The global semiconductor assembly and test equipment market is expected to grow at a CAGR of 4.5% during the forecast period, from 2021 to 2030. The growth in this market is driven by the increasing demand for semiconductors in various applications such as smartphones, tablets, laptops, and other consumer electronics devices. The increasing demand for these devices has led to an increase in the number of semiconductor manufacturers that are outsourcing their assembly and test operations to third-party companies. This trend is expected to continue over the next few years due to rising labor costs in China and other countries where most of these operations are outsourced.
The global semiconductor assembly and test equipment market can be segmented on the basis of type into wafer probe station, die bonder, dicing machine, test handler, sorter; on application into integrated device manufacturer (IDMs) or outsourced semiconductor assembly and test (OSAT); on region into North America (NA), Latin America (LA), Europe (EU), Asia Pacific & Middle East & Africa (APMEA).
- The semiconductor industry is one of the fastest growing industries in the world.
- The increasing demand for smartphones and tablets has led to an increase in demand for semiconductors, which has led to an increase in demand for semiconductor assembly and test equipment.
- Increasing investments by governments into research and development will also lead to growth in the market.
- Increasing investments by private companies into research and development will also lead to growth in the market.
Industry Growth Insights published a new data on “Semiconductor Assembly and Test Equipment Market”. The research report is titled “Semiconductor Assembly and Test Equipment Market research by Types (Wafer Probe Station, Die Bonder, Dicing Machine, Test handler, Sorter, Others), By Applications (Integrated Device Manufacturer (IDMs), Outsourced Semiconductor Assembly and Test (OSAT)), By Players/Companies ASM Pacific Technology, Kulicke & Soffa Industries, Besi, ACCRETECH, SHINKAWA, Palomar Technologies, Hesse Mechatronics, Toray Engineering, West Bond, HYBOND, DIAS Automation, Teradyne, Advantest, LTX-Credence, Cohu, Astronics, Chroma, SPEA, Averna, Shibasoku, ChangChuan, Macrotest, Huafeng”.
Scope Of The Report
Report Attributes
Report Details
Report Title
Semiconductor Assembly and Test Equipment Market Research Report
By Type
Wafer Probe Station, Die Bonder, Dicing Machine, Test handler, Sorter, Others
By Application
Integrated Device Manufacturer (IDMs), Outsourced Semiconductor Assembly and Test (OSAT)
By Companies
ASM Pacific Technology, Kulicke & Soffa Industries, Besi, ACCRETECH, SHINKAWA, Palomar Technologies, Hesse Mechatronics, Toray Engineering, West Bond, HYBOND, DIAS Automation, Teradyne, Advantest, LTX-Credence, Cohu, Astronics, Chroma, SPEA, Averna, Shibasoku, ChangChuan, Macrotest, Huafeng
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
237
Number of Tables & Figures
166
Customization Available
Yes, the report can be customized as per your need.
Global Semiconductor Assembly and Test Equipment Market Report Segments:
The global Semiconductor Assembly and Test Equipment market is segmented on the basis of:
Types
Wafer Probe Station, Die Bonder, Dicing Machine, Test handler, Sorter, Others
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Integrated Device Manufacturer (IDMs), Outsourced Semiconductor Assembly and Test (OSAT)
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- ASM Pacific Technology
- Kulicke & Soffa Industries
- Besi
- ACCRETECH
- SHINKAWA
- Palomar Technologies
- Hesse Mechatronics
- Toray Engineering
- West Bond
- HYBOND
- DIAS Automation
- Teradyne
- Advantest
- LTX-Credence
- Cohu
- Astronics
- Chroma
- SPEA
- Averna
- Shibasoku
- ChangChuan
- Macrotest
- Huafeng
Highlights of The Semiconductor Assembly and Test Equipment Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Wafer Probe Station
- Die Bonder
- Dicing Machine
- Test handler
- Sorter
- Others
- By Application:
- Integrated Device Manufacturer (IDMs)
- Outsourced Semiconductor Assembly and Test (OSAT)
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Semiconductor Assembly and Test Equipment Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Some of the major players in the semiconductor assembly and test equipment market are ASM Pacific Technology, Kulicke & Soffa Industries, Besi, ACCRETECH, SHINKAWA, Palomar Technologies, Hesse Mechatronics, Toray Engineering, West Bond, HYBOND, DIAS Automation, Teradyne, Advantest, LTX-Credence, Cohu, Astronics, Chroma, SPEA, Averna, Shibasoku, ChangChuan, Macrotest, Huafeng.
