Market Overview:
The global multilayer PCB market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for miniaturization and higher performance in electronic devices, growing adoption of advanced packaging technologies, and rising demand for PCBs in automotive applications. Based on type, the multilayer PCB market can be segmented into layer 4-6, layer 8-10, and layer 10+. The layer 4-6 segment is expected to account for the largest share of the global multilayer PCB market in 2018. This segment is projected to grow at a CAGR of 6% during the forecast period. The growth in this segment can be attributed to increased demand from consumer electronics applications. Based on application, the multilayer PCB market can be divided into consumer electronics, communications, computer related industry, automotive industry, and other applications. The computer related industry sector is expected to account for the largest share of the global multilayer PCB market in 2018 followed by automotive industry sector .The other applications sector is projected grow at highest CAGR during forecast period .
Product Definition:
A multilayer PCB is a printed circuit board with multiple layers of conductive material, typically copper, arranged in a stack. The different layers are interconnected by vias, which are thin metal tubes or pads that provide electrical connection between the different layers. Multilayer PCBs are used in high-density electronic applications where there is limited space for components and wiring. The use of multiple conductor layers allows more components to be packed into a given area, and also allows for more efficient routing of signals between components.
Layer 4-6:
Layer 4-6, it's usage.
The layer 4-6 of multilayer PCB is a thin copper sheet that is laminated between the layers of a multi-layered circuit. It helps to transfer signals between different components without any interference from other layers present in the circuit.
Layer 8-10:
Layer 8-10 is a technology used in multilayer PCBs to provide high performance and cost effectiveness. It allows for the interconnections of different types of substrates such as glass, FR4, and FR5 through copper layers. The technology provides benefits such as flexibility in design by allowing changes to be made easily to the circuit without having to change components or solder joints.
Application Insights:
The demand for multi-layer PCBs is increasing in the communications industry owing to their ability to provide high bandwidth and enhanced signal strength. The product has also become a preferred choice in the installation of telecom equipment owing to its properties such as low loss, high dielectric strength, and flexibility. Increasing use of multi-layer PCBs for providing superior performance in wireless communication devices is expected to drive the market over the forecast period.
The computer related industry was one of the largest consumers of multi-layer printed circuit boards with a revenue share estimated at around 20% in 2017. This can be attributed to factors such as increased demand for miniaturized electronic devices resulting into increased usage of these products across various end-use industries including healthcare, consumer electronics and automotive among others.
Regional Analysis:
Asia Pacific is expected to be the fastest-growing regional market over the forecast period. The growth can be attributed to increasing demand for consumer electronics and communication products in countries such as China, India, South Korea, Japan among others. Increasing penetration of smartphones and wireless devices has also led to increased demand for multilayer PCBs in this region.
The Asia Pacific region is anticipated to witness significant growth owing to rising investments by governments of various countries coupled with favorable government policies aimed at promoting manufacturing activities within their respective nations. This factor will further boost industry expansion over the next eight years.
Growth Factors:
- Increasing demand from the automotive and telecommunication industries
- Proliferation of Internet of Things (IoT) and connected devices
- Rising demand for miniaturized and high-performance PCBs
- Growing popularity of multilayer PCBs in the medical device industry
- Emergence of new applications that require advanced PCB technology
Scope Of The Report
Report Attributes
Report Details
Report Title
Multilayer PCB Market Research Report
By Type
Layer 4-6, Layer 8-10, Layer 10+
By Application
Consumer Electronics, Communications, Computer Related Industry, Automotive Industry, Other
By Companies
Nippon Mektron, ZD Tech, TTM Technologies, Unimicron, Sumitomo Denko, Compeq, Tripod, Samsung E-M, Young Poong Group, HannStar, Ibiden, Nanya PCB, KBC PCB Group, Daeduck Group, AT&S, Fujikura, Meiko, Multek, Kinsus, Chin Poon, T.P.T., Shinko Denski, Wus Group, Simmtech, Mflex, CMK, LG Innotek, Gold Circuit, Shennan Circuit, Ellington
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
241
Number of Tables & Figures
169
Customization Available
Yes, the report can be customized as per your need.
Global Multilayer PCB Market Report Segments:
The global Multilayer PCB market is segmented on the basis of:
Types
Layer 4-6, Layer 8-10, Layer 10+
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Consumer Electronics, Communications, Computer Related Industry, Automotive Industry, Other
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Nippon Mektron
- ZD Tech
- TTM Technologies
- Unimicron
- Sumitomo Denko
- Compeq
- Tripod
- Samsung E-M
- Young Poong Group
- HannStar
- Ibiden
- Nanya PCB
- KBC PCB Group
- Daeduck Group
- AT&S
- Fujikura
- Meiko
- Multek
- Kinsus
- Chin Poon
- T.P.T.
