The global new packages and materials for power devices market is expected to grow at a CAGR of 5.5% during the forecast period, from 2021 to 2030. The market is driven by the increasing demand for power devices in various applications such as telecommunications and computing, industrial, electronics, automotive and others. The growth of this market is also attributed to the increasing demand for high-performance power devices in various applications such as telecommunications and computing, industrial, electronics, automotive and others.
Wire bonding packaging accounted for the largest share of this market in 2018 due to its low cost per watt (W) compared with other packaging types such as GaN or silicon carbide (SiC). Wire bonding packaging has been used extensively in semiconductor industry since it provides a low cost per watt (W) compared with other packaging types such as GaN or silicon carbide (SiC).
- The demand for power devices is expected to grow as the world's population increases and more people are able to afford electricity.
- The need for power devices will increase as the world's population continues to grow and more people are able to afford electricity.
- Power device manufacturers will continue to innovate in order to meet the needs of their customers, which will lead to new packages and materials being developed for these devices.
- New materials may be developed that can withstand higher temperatures or provide better insulation, which would allow power devices with these new materials inside them to last longer than current models do before they need replacement or repair work done on them due to damage from high temperatures or insulation failure, respectively.
- As technology advances, there may be a shift away from traditional power sources such as coal-fired plants towards renewable energy sources such as solar panels and wind turbines, which would lead manufacturers of these technologies (such as solar panel makers) into competition with each other in order for their products (solar panels) become more popular than those made by competitors (wind turbine makers).
Industry Growth Insights published a new data on “New Packages and Materials for Power Devices Market”. The research report is titled “New Packages and Materials for Power Devices Market research by Types (Wire Bonding Packaging, Gallium Nitrid (GaN), Chip-scale Packaging, Gallium Arsenide, Silicon Carbide, Others), By Applications (Telecommunications and Computing, Industrial, Electronics, Automotive, Others), By Players/Companies Littelfuse, Remtec, Inc., MITSUBISHI ELECTRIC CORPORATION, Amkor Technology, Orient Semiconductor Electronics Ltd., Infineon Technologies AG, SEMIKRON, ROHM SEMICONDUCTOR, STMicroelectronics, NXP Semiconductor, Exagan, ON Semiconductor, Efficient Power Conversion Corporation”.
Scope Of The Report
Report Attributes
Report Details
Report Title
New Packages and Materials for Power Devices Market Research Report
By Type
Wire Bonding Packaging, Gallium Nitrid (GaN), Chip-scale Packaging, Gallium Arsenide, Silicon Carbide, Others
By Application
Telecommunications and Computing, Industrial, Electronics, Automotive, Others
By Companies
Littelfuse, Remtec, Inc., MITSUBISHI ELECTRIC CORPORATION, Amkor Technology, Orient Semiconductor Electronics Ltd., Infineon Technologies AG, SEMIKRON, ROHM SEMICONDUCTOR, STMicroelectronics, NXP Semiconductor, Exagan, ON Semiconductor, Efficient Power Conversion Corporation
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
232
Number of Tables & Figures
163
Customization Available
Yes, the report can be customized as per your need.
Global New Packages and Materials for Power Devices Market Report Segments:
The global New Packages and Materials for Power Devices market is segmented on the basis of:
Types
Wire Bonding Packaging, Gallium Nitrid (GaN), Chip-scale Packaging, Gallium Arsenide, Silicon Carbide, Others
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Telecommunications and Computing, Industrial, Electronics, Automotive, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Littelfuse
- Remtec, Inc.
- MITSUBISHI ELECTRIC CORPORATION
- Amkor Technology
- Orient Semiconductor Electronics Ltd.
- Infineon Technologies AG
- SEMIKRON
- ROHM SEMICONDUCTOR
- STMicroelectronics
- NXP Semiconductor
- Exagan
- ON Semiconductor
- Efficient Power Conversion Corporation
Highlights of The New Packages and Materials for Power Devices Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Wire Bonding Packaging
- Gallium Nitrid (GaN)
- Chip-scale Packaging
- Gallium Arsenide
- Silicon Carbide
- Others
- By Application:
- Telecommunications and Computing
- Industrial
- Electronics
- Automotive
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the New Packages and Materials for Power Devices Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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- Correctly Positioning New Products
- Market Entry Strategies
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- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
New packages and materials for power devices are designed to improve performance and reliability. These new packages and materials can help reduce heat generation, improve efficiency, and increase battery life.
Some of the key players operating in the new packages and materials for power devices market are Littelfuse, Remtec, Inc., MITSUBISHI ELECTRIC CORPORATION, Amkor Technology, Orient Semiconductor Electronics Ltd., Infineon Technologies AG, SEMIKRON, ROHM SEMICONDUCTOR, STMicroelectronics, NXP Semiconductor, Exagan, ON Semiconductor, Efficient Power Conversion Corporation.
