The global semiconductor assembly equipment market is expected to grow at a CAGR of 4.5% during the forecast period, from 2021 to 2030. The growth in this market is attributed to the increasing demand for semiconductors and the need for high-quality products. The die bonding equipment segment accounted for the largest share of this market in 2018, followed by inspection and dicing equipment, packaging equipment, wire bonding equipment, and plating equipment segments. Integrated device manufacturers (IDMs) are expected to account for the largest share of this market during the forecast period due to their requirement of high-quality products with low defect rates.
- The semiconductor industry is one of the fastest growing industries in the world.
- The increasing demand for smartphones and tablets has led to an increase in demand for semiconductors, which has increased the need for assembly equipment as well as other related products such as wafer fabrication equipment and packaging machinery.
- Increasing investments by governments and private companies in research and development activities will also fuel growth in this market over the forecast period.
- Technological advancements have led to a reduction in manufacturing costs, which has increased competitiveness among manufacturers.
Industry Growth Insights published a new data on “Semiconductor Assembly Equipment Market”. The research report is titled “Semiconductor Assembly Equipment Market research by Types (Die Bonding Equipment, Inspection and Dicing Equipment, Packaging Equipment, Wire Bonding Equipment, Plating Equipment, Other), By Applications (Integrated Device Manufacturer (IDMs), Outsourced Semiconductor Assembly and Testing (OSATs)), By Players/Companies ASM Pacific Technology, Kulicke & Soffa Industries, Palomar Technologies, Tokyo Electron, Tokyo Seimitsu, Besi, ChipMOS Technologies, DIAS Automation, Greatek Electronics, Hesse Mechatronics, Hybond, Shinkawa, Toray Engineering, West Bond”.
Scope Of The Report
Report Attributes
Report Details
Report Title
Semiconductor Assembly Equipment Market Research Report
By Type
Die Bonding Equipment, Inspection and Dicing Equipment, Packaging Equipment, Wire Bonding Equipment, Plating Equipment, Other
By Application
Integrated Device Manufacturer (IDMs), Outsourced Semiconductor Assembly and Testing (OSATs)
By Companies
ASM Pacific Technology, Kulicke & Soffa Industries, Palomar Technologies, Tokyo Electron, Tokyo Seimitsu, Besi, ChipMOS Technologies, DIAS Automation, Greatek Electronics, Hesse Mechatronics, Hybond, Shinkawa, Toray Engineering, West Bond
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
238
Number of Tables & Figures
167
Customization Available
Yes, the report can be customized as per your need.
Global Semiconductor Assembly Equipment Market Report Segments:
The global Semiconductor Assembly Equipment market is segmented on the basis of:
Types
Die Bonding Equipment, Inspection and Dicing Equipment, Packaging Equipment, Wire Bonding Equipment, Plating Equipment, Other
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Integrated Device Manufacturer (IDMs), Outsourced Semiconductor Assembly and Testing (OSATs)
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- ASM Pacific Technology
- Kulicke & Soffa Industries
- Palomar Technologies
- Tokyo Electron
- Tokyo Seimitsu
- Besi
- ChipMOS Technologies
- DIAS Automation
- Greatek Electronics
- Hesse Mechatronics
- Hybond
- Shinkawa
- Toray Engineering
- West Bond
Highlights of The Semiconductor Assembly Equipment Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Die Bonding Equipment
- Inspection and Dicing Equipment
- Packaging Equipment
- Wire Bonding Equipment
- Plating Equipment
- Other
- By Application:
- Integrated Device Manufacturer (IDMs)
- Outsourced Semiconductor Assembly and Testing (OSATs)
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Semiconductor Assembly Equipment Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Semiconductor assembly equipment is used to put together semiconductors, which are the building blocks of electronic devices. The equipment includes a variety of tools and machines that help workers place the transistors, diodes, capacitors and other components onto a printed circuit board.
Some of the key players operating in the semiconductor assembly equipment market are ASM Pacific Technology, Kulicke & Soffa Industries, Palomar Technologies, Tokyo Electron, Tokyo Seimitsu, Besi, ChipMOS Technologies, DIAS Automation, Greatek Electronics, Hesse Mechatronics, Hybond, Shinkawa, Toray Engineering, West Bond.
The semiconductor assembly equipment market is expected to register a CAGR of 4.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Semiconductor Assembly Equipment Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Semiconductor Assembly Equipment Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Semiconductor Assembly Equipment Market - Supply Chain
4.5. Global Semiconductor Assembly Equipment Market Forecast
4.5.1. Semiconductor Assembly Equipment Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Semiconductor Assembly Equipment Market Size (000 Units) and Y-o-Y Growth
4.5.3. Semiconductor Assembly Equipment Market Absolute $ Opportunity
5. Global Semiconductor Assembly Equipment Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Semiconductor Assembly Equipment Market Size and Volume Forecast by Type
5.3.1. Die Bonding Equipment
5.3.2. Inspection and Dicing Equipment
5.3.3. Packaging Equipment
5.3.4. Wire Bonding Equipment
5.3.5. Plating Equipment
5.3.6. Other
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Semiconductor Assembly Equipment Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Semiconductor Assembly Equipment Market Size and Volume Forecast by Application
6.3.1. Integrated Device Manufacturer (IDMs)
6.3.2. Outsourced Semiconductor Assembly and Testing (OSATs)
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Semiconductor Assembly Equipment Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Semiconductor Assembly Equipment Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Semiconductor Assembly Equipment Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Semiconductor Assembly Equipment Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Semiconductor Assembly Equipment Demand Share Forecast, 2019-2026
9. North America Semiconductor Assembly Equipment Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Semiconductor Assembly Equipment Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Semiconductor Assembly Equipment Market Size and Volume Forecast by Application
9.4.1. Integrated Device Manufacturer (IDMs)
9.4.2. Outsourced Semiconductor Assembly and Testing (OSATs)
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Semiconductor Assembly Equipment Market Size and Volume Forecast by Type
9.7.1. Die Bonding Equipment
9.7.2. Inspection and Dicing Equipment
9.7.3. Packaging Equipment
9.7.4. Wire Bonding Equipment
9.7.5. Plating Equipment
9.7.6. Other
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Semiconductor Assembly Equipment Demand Share Forecast, 2019-2026
10. Latin America Semiconductor Assembly Equipment Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Semiconductor Assembly Equipment Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Semiconductor Assembly Equipment Market Size and Volume Forecast by Application
10.4.1. Integrated Device Manufacturer (IDMs)
10.4.2. Outsourced Semiconductor Assembly and Testing (OSATs)
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Semiconductor Assembly Equipment Market Size and Volume Forecast by Type
10.7.1. Die Bonding Equipment
10.7.2. Inspection and Dicing Equipment
10.7.3. Packaging Equipment
10.7.4. Wire Bonding Equipment
10.7.5. Plating Equipment
10.7.6. Other
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Semiconductor Assembly Equipment Demand Share Forecast, 2019-2026
11. Europe Semiconductor Assembly Equipment Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Semiconductor Assembly Equipment Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Semiconductor Assembly Equipment Market Size and Volume Forecast by Application
11.4.1. Integrated Device Manufacturer (IDMs)
11.4.2. Outsourced Semiconductor Assembly and Testing (OSATs)
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Semiconductor Assembly Equipment Market Size and Volume Forecast by Type
11.7.1. Die Bonding Equipment
11.7.2. Inspection and Dicing Equipment
11.7.3. Packaging Equipment
11.7.4. Wire Bonding Equipment
11.7.5. Plating Equipment
11.7.6. Other
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Semiconductor Assembly Equipment Demand Share, 2019-2026
12. Asia Pacific Semiconductor Assembly Equipment Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Semiconductor Assembly Equipment Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Semiconductor Assembly Equipment Market Size and Volume Forecast by Application
12.4.1. Integrated Device Manufacturer (IDMs)
12.4.2. Outsourced Semiconductor Assembly and Testing (OSATs)
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Semiconductor Assembly Equipment Market Size and Volume Forecast by Type
12.7.1. Die Bonding Equipment
12.7.2. Inspection and Dicing Equipment
12.7.3. Packaging Equipment
12.7.4. Wire Bonding Equipment
12.7.5. Plating Equipment
12.7.6. Other
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Semiconductor Assembly Equipment Demand Share, 2019-2026
13. Middle East & Africa Semiconductor Assembly Equipment Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Semiconductor Assembly Equipment Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Semiconductor Assembly Equipment Market Size and Volume Forecast by Application
13.4.1. Integrated Device Manufacturer (IDMs)
13.4.2. Outsourced Semiconductor Assembly and Testing (OSATs)
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Semiconductor Assembly Equipment Market Size and Volume Forecast by Type
13.7.1. Die Bonding Equipment
13.7.2. Inspection and Dicing Equipment
13.7.3. Packaging Equipment
13.7.4. Wire Bonding Equipment
13.7.5. Plating Equipment
13.7.6. Other
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Semiconductor Assembly Equipment Demand Share, 2019-2026
14. Competition Landscape
14.1. Global Semiconductor Assembly Equipment Market: Market Share Analysis
14.2. Semiconductor Assembly Equipment Distributors and Customers
14.3. Semiconductor Assembly Equipment Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. ASM Pacific Technology
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. Kulicke & Soffa Industries
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. Palomar Technologies
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. Tokyo Electron
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. Tokyo Seimitsu
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. Besi
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. ChipMOS Technologies
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. DIAS Automation
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. Greatek Electronics
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. Hesse Mechatronics
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. Hybond
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. Shinkawa
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. Toray Engineering
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. West Bond
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. COMPANY 15
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. COMPANY 16
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook