2019-2026
11. Europe Molded Interconnect Devices Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Molded Interconnect Devices Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Molded Interconnect Devices Market Size and Volume Forecast by Application
11.4.1. Automotive
11.4.2. Consumer Products
11.4.3. Healthcare
11.4.4. Industrial
11.4.5. Military & Aerospace
11.4.6. Telecommunication & Computing
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Molded Interconnect Devices Market Size and Volume Forecast by Type
11.7.1. Laser Direct Structuring (LDS)
11.7.2. Two-Shot Molding
11.7.3. Others
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Molded Interconnect Devices Demand Share, 2019-2026
12. Asia Pacific Molded Interconnect Devices Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Molded Interconnect Devices Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Molded Interconnect Devices Market Size and Volume Forecast by Application
12.4.1. Automotive
12.4.2. Consumer Products
12.4.3. Healthcare
12.4.4. Industrial
12.4.5. Military & Aerospace
12.4.6. Telecommunication & Computing
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Molded Interconnect Devices Market Size and Volume Forecast by Type
12.7.1. Laser Direct Structuring (LDS)
12.7.2. Two-Shot Molding
12.7.3. Others
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Molded Interconnect Devices Demand Share, 2019-2026
13. Middle East & Africa Molded Interconnect Devices Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Molded Interconnect Devices Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Molded Interconnect Devices Market Size and Volume Forecast by Application
13.4.1. Automotive
13.4.2. Consumer Products
13.4.3. Healthcare
13.4.4. Industrial
13.4.5. Military & Aerospace
13.4.6. Telecommunication & Computing
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Molded Interconnect Devices Market Size and Volume Forecast by Type
13.7.1. Laser Direct Structuring (LDS)
13.7.2. Two-Shot Molding
13.7.3. Others
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Molded Interconnect Devices Demand Share, 2019-2026
14. Competition Landscape
14.1. Global Molded Interconnect Devices Market: Market Share Analysis
14.2. Molded Interconnect Devices Distributors and Customers
14.3. Molded Interconnect Devices Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. MacDermid Enthone
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. Molex
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. LPKF Laser & Electronics
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. TE Connectivity
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. Harting Mitronics AG
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. SelectConnect Technologies
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. RTP company
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. COMPANY8
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. COMPANY9
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. COMPANY 10
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. COMPANY 11
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. COMPANY 12
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. COMPANY 13
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. COMPANY 14
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. COMPANY 15
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. COMPANY 16
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