The semiconductor assembly and test equipment market is expected to grow at a compound annual growth rate of 4.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Semiconductor Assembly and Test Equipment Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Semiconductor Assembly and Test Equipment Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Semiconductor Assembly and Test Equipment Market - Supply Chain
4.5. Global Semiconductor Assembly and Test Equipment Market Forecast
4.5.1. Semiconductor Assembly and Test Equipment Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Semiconductor Assembly and Test Equipment Market Size (000 Units) and Y-o-Y Growth
4.5.3. Semiconductor Assembly and Test Equipment Market Absolute $ Opportunity
5. Global Semiconductor Assembly and Test Equipment Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Semiconductor Assembly and Test Equipment Market Size and Volume Forecast by Type
5.3.1. Wafer Probe Station
5.3.2. Die Bonder
5.3.3. Dicing Machine
5.3.4. Test handler
5.3.5. Sorter
5.3.6. Others
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Semiconductor Assembly and Test Equipment Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Semiconductor Assembly and Test Equipment Market Size and Volume Forecast by Application
6.3.1. Integrated Device Manufacturer (IDMs)
6.3.2. Outsourced Semiconductor Assembly and Test (OSAT)
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Semiconductor Assembly and Test Equipment Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Semiconductor Assembly and Test Equipment Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Semiconductor Assembly and Test Equipment Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Semiconductor Assembly and Test Equipment Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Semiconductor Assembly and Test Equipment Demand Share Forecast, 2019-2026
9. North America Semiconductor Assembly and Test Equipment Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Semiconductor Assembly and Test Equipment Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Semiconductor Assembly and Test Equipment Market Size and Volume Forecast by Application
9.4.1. Integrated Device Manufacturer (IDMs)
9.4.2. Outsourced Semiconductor Assembly and Test (OSAT)
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Semiconductor Assembly and Test Equipment Market Size and Volume Forecast by Type
9.7.1. Wafer Probe Station
9.7.2. Die Bonder
9.7.3. Dicing Machine
9.7.4. Test handler
9.7.5. Sorter
9.7.6. Others
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Semiconductor Assembly and Test Equipment Demand Share Forecast, 2019-2026
10. Latin America Semiconductor Assembly and Test Equipment Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Semiconductor Assembly and Test Equipment Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Semiconductor Assembly and Test Equipment Market Size and Volume Forecast by Application
10.4.1. Integrated Device Manufacturer (IDMs)
10.4.2. Outsourced Semiconductor Assembly and Test (OSAT)
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Semiconductor Assembly and Test Equipment Market Size and Volume Forecast by Type
10.7.1. Wafer Probe Station
10.7.2. Die Bonder
10.7.3. Dicing Machine
10.7.4. Test handler
10.7.5. Sorter
10.7.6. Others
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Semiconductor Assembly and Test Equipment Demand Share Forecast, 2019-2026
11. Europe Semiconductor Assembly and Test Equipment Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Semiconductor Assembly and Test Equipment Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Semiconductor Assembly and Test Equipment Market Size and Volume Forecast by Application
11.4.1. Integrated Device Manufacturer (IDMs)
11.4.2. Outsourced Semiconductor Assembly and Test (OSAT)
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Semiconductor Assembly and Test Equipment arket Size and Volume Forecast by Type
11.7.1. Wafer Probe Station
11.7.2. Die Bonder
11.7.3. Dicing Machine
11.7.4. Test handler
11.7.5. Sorter
11.7.6. Others
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Semiconductor Assembly and Test Equipment Demand Share, 2019-2026
12. Asia Pacific Semiconductor Assembly and Test Equipment Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Semiconductor Assembly and Test Equipment Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Semiconductor Assembly and Test Equipment Market Size and Volume Forecast by Application
12.4.1. Integrated Device Manufacturer (IDMs)
12.4.2. Outsourced Semiconductor Assembly and Test (OSAT)
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Semiconductor Assembly and Test Equipment Market Size and Volume Forecast by Type
12.7.1. Wafer Probe Station
12.7.2. Die Bonder
12.7.3. Dicing Machine
12.7.4. Test handler
12.7.5. Sorter
12.7.6. Others
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Semiconductor Assembly and Test Equipment Demand Share, 2019-2026
13. Middle East & Africa Semiconductor Assembly and Test Equipment Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Semiconductor Assembly and Test Equipment Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Semiconductor Assembly and Test Equipment Market Size and Volume Forecast by Application
13.4.1. Integrated Device Manufacturer (IDMs)
13.4.2. Outsourced Semiconductor Assembly and Test (OSAT)
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Semiconductor Assembly and Test Equipment Market Size and Volume Forecast by Type
13.7.1. Wafer Probe Station
13.7.2. Die Bonder
13.7.3. Dicing Machine
13.7.4. Test handler
13.7.5. Sorter
13.7.6. Others
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Semiconductor Assembly and Test Equipment Demand Share, 2019-2026
14. Competition Landscape
14.1. Global Semiconductor Assembly and Test Equipment Market: Market Share Analysis
14.2. Semiconductor Assembly and Test Equipment Distributors and Customers
14.3. Semiconductor Assembly and Test Equipment Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. ASM Pacific Technology
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. Kulicke & Soffa Industries
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. Besi
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. ACCRETECH
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. SHINKAWA
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. Palomar Technologies
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. Hesse Mechatronics
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. Toray Engineering
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. West Bond
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. HYBOND
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. DIAS Automation
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. Teradyne
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. Advantest
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. LTX-Credence
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. Cohu
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. Astronics
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. Chroma
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. SPEA
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. Averna
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. Shibasoku
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
