Market Overview:
The global package substrates in mobile devices market is expected to grow at a CAGR of 9.5% during the forecast period from 2018 to 2030. The market growth can be attributed to the increasing demand for smartphones and tablets across the globe. Additionally, rising adoption of 4G and 5G networks is also propelling the demand for package substrates in mobile devices market. Based on type, FCCSP (Flip Chip Coated Substrate Package) held a major share of the global package substrates in mobile devices market in 2017 and is expected to maintain its dominance during the forecast period as well. This can be attributed to its advantages such as high thermal conductivity, low junction capacitance, and low resistance values that make it suitable for use in high-performance applications such as smartphones and tablets. WBCSP (Wafer Level Ball Grid Array Package) is another type of package substrate that has been witnessing significant growth over the past few years owing to its advantages such as small form factor, reduced manufacturing cost, and improved electrical performance when compared with traditional packages such as FCBGA (Flip Chip Ball Grid Array). SiP (System-in-Package) technology is also gaining traction due to its ability to integrate multiple semiconductor dies into a single package which helps reduce system costs while improving performance.
Product Definition:
Package substrates are materials used in the packaging of electronic components, such as semiconductors and integrated circuits. They protect the components from physical and environmental damage during shipping and handling. Package substrates also provide a surface for attaching electrical contacts and other elements that enable the component to function.
FCCSP:
FCCSP is a new set of standards that are designed to regulate the power consumption in mobile devices. It aims at providing a framework for classifying and controlling electrical equipment according to their power needs. The standard has been introduced by the Federal Communications Commission (FCC) with an objective to reduce the overall energy consumption in electronic products, which is expected to have a positive impact on global market growth over the forecast period.
WBCSP:
WBCSP is a wireless technology that enables mobile devices to communicate with each other and the infrastructure without being connected through wired connections. It uses radio waves for communication between the devices and infrastructure. The technology provides high-speed data transfer, which is expected to drive market growth over the forecast period.
Application Insights:
The smartphones segment held the largest market share in 2017 and is expected to continue its dominance over the forecast period. The increasing use of package substrates in smartphones owing to their small size and light weight has been contributing significantly to their demand. Smartphone manufacturers are focusing on reducing the thickness of mobile devices so as to improve their aesthetic designs, which is likely to boost product demand further.
The growing popularity of e-sports has been driving the demand for gaming phones with advanced features such as high storage capacity, large displays, and fast processors. This factor will help Package Substrate Market grow with a CAGR around 12% from 2018to 2030 globally owing to increased sales of gaming phones across regions coupled with rising consumer disposable income levels in developing countries such as China and India.
Regional Analysis:
Asia Pacific region is anticipated to witness the highest CAGR of XX% during the forecast period. The growth can be attributed to increasing demand for smartphones, tablets, and other mobile devices in this region. China and India are among the largest smartphone markets in this region with more than 340 million and 210 million units shipped respectively in 2016 as per Strategy Analytics. Increasing penetration of high-speed internet services has led to an increase in online shopping activities which is expected to drive product demand further over the next eight years.
North America was estimated as a significant market for package substrates by Mobile Asia Congress (MAC) 2017 held recently at Las Vegas, Nevada, U.S.
Growth Factors:
- Increasing demand for miniaturization in mobile devices
- Rising demand for high-performance and low-power consumption mobile devices
- Proliferation of 4G/LTE networks and the growing popularity of LTE-enabled smartphones and tablets
- Growing trend of device personalization and the increasing use of custom packaging substrates in mobile devices
- Emergence of new applications such as 3D printing that require specialized packaging substrates
Scope Of The Report
Report Attributes
Report Details
Report Title
Package Substrates in Mobile Devices Market Research Report
By Type
FCCSP, WBCSP, SiP, BOC, FCBGA
By Application
Smartphones, Tablets, Notebook PCs, Others
By Companies
Ibiden, Shinko Electric Industries, Kyocera, Samsung Electro-Mechanics, Fujitsu, Hitachi, Eastern, LG Innotek, Simmtech, Daeduck, AT&S, Unimicron, Kinsus, Nan Ya PCB, ASE Group, TTM Technologies, Zhen Ding Technology, Shenzhen Fastprint Circuit Tech
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
246
Number of Tables & Figures
173
Customization Available
Yes, the report can be customized as per your need.
Global Package Substrates in Mobile Devices Market Report Segments:
The global Package Substrates in Mobile Devices market is segmented on the basis of:
Types
FCCSP, WBCSP, SiP, BOC, FCBGA
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Smartphones, Tablets, Notebook PCs, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Ibiden
- Shinko Electric Industries
- Kyocera
- Samsung Electro-Mechanics
- Fujitsu
- Hitachi
- Eastern
- LG Innotek
- Simmtech
- Daeduck
- AT&S
- Unimicron
- Kinsus
- Nan Ya PCB
- ASE Group
- TTM Technologies
- Zhen Ding Technology
- Shenzhen Fastprint Circuit Tech
Highlights of The Package Substrates in Mobile Devices Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- FCCSP
- WBCSP
- SiP
- BOC
- FCBGA
- By Application:
- Smartphones
- Tablets
- Notebook PCs
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Package Substrates in Mobile Devices Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Package substrates are the physical components of mobile devices that house the operating system, applications, and other software.
Some of the key players operating in the package substrates in mobile devices market are Ibiden, Shinko Electric Industries, Kyocera, Samsung Electro-Mechanics, Fujitsu, Hitachi, Eastern, LG Innotek, Simmtech, Daeduck, AT&S, Unimicron, Kinsus, Nan Ya PCB, ASE Group, TTM Technologies, Zhen Ding Technology, Shenzhen Fastprint Circuit Tech.
The package substrates in mobile devices market is expected to grow at a compound annual growth rate of 9.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Package Substrates in Mobile Devices Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Package Substrates in Mobile Devices Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Package Substrates in Mobile Devices Market - Supply Chain
4.5. Global Package Substrates in Mobile Devices Market Forecast
4.5.1. Package Substrates in Mobile Devices Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Package Substrates in Mobile Devices Market Size (000 Units) and Y-o-Y Growth
4.5.3. Package Substrates in Mobile Devices Market Absolute $ Opportunity
5. Global Package Substrates in Mobile Devices Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Package Substrates in Mobile Devices Market Size and Volume Forecast by Type
5.3.1. FCCSP
5.3.2. WBCSP
5.3.3. SiP
5.3.4. BOC
5.3.5. FCBGA
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Package Substrates in Mobile Devices Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Package Substrates in Mobile Devices Market Size and Volume Forecast by Application
6.3.1. Smartphones
6.3.2. Tablets
6.3.3. Notebook PCs
6.3.4. Others
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Package Substrates in Mobile Devices Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Package Substrates in Mobile Devices Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Package Substrates in Mobile Devices Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Package Substrates in Mobile Devices Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Package Substrates in Mobile Devices Demand Share Forecast, 2019-2026
9. North America Package Substrates in Mobile Devices Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Package Substrates in Mobile Devices Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Package Substrates in Mobile Devices Market Size and Volume Forecast by Application
9.4.1. Smartphones
9.4.2. Tablets
9.4.3. Notebook PCs
9.4.4. Others
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Package Substrates in Mobile Devices Market Size and Volume Forecast by Type
9.7.1. FCCSP
9.7.2. WBCSP
9.7.3. SiP
9.7.4. BOC
9.7.5. FCBGA
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Package Substrates in Mobile Devices Demand Share Forecast, 2019-2026
10. Latin America Package Substrates in Mobile Devices Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Package Substrates in Mobile Devices Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Package Substrates in Mobile Devices Market Size and Volume Forecast by Application
10.4.1. Smartphones
10.4.2. Tablets
10.4.3. Notebook PCs
10.4.4. Others
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Package Substrates in Mobile Devices Market Size and Volume Forecast by Type
10.7.1. FCCSP
10.7.2. WBCSP
10.7.3. SiP
10.7.4. BOC
10.7.5. FCBGA
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Package Substrates in Mobile Devices Demand Share Forecast, 2019-2026
11. Europe Package Substrates in Mobile Devices Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Package Substrates in Mobile Devices Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Package Substrates in Mobile Devices Market Size and Volume Forecast by Application
11.4.1. Smartphones
11.4.2. Tablets
11.4.3. Notebook PCs
11.4.4. Others
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Package Substrates in Mobile Devices Market Size and Volume Forecast by Type
11.7.1. FCCSP
117.2. WBCSP
11.7.3. SiP
11.7.4. BOC
11.7.5. FCBGA
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Package Substrates in Mobile Devices Demand Share, 2019-2026
12. Asia Pacific Package Substrates in Mobile Devices Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Package Substrates in Mobile Devices Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Package Substrates in Mobile Devices Market Size and Volume Forecast by Application
12.4.1. Smartphones
12.4.2. Tablets
12.4.3. Notebook PCs
12.4.4. Others
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Package Substrates in Mobile Devices Market Size and Volume Forecast by Type
12.7.1. FCCSP
12.7.2. WBCSP
12.7.3. SiP
12.7.4. BOC
12.7.5. FCBGA
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Package Substrates in Mobile Devices Demand Share, 2019-2026
13. Middle East & Africa Package Substrates in Mobile Devices Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Package Substrates in Mobile Devices Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Package Substrates in Mobile Devices Market Size and Volume Forecast by Application
13.4.1. Smartphones
13.4.2. Tablets
13.4.3. Notebook PCs
13.4.4. Others
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Package Substrates in Mobile Devices Market Size and Volume Forecast by Type
13.7.1. FCCSP
13.7.2. WBCSP
13.7.3. SiP
13.7.4. BOC
13.7.5. FCBGA
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Package Substrates in Mobile Devices Demand Share, 2019-2026
14. Competition Landscape
14.1. Global Package Substrates in Mobile Devices Market: Market Share Analysis
14.2. Package Substrates in Mobile Devices Distributors and Customers
14.3. Package Substrates in Mobile Devices Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. Ibiden
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. Shinko Electric Industries
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. Kyocera
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. Samsung Electro-Mechanics
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. Fujitsu
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. Hitachi
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. Eastern
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. LG Innotek
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. Simmtech
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. Daeduck
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. AT&S
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. Unimicron
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. Kinsus
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. Nan Ya PCB
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. ASE Group
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. TTM Technologies
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. Zhen Ding Technology
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. Shenzhen Fastprint Circuit Tech
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
