The global QFN package market is expected to grow at a CAGR of 5.5% during the forecast period, from 2021 to 2030. The growth of this market can be attributed to the increasing demand for wearable devices and portable devices, which are driving the demand for QFN packages in these applications. The increasing adoption of RFID technology in various industries is also expected to drive the growth of this market during the forecast period. The global QFN package market by type is segmented into AICAVITY QFN and Plastimoulded QFN. The AICAVITY QFN segment accounted for a share of over 50% in 2018 and is expected to maintain its dominance throughout the forecast period owing to its low cost-per-unit packaging solution with high reliability features such as hermetic sealing, high thermal conductivity, and low dielectric constant.
Some Of The Growth Factors Of This Market:
- QFN package is a type of surface mount technology (SMT) package that has no leads and is flat.
- The QFN package is used in the electronics industry for integrated circuits, such as microprocessors, memory chips, and other semiconductor devices.
- The QFN package can be made by using a variety of materials including ceramic, plastic or metal.
- The QFN packages are usually made with a molding process that involves injection molding or transfer molding to create the desired shape and size of the device's body with an insulating layer on top to protect it from short-circuits caused by contact with other components on the circuit board during assembly.
- There are many benefits to using this type of packaging including: low cost per unit area; small size; high reliability; good thermal stability.
Industry Growth Insights published a new data on “Quad Flat No-leads (QFN) Package Market”. The research report is titled “Quad Flat No-leads (QFN) Package Market research by Types (Air-cavity QFN, Plastic-moulded QFN), By Applications (Radio Frequency Devices, Wearable Devices, Portable Devices, Others), By Players/Companies Amkor Technology, Texas Instruments, STATS ChipPAC Pte. Ltd, Microchip Technology Inc., ASE Group, NXP Semiconductor, Fujitsu Ltd., Toshiba Corporation, UTAC Group, Linear Technology Corporation, Henkel AG & Co., Broadcom Limited”.
Scope Of The Report
Report Attributes
Report Details
Report Title
Quad Flat No-leads (QFN) Package Market Research Report
By Type
Air-cavity QFN, Plastic-moulded QFN
By Application
Radio Frequency Devices, Wearable Devices, Portable Devices, Others
By Companies
Amkor Technology, Texas Instruments, STATS ChipPAC Pte. Ltd, Microchip Technology Inc., ASE Group, NXP Semiconductor, Fujitsu Ltd., Toshiba Corporation, UTAC Group, Linear Technology Corporation, Henkel AG & Co., Broadcom Limited
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
238
Number of Tables & Figures
167
Customization Available
Yes, the report can be customized as per your need.
Global Quad Flat No-leads (QFN) Package Market Report Segments:
The global Quad Flat No-leads (QFN) Package market is segmented on the basis of:
Types
Air-cavity QFN, Plastic-moulded QFN
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Radio Frequency Devices, Wearable Devices, Portable Devices, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Amkor Technology
- Texas Instruments
- STATS ChipPAC Pte. Ltd
- Microchip Technology Inc.
- ASE Group
- NXP Semiconductor
- Fujitsu Ltd.
- Toshiba Corporation
- UTAC Group
- Linear Technology Corporation
- Henkel AG & Co.
- Broadcom Limited
Highlights of The Quad Flat No-leads (QFN) Package Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Air-cavity QFN
- Plastic-moulded QFN
- By Application:
- Radio Frequency Devices
- Wearable Devices
- Portable Devices
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Quad Flat No-leads (QFN) Package Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
A Quad Flat No-leads (QFN) package is a small, thin, square package that has four leads on each side. QFN packages are used to house electronic components and can be found in a variety of shapes and sizes.
Some of the key players operating in the quad flat no-leads (qfn) package market are Amkor Technology, Texas Instruments, STATS ChipPAC Pte. Ltd, Microchip Technology Inc., ASE Group, NXP Semiconductor, Fujitsu Ltd., Toshiba Corporation, UTAC Group, Linear Technology Corporation, Henkel AG & Co., Broadcom Limited.
The quad flat no-leads (qfn) package market is expected to register a CAGR of 5.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Quad Flat No-leads (QFN) Package Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Quad Flat No-leads (QFN) Package Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Quad Flat No-leads (QFN) Package Market - Supply Chain
4.5. Global Quad Flat No-leads (QFN) Package Market Forecast
4.5.1. Quad Flat No-leads (QFN) Package Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Quad Flat No-leads (QFN) Package Market Size (000 Units) and Y-o-Y Growth
4.5.3. Quad Flat No-leads (QFN) Package Market Absolute $ Opportunity
5. Global Quad Flat No-leads (QFN) Package Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Quad Flat No-leads (QFN) Package Market Size and Volume Forecast by Type
5.3.1. Air-cavity QFN
5.3.2. Plastic-moulded QFN
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Quad Flat No-leads (QFN) Package Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Quad Flat No-leads (QFN) Package Market Size and Volume Forecast by Application
6.3.1. Radio Frequency Devices
6.3.2. Wearable Devices
6.3.3. Portable Devices
6.3.4. Others
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Quad Flat No-leads (QFN) Package Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Quad Flat No-leads (QFN) Package Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Quad Flat No-leads (QFN) Package Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Quad Flat No-leads (QFN) Package Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Quad Flat No-leads (QFN) Package Demand Share Forecast, 2019-2026
9. North America Quad Flat No-leads (QFN) Package Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Quad Flat No-leads (QFN) Package Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Quad Flat No-leads (QFN) Package Market Size and Volume Forecast by Application
9.4.1. Radio Frequency Devices
9.4.2. Wearable Devices
9.4.3. Portable Devices
9.4.4. Others
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Quad Flat No-leads (QFN) Package Market Size and Volume Forecast by Type
9.7.1. Air-cavity QFN
9.7.2. Plastic-moulded QFN
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Quad Flat No-leads (QFN) Package Demand Share Forecast, 2019-2026
10. Latin America Quad Flat No-leads (QFN) Package Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Quad Flat No-leads (QFN) Package Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Quad Flat No-leads (QFN) Package Market Size and Volume Forecast by Application
10.4.1. Radio Frequency Devices
10.4.2. Wearable Devices
10.4.3. Portable Devices
10.4.4. Others
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Quad Flat No-leads (QFN) Package Market Size and Volume Forecast by Type
10.7.1. Air-cavity QFN
10.7.2. Plastic-moulded QFN
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Quad Flat No-leads (QFN) Package Demand Share Forecast, 2019-2026
11. Europe Quad Flat No-leads (QFN) Package Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Quad Flat No-leads (QFN) Package Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Quad Flat No-leads (QFN) Package Market Size and Volume Forecast by Application
11.4.1. Radio Frequency Devices
11.4.2. Wearable Devices
11.4.3. Portable Devices
11.4.4. Others
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Quad Flat No-leads (QFN) Package Market Size and Volume Forecast by Type
11.7.1. Air-cavity QFN
11.7.2. Plastic-mouldedQFN
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Quad Flat No-leads (QFN) Package Demand Share, 2019-2026
12. Asia Pacific Quad Flat No-leads (QFN) Package Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Quad Flat No-leads (QFN) Package Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Quad Flat No-leads (QFN) Package Market Size and Volume Forecast by Application
12.4.1. Radio Frequency Devices
12.4.2. Wearable Devices
12.4.3. Portable Devices
12.4.4. Others
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Quad Flat No-leads (QFN) Package Market Size and Volume Forecast by Type
12.7.1. Air-cavity QFN
12.7.2. Plastic-moulded QFN
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Quad Flat No-leads (QFN) Package Demand Share, 2019-2026
13. Middle East & Africa Quad Flat No-leads (QFN) Package Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Quad Flat No-leads (QFN) Package Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Quad Flat No-leads (QFN) Package Market Size and Volume Forecast by Application
13.4.1. Radio Frequency Devices
13.4.2. Wearable Devices
13.4.3. Portable Devices
13.4.4. Others
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Quad Flat No-leads (QFN) Package Market Size and Volume Forecast by Type
13.7.1. Air-cavity QFN
13.7.2. Plastic-moulded QFN
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Quad Flat No-leads (QFN) Package Demand Share, 2019-2026
14. Competition Landscape
14.1. Global Quad Flat No-leads (QFN) Package Market: Market Share Analysis
14.2. Quad Flat No-leads (QFN) Package Distributors and Customers
14.3. Quad Flat No-leads (QFN) Package Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. Amkor Technology
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. Texas Instruments
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. STATS ChipPAC Pte. Ltd
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. Microchip Technology Inc.
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. ASE Group
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. NXP Semiconductor
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. Fujitsu Ltd.
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. Toshiba Corporation
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. UTAC Group
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. Linear Technology Corporation
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. Henkel AG & Co.
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. Broadcom Limited
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. COMPANY 13
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. COMPANY 14
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. COMPANY 15
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. COMPANY 16
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook