The global plating for microelectronics market is projected to grow at a CAGR of 4.5% during the forecast period, to reach USD 3.2 billion by 2030. The growth of this market is driven by the increasing demand for plating in various applications such as MEMS, PCBs, ICs and photoelectron. The increasing demand for plating in these applications is due to the growing need for miniaturization and high-density integration in electronics devices.
Some Of The Growth Factors Of This Market:
- The increasing demand for high-performance microelectronics in the automotive, aerospace, and defense industries is driving the growth of the global plating for microelectronics market.
- The increasing demand for high-performance microelectronics in the automotive, aerospace, and defense industries is driving the growth of the global plating for microplectonics market.
- Increasing use of advanced technologies such as 3D printing to manufacture complex components.
Industry Growth Insights published a new data on “Plating for Microelectronics Market”. The research report is titled “Plating for Microelectronics Market research by Types (Gold, Zinc, Nickel, Bronze, Tin, Copper, Others), By Applications (MEMS, PCB, IC, Photoelectron, Others), By Players/Companies DowDuPont, Mitsubishi Materials Corporation, Heraeus, XiLong Scientific, Atotech, Yamato Denki, Meltex, Ishihara Chemical, Raschig GmbH, Japan Pure Chemical, Coatech, MAGNETO special anodes, Vopelius Chemie AG, Moses Lake Industries, JCU International”.
Scope Of The Report
Report Attributes
Report Details
Report Title
Plating for Microelectronics Market Research Report
By Type
Gold, Zinc, Nickel, Bronze, Tin, Copper, Others
By Application
MEMS, PCB, IC, Photoelectron, Others
By Companies
DowDuPont, Mitsubishi Materials Corporation, Heraeus, XiLong Scientific, Atotech, Yamato Denki, Meltex, Ishihara Chemical, Raschig GmbH, Japan Pure Chemical, Coatech, MAGNETO special anodes, Vopelius Chemie AG, Moses Lake Industries, JCU International
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
233
Number of Tables & Figures
164
Customization Available
Yes, the report can be customized as per your need.
Global Plating for Microelectronics Market Report Segments:
The global Plating for Microelectronics market is segmented on the basis of:
Types
Gold, Zinc, Nickel, Bronze, Tin, Copper, Others
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
MEMS, PCB, IC, Photoelectron, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- DowDuPont
- Mitsubishi Materials Corporation
- Heraeus
- XiLong Scientific
- Atotech
- Yamato Denki
- Meltex
- Ishihara Chemical
- Raschig GmbH
- Japan Pure Chemical
- Coatech
- MAGNETO special anodes
- Vopelius Chemie AG
- Moses Lake Industries
- JCU International
Highlights of The Plating for Microelectronics Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Gold
- Zinc
- Nickel
- Bronze
- Tin
- Copper
- Others
- By Application:
- MEMS
- PCB
- IC
- Photoelectron
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Plating for Microelectronics Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
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- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Plating is a process that coats microelectronics with a protective layer of metal. This layer helps to protect the microelectronics from environmental damage and also enhances the electrical and thermal conductivity of the microelectronics.
Some of the major players in the plating for microelectronics market are DowDuPont, Mitsubishi Materials Corporation, Heraeus, XiLong Scientific, Atotech, Yamato Denki, Meltex, Ishihara Chemical, Raschig GmbH, Japan Pure Chemical, Coatech, MAGNETO special anodes, Vopelius Chemie AG, Moses Lake Industries, JCU International.
The plating for microelectronics market is expected to grow at a compound annual growth rate of 4.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Plating for Microelectronics Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Plating for Microelectronics Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Plating for Microelectronics Market - Supply Chain
4.5. Global Plating for Microelectronics Market Forecast
4.5.1. Plating for Microelectronics Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Plating for Microelectronics Market Size (000 Units) and Y-o-Y Growth
4.5.3. Plating for Microelectronics Market Absolute $ Opportunity
5. Global Plating for Microelectronics Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Plating for Microelectronics Market Size and Volume Forecast by Type
5.3.1. Gold
5.3.2. Zinc
5.3.3. Nickel
5.3.4. Bronze
5.3.5. Tin
5.3.6. Copper
5.3.7. Others
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Plating for Microelectronics Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Plating for Microelectronics Market Size and Volume Forecast by Application
6.3.1. MEMS
6.3.2. PCB
6.3.3. IC
6.3.4. Photoelectron
6.3.5. Others
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Plating for Microelectronics Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Plating for Microelectronics Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Plating for Microelectronics Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Plating for Microelectronics Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Plating for Microelectronics Demand Share Forecast, 2019-2026
9. North America Plating for Microelectronics Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Plating for Microelectronics Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Plating for Microelectronics Market Size and Volume Forecast by Application
9.4.1. MEMS
9.4.2. PCB
9.4.3. IC
9.4.4. Photoelectron
9.4.5. Others
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Plating for Microelectronics Market Size and Volume Forecast by Type
9.7.1. Gold
9.7.2. Zinc
9.7.3. Nickel
9.7.4. Bronze
9.7.5. Tin
9.7.6. Copper
9.7.7. Others
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Plating for Microelectronics Demand Share Forecast, 2019-2026
10. Latin America Plating for Microelectronics Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Plating for Microelectronics Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Plating for Microelectronics Market Size and Volume Forecast by Application
10.4.1. MEMS
10.4.2. PCB
10.4.3. IC
10.4.4. Photoelectron
10.4.5. Others
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Plating for Microelectronics Market Size and Volume Forecast by Type
10.7.1. Gold
10.7.2. Zinc
10.7.3. Nickel
10.7.4. Bronze
10.7.5. Tin
10.7.6. Copper
10.7.7. Others
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Plating for Microelectronics Demand Share Forecast, 2019-2026
11. Europe Plating for Microelectronics Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Plating for Microelectronics Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Plating for Microelectronics Market Size and Volume Forecast by Application
11.4.1. MEMS
11.4.2. PCB
11.4.3. IC
11.4.4. Photoelectron
11.4.5. Others
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Plating for Microelectronics Market Size and Volume Forecast by Type
11.7.1. Gold
11.7.2. Zinc
11.7.3. Nickel
11.7.4. Bronze
11.7.5. Tin
11..6. Copper
11.7.7. Others
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Plating for Microelectronics Demand Share, 2019-2026
12. Asia Pacific Plating for Microelectronics Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Plating for Microelectronics Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Plating for Microelectronics Market Size and Volume Forecast by Application
12.4.1. MEMS
12.4.2. PCB
12.4.3. IC
12.4.4. Photoelectron
12.4.5. Others
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Plating for Microelectronics Market Size and Volume Forecast by Type
12.7.1. Gold
12.7.2. Zinc
12.7.3. Nickel
12.7.4. Bronze
12.7.5. Tin
12.7.6. Copper
12.7.7. Others
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Plating for Microelectronics Demand Share, 2019-2026
13. Middle East & Africa Plating for Microelectronics Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Plating for Microelectronics Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Plating for Microelectronics Market Size and Volume Forecast by Application
13.4.1. MEMS
13.4.2. PCB
13.4.3. IC
13.4.4. Photoelectron
13.4.5. Others
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Plating for Microelectronics Market Size and Volume Forecast by Type
13.7.1. Gold
13.7.2. Zinc
13.7.3. Nickel
13.7.4. Bronze
13.7.5. Tin
13.7.6. Copper
13.7.7. Others
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Plating for Microelectronics Demand Share, 2019-2026
14. Competition Landscape
14.1. Global Plating for Microelectronics Market: Market Share Analysis
14.2. Plating for Microelectronics Distributors and Customers
14.3. Plating for Microelectronics Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. DowDuPont
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. Mitsubishi Materials Corporation
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. Heraeus
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. XiLong Scientific
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. Atotech
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. Yamato Denki
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. Meltex
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. Ishihara Chemical
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. Raschig GmbH
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. Japan Pure Chemical
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. Coatech
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. MAGNETO special anodes
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. Vopelius Chemie AG
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. Moses Lake Industries
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. JCU International
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. COMPANY 16
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