The new packages and materials for power devices market is expected to register a CAGR of 5.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. New Packages and Materials for Power Devices Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. New Packages and Materials for Power Devices Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. New Packages and Materials for Power Devices Market - Supply Chain
4.5. Global New Packages and Materials for Power Devices Market Forecast
4.5.1. New Packages and Materials for Power Devices Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. New Packages and Materials for Power Devices Market Size (000 Units) and Y-o-Y Growth
4.5.3. New Packages and Materials for Power Devices Market Absolute $ Opportunity
5. Global New Packages and Materials for Power Devices Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. New Packages and Materials for Power Devices Market Size and Volume Forecast by Type
5.3.1. Wire Bonding Packaging
5.3.2. Gallium Nitrid (GaN)
5.3.3. Chip-scale Packaging
5.3.4. Gallium Arsenide
5.3.5. Silicon Carbide
5.3.6. Others
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global New Packages and Materials for Power Devices Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. New Packages and Materials for Power Devices Market Size and Volume Forecast by Application
6.3.1. Telecommunications and Computing
6.3.2. Industrial
6.3.3. Electronics
6.3.4. Automotive
6.3.5. Others
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global New Packages and Materials for Power Devices Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. New Packages and Materials for Power Devices Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global New Packages and Materials for Power Devices Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. New Packages and Materials for Power Devices Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global New Packages and Materials for Power Devices Demand Share Forecast, 2019-2026
9. North America New Packages and Materials for Power Devices Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America New Packages and Materials for Power Devices Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America New Packages and Materials for Power Devices Market Size and Volume Forecast by Application
9.4.1. Telecommunications and Computing
9.4.2. Industrial
9.4.3. Electronics
9.4.4. Automotive
9.4.5. Others
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America New Packages and Materials for Power Devices Market Size and Volume Forecast by Type
9.7.1. Wire Bonding Packaging
9.7.2. Gallium Nitrid (GaN)
9.7.3. Chip-scale Packaging
9.7.4. Gallium Arsenide
9.7.5. Silicon Carbide
9.7.6. Others
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America New Packages and Materials for Power Devices Demand Share Forecast, 2019-2026
10. Latin America New Packages and Materials for Power Devices Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America New Packages and Materials for Power Devices Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America New Packages and Materials for Power Devices Market Size and Volume Forecast by Application
10.4.1. Telecommunications and Computing
10.4.2. Industrial
10.4.3. Electronics
10.4.4. Automotive
10.4.5. Others
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America New Packages and Materials for Power Devices Market Size and Volume Forecast by Type
10.7.1. Wire Bonding Packaging
10.7.2. Gallium Nitrid (GaN)
10.7.3. Chip-scale Packaging
10.7.4. Gallium Arsenide
10.7.5. Silicon Carbide
10.7.6. Others
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America New Packages and Materials for Power Devices Demand Share Forecast, 2019-2026
11. Europe New Packages and Materials for Power Devices Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe New Packages and Materials for Power Devices Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe New Packages and Materials for Power Devices Market Size and Volume Forecast by Application
11.4.1. Telecommunications and Computing
11.4.2. Industrial
11.4.3. Electronics
11.4.4. Automotive
11.4.5. Others
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe New Packages and Materials for Power Devices Mrket Size and Volume Forecast by Type
11.7.1. Wire Bonding Packaging
11.7.2. Gallium Nitrid (GaN)
11.7.3. Chip-scale Packaging
11.7.4. Gallium Arsenide
11.7.5. Silicon Carbide
11.7.6. Others
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe New Packages and Materials for Power Devices Demand Share, 2019-2026
12. Asia Pacific New Packages and Materials for Power Devices Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific New Packages and Materials for Power Devices Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific New Packages and Materials for Power Devices Market Size and Volume Forecast by Application
12.4.1. Telecommunications and Computing
12.4.2. Industrial
12.4.3. Electronics
12.4.4. Automotive
12.4.5. Others
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific New Packages and Materials for Power Devices Market Size and Volume Forecast by Type
12.7.1. Wire Bonding Packaging
12.7.2. Gallium Nitrid (GaN)
12.7.3. Chip-scale Packaging
12.7.4. Gallium Arsenide
12.7.5. Silicon Carbide
12.7.6. Others
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific New Packages and Materials for Power Devices Demand Share, 2019-2026
13. Middle East & Africa New Packages and Materials for Power Devices Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa New Packages and Materials for Power Devices Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa New Packages and Materials for Power Devices Market Size and Volume Forecast by Application
13.4.1. Telecommunications and Computing
13.4.2. Industrial
13.4.3. Electronics
13.4.4. Automotive
13.4.5. Others
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa New Packages and Materials for Power Devices Market Size and Volume Forecast by Type
13.7.1. Wire Bonding Packaging
13.7.2. Gallium Nitrid (GaN)
13.7.3. Chip-scale Packaging
13.7.4. Gallium Arsenide
13.7.5. Silicon Carbide
13.7.6. Others
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa New Packages and Materials for Power Devices Demand Share, 2019-2026
14. Competition Landscape
14.1. Global New Packages and Materials for Power Devices Market: Market Share Analysis
14.2. New Packages and Materials for Power Devices Distributors and Customers
14.3. New Packages and Materials for Power Devices Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. Littelfuse
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. Remtec, Inc.
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. MITSUBISHI ELECTRIC CORPORATION
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. Amkor Technology
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. Orient Semiconductor Electronics Ltd.
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. Infineon Technologies AG
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. SEMIKRON
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. ROHM SEMICONDUCTOR
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. STMicroelectronics
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. NXP Semiconductor
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. Exagan
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. ON Semiconductor
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. Efficient Power Conversion Corporation
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. COMPANY 14
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. COMPANY 15
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. COMPANY 16
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
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