Market Overview:
The global power module packaging market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The market growth can be attributed to the increasing demand for electric vehicles and hybrid electric vehicles, rising investments in renewable energy sources such as wind turbines and photovoltaic equipment, and growing concerns about climate change. The global power module packaging market is segmented on the basis of type into GaN modules, SiC modules, FET modules, IGBT modules, and thyristors. The GaN module segment is expected to grow at the highest CAGR during the forecast period owing to its high efficiency and low cost as compared to other types of modules. On the basis of application, the market is divided into electric vehicles (EV)/hybrid electric vehicles (HEV), motors, rail traction systems, wind turbines, and photovoltaic equipment.
Product Definition:
Power module packaging is the technology that is used to protect and house power modules. These packages are important because they protect the modules from damage, allow for efficient heat dissipation, and provide a means of connecting the modules to other components.
GaN Module:
GaN module is a power electronic device that works on the principle of super-high voltage and current. It has high thermal stability, excellent electrical characteristics, and low loss features which make it suitable for various applications in Power Module Packaging (PMP) market. GaN modules are used in PMP devices such as electric vehicles (EV), Uninterruptible Power Supply (UPS), solar power systems etc.
SiC Module:
The Silicon Carbide (SiC) module is a power device that utilizes the silicon carbide semiconductor material for generating electric energy. It has several advantages over traditional power devices such as higher efficiency, less weight, and lower noise. SiC modules are used in applications where high-power density is required along with low heat loss and high operating temperature.
Application Insights:
Electric vehicles (EV) and hybrid electric vehicles (HEV) accounted for the largest market share of power module packaging applications in 2017. The growing demand for compact, lightweight and energy-efficient packaged products is expected to drive the growth of this segment over the forecast period.
The motors segment is anticipated to witness significant growth over the forecast period owing to increasing demand from industrial as well as commercial sectors. Rising penetration of renewable energy sources such as wind turbines along with rising concerns regarding environmental pollution are expected to propel product demand in this application segment over the coming years.
Power modules used in rail traction equipment offer various benefits including high efficiency, low operating cost, small size and weight reduction which makes them highly suitable for use across a wide range of railway applications including Metros & Trains, Rapid Rail Transit Systems (RRTS), Light Rail Vehicles (LRVs), Monorails etc.
Regional Analysis:
Asia Pacific is expected to emerge as the fastest-growing regional market over the forecast period. The growth can be attributed to increasing demand for energy storage systems and electric vehicles in countries, such as China and India. In 2016, China accounted for a share of more than 20% of global EV sales. Moreover, with rising investments in wind farms across various countries including China and Japan, power modules are projected to gain traction in this region.
North America is estimated to account for a significant market share by 2030 owing to high penetration rates of electric vehicles along with growing adoption rates of solar panels across U.S., Canada, Mexico). Europe also has considerable potential due to growing demand from major application sectors including transportation sector (automobile), industrial sector (motor drives), etc.). Rising awareness regarding environment protection coupled with stringent government regulations on carbon emissions from power generation sources are likely boost industry growth over the next eight years (2030).
Growth Factors:
- Increasing demand for electric vehicles
- Rising demand from the telecommunications and data center sectors
- Growing popularity of miniaturized and high-density packaging solutions
- Proliferation of next-generation technologies, such as 5G, AI, and IoT
- Advances in materials science that enable new packaging designs
Scope Of The Report
Report Attributes
Report Details
Report Title
Power Module Packaging Market Research Report
By Type
GaN Module, SiC Module, FET Module, IGBT Module, Thyristors
By Application
Electric Vehicles (EV)/Hybrid Electric Vehicles (HEV), Motors, Rail Tractions, Wind Turbines, Photovoltaic Equipment
By Companies
Texas Instruments Incorporated, Star Automations, DyDac Controls, SEMIKRON, IXYS Corporation, Infineon Technologies AG, Mitsubishi Electric Corporation, Fuji Electric Co. Ltd., Sanken Electric Co., Ltd., SanRex Corporation
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
248
Number of Tables & Figures
174
Customization Available
Yes, the report can be customized as per your need.
Global Power Module Packaging Market Report Segments:
The global Power Module Packaging market is segmented on the basis of:
Types
GaN Module, SiC Module, FET Module, IGBT Module, Thyristors
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Electric Vehicles (EV)/Hybrid Electric Vehicles (HEV), Motors, Rail Tractions, Wind Turbines, Photovoltaic Equipment
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Texas Instruments Incorporated
- Star Automations
- DyDac Controls
- SEMIKRON
- IXYS Corporation
- Infineon Technologies AG
- Mitsubishi Electric Corporation
- Fuji Electric Co. Ltd.
- Sanken Electric Co., Ltd.
- SanRex Corporation
Highlights of The Power Module Packaging Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- GaN Module
- SiC Module
- FET Module
- IGBT Module
- Thyristors
- By Application:
- Electric Vehicles (EV)/Hybrid Electric Vehicles (HEV)
- Motors
- Rail Tractions
- Wind Turbines
- Photovoltaic Equipment
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Power Module Packaging Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Power Module Packaging is a packaging technique used to protect electronic devices from physical damage and environmental conditions. The package typically includes an outer shell, a heat-sealed thermal interface material (TIM), and the device itself. Power Module Packaging helps to ensure that the device remains operational in extreme environments, such as high temperatures or humidity levels.