- Shinko Denski
- Wus Group
- Simmtech
- Mflex
- CMK
- LG Innotek
- Gold Circuit
- Shennan Circuit
- Ellington
Highlights of The Multilayer PCB Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Layer 4-6
- Layer 8-10
- Layer 10+
- By Application:
- Consumer Electronics
- Communications
- Computer Related Industry
- Automotive Industry
- Other
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Multilayer PCB Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Multilayer PCB is a type of printed circuit board that has multiple layers of copper foil. The top layer is usually made of a plastic material, and the bottom layer is made of copper foil.
Some of the major companies in the multilayer pcb market are Nippon Mektron, ZD Tech, TTM Technologies, Unimicron, Sumitomo Denko, Compeq, Tripod, Samsung E-M, Young Poong Group, HannStar, Ibiden, Nanya PCB, KBC PCB Group, Daeduck Group, AT&S, Fujikura, Meiko, Multek, Kinsus, Chin Poon, T.P.T., Shinko Denski, Wus Group, Simmtech, Mflex, CMK, LG Innotek, Gold Circuit, Shennan Circuit, Ellington.
The multilayer pcb market is expected to grow at a compound annual growth rate of 5.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Multilayer PCB Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Multilayer PCB Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Multilayer PCB Market - Supply Chain
4.5. Global Multilayer PCB Market Forecast
4.5.1. Multilayer PCB Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Multilayer PCB Market Size (000 Units) and Y-o-Y Growth
4.5.3. Multilayer PCB Market Absolute $ Opportunity
5. Global Multilayer PCB Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Multilayer PCB Market Size and Volume Forecast by Type
5.3.1. Layer 4-6
5.3.2. Layer 8-10
5.3.3. Layer 10+
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Multilayer PCB Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Multilayer PCB Market Size and Volume Forecast by Application
6.3.1. Consumer Electronics
6.3.2. Communications
6.3.3. Computer Related Industry
6.3.4. Automotive Industry
6.3.5. Other
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Multilayer PCB Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Multilayer PCB Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Multilayer PCB Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Multilayer PCB Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Multilayer PCB Demand Share Forecast, 2019-2026
9. North America Multilayer PCB Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Multilayer PCB Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Multilayer PCB Market Size and Volume Forecast by Application
9.4.1. Consumer Electronics
9.4.2. Communications
9.4.3. Computer Related Industry
9.4.4. Automotive Industry
9.4.5. Other
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Multilayer PCB Market Size and Volume Forecast by Type
9.7.1. Layer 4-6
9.7.2. Layer 8-10
9.7.3. Layer 10+
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Multilayer PCB Demand Share Forecast, 2019-2026
10. Latin America Multilayer PCB Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Multilayer PCB Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Multilayer PCB Market Size and Volume Forecast by Application
10.4.1. Consumer Electronics
10.4.2. Communications
10.4.3. Computer Related Industry
10.4.4. Automotive Industry
10.4.5. Other
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Multilayer PCB Market Size and Volume Forecast by Type
10.7.1. Layer 4-6
10.7.2. Layer 8-10
10.7.3. Layer 10+
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Multilayer PCB Demand Share Forecast, 2019-2026
11. Europe Multilayer PCB Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Multilayer PCB Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Multilayer PCB Market Size and Volume Forecast by Application
11.4.1. Consumer Electronics
11.4.2. Communications
11.4.3. Computer Related Industry
11.4.4. Automotive Industry
11.4.5. Other
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Multilayer PCB Market Size and Volume Forecast by Type
11.7.1. Layer 4-6
11.7.2. Layer 8-10
11.7.3. Layer 10+
11.8. Basis Point Share (BPS) Analysis byType
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Multilayer PCB Demand Share, 2019-2026
12. Asia Pacific Multilayer PCB Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Multilayer PCB Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Multilayer PCB Market Size and Volume Forecast by Application
12.4.1. Consumer Electronics
12.4.2. Communications
12.4.3. Computer Related Industry
12.4.4. Automotive Industry
12.4.5. Other
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Multilayer PCB Market Size and Volume Forecast by Type
12.7.1. Layer 4-6
12.7.2. Layer 8-10
12.7.3. Layer 10+
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Multilayer PCB Demand Share, 2019-2026
13. Middle East & Africa Multilayer PCB Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Multilayer PCB Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Multilayer PCB Market Size and Volume Forecast by Application
13.4.1. Consumer Electronics
13.4.2. Communications
13.4.3. Computer Related Industry
13.4.4. Automotive Industry
13.4.5. Other
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Multilayer PCB Market Size and Volume Forecast by Type
13.7.1. Layer 4-6
13.7.2. Layer 8-10
13.7.3. Layer 10+
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Multilayer PCB Demand Share, 2019-2026
14. Competition Landscape
14.1. Global Multilayer PCB Market: Market Share Analysis
14.2. Multilayer PCB Distributors and Customers
14.3. Multilayer PCB Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. Nippon Mektron
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. ZD Tech
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. TTM Technologies
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. Unimicron
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. Sumitomo Denko
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. Compeq
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. Tripod
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. Samsung E-M
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. Young Poong Group
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. HannStar
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. Ibiden
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. Nanya PCB
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. KBC PCB Group
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. Daeduck Group
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. AT&S
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. Fujikura
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. Meiko
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. Multek
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. Kinsus
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. Chin Poon
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
