Industry Growth Insights published a new data on “Radiation-Hardened Electronic Components Market”. The research report is titled “Radiation-Hardened Electronic Components Market research by Types (Silicon, Silicon Carbide, Gallium Nitride, Others), By Applications (Aerospace and Defense, Medical, Consumer Electronics, Industrial, Others), By Players/Companies Honeywell International, BAE Systems, Analog Devices, Texas Instruments, Atmel, Renesas Electronics, STMicroelectronics, Microsemi, Xilinx, Cobham, VPT, Data Device Corporation (DDC), Intersil, Maxwell Technologies”.
Scope Of The Report
Report Attributes
Report Details
Report Title
Radiation-Hardened Electronic Components Market Research Report
By Type
Silicon, Silicon Carbide, Gallium Nitride, Others
By Application
Aerospace and Defense, Medical, Consumer Electronics, Industrial, Others
By Companies
Honeywell International, BAE Systems, Analog Devices, Texas Instruments, Atmel, Renesas Electronics, STMicroelectronics, Microsemi, Xilinx, Cobham, VPT, Data Device Corporation (DDC), Intersil, Maxwell Technologies
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
249
Number of Tables & Figures
175
Customization Available
Yes, the report can be customized as per your need.
Global Radiation-Hardened Electronic Components Market Report Segments:
The global Radiation-Hardened Electronic Components market is segmented on the basis of:
Types
Silicon, Silicon Carbide, Gallium Nitride, Others
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Aerospace and Defense, Medical, Consumer Electronics, Industrial, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Honeywell International
- BAE Systems
- Analog Devices
- Texas Instruments
- Atmel
- Renesas Electronics
- STMicroelectronics
- Microsemi
- Xilinx
- Cobham
- VPT
- Data Device Corporation (DDC)
- Intersil
- Maxwell Technologies
Highlights of The Radiation-Hardened Electronic Components Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Silicon
- Silicon Carbide
- Gallium Nitride
- Others
- By Application:
- Aerospace and Defense
- Medical
- Consumer Electronics
- Industrial
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Radiation-Hardened Electronic Components Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Radiation-hardened electronic components are those that have been designed to withstand the effects of radiation. This includes both natural and man-made radiation.
Some of the major companies in the radiation-hardened electronic components market are Honeywell International, BAE Systems, Analog Devices, Texas Instruments, Atmel, Renesas Electronics, STMicroelectronics, Microsemi, Xilinx, Cobham, VPT, Data Device Corporation (DDC), Intersil, Maxwell Technologies.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Radiation-Hardened Electronic Components Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Radiation-Hardened Electronic Components Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Radiation-Hardened Electronic Components Market - Supply Chain
4.5. Global Radiation-Hardened Electronic Components Market Forecast
4.5.1. Radiation-Hardened Electronic Components Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Radiation-Hardened Electronic Components Market Size (000 Units) and Y-o-Y Growth
4.5.3. Radiation-Hardened Electronic Components Market Absolute $ Opportunity
5. Global Radiation-Hardened Electronic Components Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Radiation-Hardened Electronic Components Market Size and Volume Forecast by Type
5.3.1. Silicon
5.3.2. Silicon Carbide
5.3.3. Gallium Nitride
5.3.4. Others
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Radiation-Hardened Electronic Components Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Radiation-Hardened Electronic Components Market Size and Volume Forecast by Application
6.3.1. Aerospace and Defense
6.3.2. Medical
6.3.3. Consumer Electronics
6.3.4. Industrial
6.3.5. Others
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Radiation-Hardened Electronic Components Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Radiation-Hardened Electronic Components Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Radiation-Hardened Electronic Components Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Radiation-Hardened Electronic Components Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Radiation-Hardened Electronic Components Demand Share Forecast, 2019-2029
9. North America Radiation-Hardened Electronic Components Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Radiation-Hardened Electronic Components Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Radiation-Hardened Electronic Components Market Size and Volume Forecast by Application
9.4.1. Aerospace and Defense
9.4.2. Medical
9.4.3. Consumer Electronics
9.4.4. Industrial
9.4.5. Others
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Radiation-Hardened Electronic Components Market Size and Volume Forecast by Type
9.7.1. Silicon
9.7.2. Silicon Carbide
9.7.3. Gallium Nitride
9.7.4. Others
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Radiation-Hardened Electronic Components Demand Share Forecast, 2019-2029
10. Latin America Radiation-Hardened Electronic Components Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Radiation-Hardened Electronic Components Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Radiation-Hardened Electronic Components Market Size and Volume Forecast by Application
10.4.1. Aerospace and Defense
10.4.2. Medical
10.4.3. Consumer Electronics
10.4.4. Industrial
10.4.5. Others
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Radiation-Hardened Electronic Components Market Size and Volume Forecast by Type
10.7.1. Silicon
10.7.2. Silicon Carbide
10.7.3. Gallium Nitride
10.7.4. Others
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Radiation-Hardened Electronic Components Demand Share Forecast, 2019-2029
11. Europe Radiation-Hardened Electronic Components Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Radiation-Hardened Electronic Components Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Radiation-Hardened Electronic Components Market Size and Volume Forecast by Application
11.4.1. Aerospace and Defense
11.4.2. Medical
11.4.3. Consumer Electronics
11.4.4. Industrial
11.4.5. Others
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Radiation-Hardened Electronic Components Market Size and Volume Forecast by Type
11.7.1. Silicon
11.7.2. Silicon Carbide
11.7.3. Gallium Nitride
11.7.4. Others
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Radiation-Hardened Electronic Components Demand Share, 2019-2029
12. Asia Pacific Radiation-Hardened Electronic Components Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Radiation-Hardened Electronic Components Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Radiation-Hardened Electronic Components Market Size and Volume Forecast by Application
12.4.1. Aerospace and Defense
12.4.2. Medical
12.4.3. Consumer Electronics
12.4.4. Industrial
12.4.5. Others
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Radiation-Hardened Electronic Components Market Size and Volume Forecast by Type
12.7.1. Silicon
12.7.2. Silicon Carbide
12.7.3. Gallium Nitride
12.7.4. Others
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Radiation-Hardened Electronic Components Demand Share, 2019-2029
13. Middle East & Africa Radiation-Hardened Electronic Components Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Radiation-Hardened Electronic Components Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Radiation-Hardened Electronic Components Market Size and Volume Forecast by Application
13.4.1. Aerospace and Defense
13.4.2. Medical
13.4.3. Consumer Electronics
13.4.4. Industrial
13.4.5. Others
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Radiation-Hardened Electronic Components Market Size and Volume Forecast by Type
13.7.1. Silicon
13.7.2. Silicon Carbide
13.7.3. Gallium Nitride
13.7.4. Others
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Radiation-Hardened Electronic Components Demand Share, 2019-2029
14. Competition Landscape
14.1. Global Radiation-Hardened Electronic Components Market: Market Share Analysis
14.2. Radiation-Hardened Electronic Components Distributors and Customers
14.3. Radiation-Hardened Electronic Components Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. Honeywell International
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. BAE Systems
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. Analog Devices
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. Texas Instruments
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. Atmel
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. Renesas Electronics
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. STMicroelectronics
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. Microsemi
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. Xilinx
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. Cobham
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. VPT
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. Data Device Corporation (DDC)
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. Intersil
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. Maxwell Technologies
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. COMPANY 15
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. COMPANY 16
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook