Industry Growth Insights published a new data on “PUR Adhesive in Electronics Industry Market”. The research report is titled “PUR Adhesive in Electronics Industry Market research by Types (Electrically Conductive Adhesives, Thermally Conductive Adhesives, UV Curing Adhesives, Other), By Applications (Surface Mounting, Conformal Coatings, Wire Tacking, Potting, Encapsulation, Other), By Players/Companies BASF, Dow Corning, DuPont, Henkel, Laird Technologies, Croda International, Datum Phase Change, Kaplan Energy, AI Technology, Phase Change Products, Phase Change Energy Solutions, Shenzhen Aochuan Technology, Shin-Etsu Chemical”.
Scope Of The Report
Report Attributes
Report Details
Report Title
PUR Adhesive in Electronics Industry Market Research Report
By Type
Electrically Conductive Adhesives, Thermally Conductive Adhesives, UV Curing Adhesives, Other
By Application
Surface Mounting, Conformal Coatings, Wire Tacking, Potting, Encapsulation, Other
By Companies
BASF, Dow Corning, DuPont, Henkel, Laird Technologies, Croda International, Datum Phase Change, Kaplan Energy, AI Technology, Phase Change Products, Phase Change Energy Solutions, Shenzhen Aochuan Technology, Shin-Etsu Chemical
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
234
Number of Tables & Figures
164
Customization Available
Yes, the report can be customized as per your need.
Global PUR Adhesive in Electronics Industry Market Report Segments:
The global PUR Adhesive in Electronics Industry market is segmented on the basis of:
Types
Electrically Conductive Adhesives, Thermally Conductive Adhesives, UV Curing Adhesives, Other
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Surface Mounting, Conformal Coatings, Wire Tacking, Potting, Encapsulation, Other
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- BASF
- Dow Corning
- DuPont
- Henkel
- Laird Technologies
- Croda International
- Datum Phase Change
- Kaplan Energy
- AI Technology
- Phase Change Products
- Phase Change Energy Solutions
- Shenzhen Aochuan Technology
- Shin-Etsu Chemical
Highlights of The PUR Adhesive in Electronics Industry Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Electrically Conductive Adhesives
- Thermally Conductive Adhesives
- UV Curing Adhesives
- Other
- By Application:
- Surface Mounting
- Conformal Coatings
- Wire Tacking
- Potting
- Encapsulation
- Other
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the PUR Adhesive in Electronics Industry Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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- Correctly Positioning New Products
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
PUR adhesive is a type of adhesive used in the electronics industry. It is a strong, fast-drying adhesive that can be used to attach parts together.
Some of the key players operating in the pur adhesive in electronics industry market are BASF, Dow Corning, DuPont, Henkel, Laird Technologies, Croda International, Datum Phase Change, Kaplan Energy, AI Technology, Phase Change Products, Phase Change Energy Solutions, Shenzhen Aochuan Technology, Shin-Etsu Chemical.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. PUR Adhesive in Electronics Industry Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. PUR Adhesive in Electronics Industry Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. PUR Adhesive in Electronics Industry Market - Supply Chain
4.5. Global PUR Adhesive in Electronics Industry Market Forecast
4.5.1. PUR Adhesive in Electronics Industry Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. PUR Adhesive in Electronics Industry Market Size (000 Units) and Y-o-Y Growth
4.5.3. PUR Adhesive in Electronics Industry Market Absolute $ Opportunity
5. Global PUR Adhesive in Electronics Industry Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. PUR Adhesive in Electronics Industry Market Size and Volume Forecast by Type
5.3.1. Electrically Conductive Adhesives
5.3.2. Thermally Conductive Adhesives
5.3.3. UV Curing Adhesives
5.3.4. Other
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global PUR Adhesive in Electronics Industry Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. PUR Adhesive in Electronics Industry Market Size and Volume Forecast by Application
6.3.1. Surface Mounting
6.3.2. Conformal Coatings
6.3.3. Wire Tacking
6.3.4. Potting
6.3.5. Encapsulation
6.3.6. Other
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global PUR Adhesive in Electronics Industry Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. PUR Adhesive in Electronics Industry Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global PUR Adhesive in Electronics Industry Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. PUR Adhesive in Electronics Industry Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global PUR Adhesive in Electronics Industry Demand Share Forecast, 2019-2026
9. North America PUR Adhesive in Electronics Industry Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America PUR Adhesive in Electronics Industry Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America PUR Adhesive in Electronics Industry Market Size and Volume Forecast by Application
9.4.1. Surface Mounting
9.4.2. Conformal Coatings
9.4.3. Wire Tacking
9.4.4. Potting
9.4.5. Encapsulation
9.4.6. Other
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America PUR Adhesive in Electronics Industry Market Size and Volume Forecast by Type
9.7.1. Electrically Conductive Adhesives
9.7.2. Thermally Conductive Adhesives
9.7.3. UV Curing Adhesives
9.7.4. Other
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America PUR Adhesive in Electronics Industry Demand Share Forecast, 2019-2026
10. Latin America PUR Adhesive in Electronics Industry Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America PUR Adhesive in Electronics Industry Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America PUR Adhesive in Electronics Industry Market Size and Volume Forecast by Application
10.4.1. Surface Mounting
10.4.2. Conformal Coatings
10.4.3. Wire Tacking
10.4.4. Potting
10.4.5. Encapsulation
10.4.6. Other
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America PUR Adhesive in Electronics Industry Market Size and Volume Forecast by Type
10.7.1. Electrically Conductive Adhesives
10.7.2. Thermally Conductive Adhesives
10.7.3. UV Curing Adhesives
10.7.4. Other
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America PUR Adhesive in Electronics Industry Demand Share Forecast, 2019-2026
11. Europe PUR Adhesive in Electronics Industry Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe PUR Adhesive in Electronics Industry Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe PUR Adhesive in Electronics Industry Market Size and Volume Forecast by Application
11.4.1. Surface Mounting
11.4.2. Conformal Coatings
11.4.3. Wire Tacking
11.4.4. Potting
11.4.5. Encapsulation
11.4.6. Other
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe PUR Adhesive in Electronics Industry Market Size and Volume orecast by Type
11.7.1. Electrically Conductive Adhesives
11.7.2. Thermally Conductive Adhesives
11.7.3. UV Curing Adhesives
11.7.4. Other
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe PUR Adhesive in Electronics Industry Demand Share, 2019-2026
12. Asia Pacific PUR Adhesive in Electronics Industry Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific PUR Adhesive in Electronics Industry Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific PUR Adhesive in Electronics Industry Market Size and Volume Forecast by Application
12.4.1. Surface Mounting
12.4.2. Conformal Coatings
12.4.3. Wire Tacking
12.4.4. Potting
12.4.5. Encapsulation
12.4.6. Other
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific PUR Adhesive in Electronics Industry Market Size and Volume Forecast by Type
12.7.1. Electrically Conductive Adhesives
12.7.2. Thermally Conductive Adhesives
12.7.3. UV Curing Adhesives
12.7.4. Other
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific PUR Adhesive in Electronics Industry Demand Share, 2019-2026
13. Middle East & Africa PUR Adhesive in Electronics Industry Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa PUR Adhesive in Electronics Industry Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa PUR Adhesive in Electronics Industry Market Size and Volume Forecast by Application
13.4.1. Surface Mounting
13.4.2. Conformal Coatings
13.4.3. Wire Tacking
13.4.4. Potting
13.4.5. Encapsulation
13.4.6. Other
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa PUR Adhesive in Electronics Industry Market Size and Volume Forecast by Type
13.7.1. Electrically Conductive Adhesives
13.7.2. Thermally Conductive Adhesives
13.7.3. UV Curing Adhesives
13.7.4. Other
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa PUR Adhesive in Electronics Industry Demand Share, 2019-2026
14. Competition Landscape
14.1. Global PUR Adhesive in Electronics Industry Market: Market Share Analysis
14.2. PUR Adhesive in Electronics Industry Distributors and Customers
14.3. PUR Adhesive in Electronics Industry Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. BASF
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. Dow Corning
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. DuPont
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. Henkel
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. Laird Technologies
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. Croda International
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. Datum Phase Change
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. Kaplan Energy
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. AI Technology
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. Phase Change Products
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. Phase Change Energy Solutions
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. Shenzhen Aochuan Technology
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. Shin-Etsu Chemical
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. COMPANY 14
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. COMPANY 15
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. COMPANY 16
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
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