Some of the major players in the power module packaging market are Texas Instruments Incorporated, Star Automations, DyDac Controls, SEMIKRON, IXYS Corporation, Infineon Technologies AG, Mitsubishi Electric Corporation, Fuji Electric Co. Ltd., Sanken Electric Co., Ltd., SanRex Corporation.
The power module packaging market is expected to grow at a compound annual growth rate of 6.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Power Module Packaging Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Power Module Packaging Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Power Module Packaging Market - Supply Chain
4.5. Global Power Module Packaging Market Forecast
4.5.1. Power Module Packaging Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Power Module Packaging Market Size (000 Units) and Y-o-Y Growth
4.5.3. Power Module Packaging Market Absolute $ Opportunity
5. Global Power Module Packaging Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Power Module Packaging Market Size and Volume Forecast by Type
5.3.1. GaN Module
5.3.2. SiC Module
5.3.3. FET Module
5.3.4. IGBT Module
5.3.5. Thyristors
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Power Module Packaging Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Power Module Packaging Market Size and Volume Forecast by Application
6.3.1. Electric Vehicles (EV)/Hybrid Electric Vehicles (HEV)
6.3.2. Motors
6.3.3. Rail Tractions
6.3.4. Wind Turbines
6.3.5. Photovoltaic Equipment
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Power Module Packaging Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Power Module Packaging Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Power Module Packaging Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Power Module Packaging Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Power Module Packaging Demand Share Forecast, 2019-2026
9. North America Power Module Packaging Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Power Module Packaging Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Power Module Packaging Market Size and Volume Forecast by Application
9.4.1. Electric Vehicles (EV)/Hybrid Electric Vehicles (HEV)
9.4.2. Motors
9.4.3. Rail Tractions
9.4.4. Wind Turbines
9.4.5. Photovoltaic Equipment
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Power Module Packaging Market Size and Volume Forecast by Type
9.7.1. GaN Module
9.7.2. SiC Module
9.7.3. FET Module
9.7.4. IGBT Module
9.7.5. Thyristors
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Power Module Packaging Demand Share Forecast, 2019-2026
10. Latin America Power Module Packaging Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Power Module Packaging Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Power Module Packaging Market Size and Volume Forecast by Application
10.4.1. Electric Vehicles (EV)/Hybrid Electric Vehicles (HEV)
10.4.2. Motors
10.4.3. Rail Tractions
10.4.4. Wind Turbines
10.4.5. Photovoltaic Equipment
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Power Module Packaging Market Size and Volume Forecast by Type
10.7.1. GaN Module
10.7.2. SiC Module
10.7.3. FET Module
10.7.4. IGBT Module
10.7.5. Thyristors
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Power Module Packaging Demand Share Forecast, 2019-2026
11. Europe Power Module Packaging Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Power Module Packaging Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Power Module Packaging Market Size and Volume Forecast by Application
11.4.1. Electric Vehicles (EV)/Hybrid Electric Vehicles (HEV)
11.4.2. Motors
11.4.3. Rail Tractions
11.4.4. Wind Turbines
11.4.5. Photovoltaic Equipment
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Power Module Packaging Market Size and Volume Forecast by Type
11.7.1. GaN Module
11.7.2. SiC Module
11.7.3. FET Module
11.7.4. IGBT Module
11.7.5. Thyristors
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Power Module Packaging Demand Share, 2019-2026
12. Asia Pacific Power Module Packaging Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Power Module Packaging Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Power Module Packaging Market Size and Volume Forecast by Application
12.4.1. Electric Vehicles (EV)/Hybrid Electric Vehicles (HEV)
12.4.2. Motors
12.4.3. Rail Tractions
12.4.4. Wind Turbines
12.4.5. Photovoltaic Equipment
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Power Module Packaging Market Size and Volume Forecast by Type
12.7.1. GaN Module
12.7.2. SiC Module
12.7.3. FET Module
12.7.4. IGBT Module
12.7.5. Thyristors
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Power Module Packaging Demand Share, 2019-2026
13. Middle East & Africa Power Module Packaging Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Power Module Packaging Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Power Module Packaging Market Size and Volume Forecast by Application
13.4.1. Electric Vehicles (EV)/Hybrid Electric Vehicles (HEV)
13.4.2. Motors
13.4.3. Rail Tractions
13.4.4. Wind Turbines
13.4.5. Photovoltaic Equipment
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Power Module Packaging Market Size and Volume Forecast by Type
13.7.1. GaN Module
13.7.2. SiC Module
13.7.3. FET Module
13.7.4. IGBT Module
13.7.5. Thyristors
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Power Module Packaging Demand Share, 2019-2026
14. Competition Landscape
14.1. Global Power Module Packaging Market: Market Share Analysis
14.2. Power Module Packaging Distributors and Customers
14.3. Power Module Packaging Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. Texas Instruments Incorporated
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. Star Automations
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. DyDac Controls
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. SEMIKRON
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. IXYS Corporation
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. Infineon Technologies AG
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. Mitsubishi Electric Corporation
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. Fuji Electric Co. Ltd.
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. Sanken Electric Co., Ltd.
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. SanRex Corporation
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. COMPANY 11
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. COMPANY 12
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. COMPANY 13
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. COMPANY 14
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. COMPANY 15
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. COMPANY 16
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
