Market Overview:
The global semiconductor package market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for semiconductor packages from the consumer electronics, automotive industry, aerospace and defense, medical devices, communications and telecom sectors. In addition, the growing demand for miniaturized and high-performance semiconductor packages is also contributing to the growth of this market. On the basis of type, flip chip packaging accounted for a major share of the global semiconductor package market in 2017. This segment is projected to grow at a CAGR of 7% during the forecast period from 2018 to 2030 due to its advantages such as high performance and low power consumption.
Product Definition:
A semiconductor package is an enclosure that houses one or more semiconductor devices, such as a chip, die or wafer. The package provides physical protection for the device and electrical connections between the device and other elements in the circuit. The package also influences the performance of the device by providing a controlled environment around it.
Flip Chip:
Flip chip is a technology used in integrated circuits (IC) packaging wherein the ICs are Flip-mounted on the PCB using copper lands and pads. The Flip Chip capacitive sensing technology has been developed to overcome limitations of traditional wire bond package designs. This technology enables higher flexibility, lower power consumption, and greater performance in package applications.
Embedded Die:
Embedded die is a semiconductor component used in integrated circuits (IC) packaging. It is also known as the on-chip die or chip-on-chip (CoC) device and it's primary function is to implement functions related to its associated module. Embedded dies are primarily used in mobile phones, personal computers, digital cameras, portable media players and other such electronic devices where ICs are packaged together.
Application Insights:
The consumer electronics segment accounted for the largest market share in 2016 and is projected to continue leading over the forecast period. The growth of this application segment can be attributed to increasing demand for semiconductor packages from smartphones, tablets, and other smart devices. Furthermore, rising demand for wearable technology products such as fitness bands and smartwatches is expected to propel industry growth over the next eight years.
The automotive industry was one of the fastest-growing segments in terms of revenue during 2015-16 owing to increased use of electronic systems in vehicles which include infotainment systems, body electronics controls, lighting controls among others.
Regional Analysis:
Asia Pacific is expected to be the fastest-growing regional market over the forecast period. The growth can be attributed to increasing demand for electronic products in countries such as China, India, and Japan. Furthermore, rising investments by governments of various countries are anticipated to boost the electronics industry in Asia Pacific region which will further propel market growth during the forecast period.
The U.S., China, and Japan are among major consumers of semiconductor packages globally owing to their high product demand across a wide range of industries including consumer electronics & appliances; automotive; industrial applications; networking & communication devices; computing & laptops etc.; all these factors have contributed towards high revenue share of this regional market over global ones during 2017’s review period.
Growth Factors:
- Increasing demand for semiconductor package from the automotive and consumer electronics industries
- Growing demand for miniaturization of semiconductor packages
- Proliferation of 3D packaging technologies
- Rising demand for advanced packaging solutions
- Increasing trend of consolidation in the semiconductor package market
Scope Of The Report
Report Attributes
Report Details
Report Title
Semiconductor Package Market Research Report
By Type
Flip Chip, Embedded Die, Fan-in Wafer Level Packaging (Fi Wlp), Fan-out Wafer Level Packaging, Others
By Application
Consumer Electronics, Automotive Industry, Aerospace and Defense, Medical Devices, Communications and Telecom, Others
By Companies
SPIL, ASE, Amkor, JCET, TFME, Siliconware Precision Industries, Powertech Technology Inc, TSMC, Nepes, Walton Advanced Engineering, Unisem, Huatian, Chipbond, UTAC, Chipmos, China Wafer Level CSP, Lingsen Precision, Tianshui Huatian Technology Co., Ltd, King Yuan Electronics CO., Ltd., Formosa, Carsem, J-Devices, Stats Chippac, Advanced Micro Devices
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
235
Number of Tables & Figures
165
Customization Available
Yes, the report can be customized as per your need.
Global Semiconductor Package Market Report Segments:
The global Semiconductor Package market is segmented on the basis of:
Types
Flip Chip, Embedded Die, Fan-in Wafer Level Packaging (Fi Wlp), Fan-out Wafer Level Packaging, Others
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Consumer Electronics, Automotive Industry, Aerospace and Defense, Medical Devices, Communications and Telecom, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- SPIL
- ASE
- Amkor
- JCET
- TFME
- Siliconware Precision Industries
- Powertech Technology Inc
- TSMC
- Nepes
- Walton Advanced Engineering
- Unisem
- Huatian
- Chipbond
- UTAC
- Chipmos
- China Wafer Level CSP
- Lingsen Precision
- Tianshui Huatian Technology Co., Ltd
- King Yuan Electronics CO., Ltd.
- Formosa
- Carsem
- J-Devices
- Stats Chippac
- Advanced Micro Devices
Highlights of The Semiconductor Package Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Flip Chip
- Embedded Die
- Fan-in Wafer Level Packaging (Fi Wlp)
- Fan-out Wafer Level Packaging
- Others
- By Application:
- Consumer Electronics
- Automotive Industry
- Aerospace and Defense
- Medical Devices
- Communications and Telecom
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Semiconductor Package Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
A semiconductor package is a physical container for one or more semiconductor devices.
Some of the major companies in the semiconductor package market are SPIL, ASE, Amkor, JCET, TFME, Siliconware Precision Industries, Powertech Technology Inc, TSMC, Nepes, Walton Advanced Engineering, Unisem, Huatian, Chipbond, UTAC, Chipmos, China Wafer Level CSP, Lingsen Precision, Tianshui Huatian Technology Co., Ltd, King Yuan Electronics CO., Ltd., Formosa, Carsem, J-Devices, Stats Chippac, Advanced Micro Devices.
The semiconductor package market is expected to grow at a compound annual growth rate of 6.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Semiconductor Package Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Semiconductor Package Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Semiconductor Package Market - Supply Chain
4.5. Global Semiconductor Package Market Forecast
4.5.1. Semiconductor Package Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Semiconductor Package Market Size (000 Units) and Y-o-Y Growth
4.5.3. Semiconductor Package Market Absolute $ Opportunity
5. Global Semiconductor Package Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Semiconductor Package Market Size and Volume Forecast by Type
5.3.1. Flip Chip
5.3.2. Embedded Die
5.3.3. Fan-in Wafer Level Packaging (Fi Wlp)
5.3.4. Fan-out Wafer Level Packaging
5.3.5. Others
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Semiconductor Package Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Semiconductor Package Market Size and Volume Forecast by Application
6.3.1. Consumer Electronics
6.3.2. Automotive Industry
6.3.3. Aerospace and Defense
6.3.4. Medical Devices
6.3.5. Communications and Telecom
6.3.6. Others
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Semiconductor Package Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Semiconductor Package Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Semiconductor Package Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Semiconductor Package Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Semiconductor Package Demand Share Forecast, 2019-2026
9. North America Semiconductor Package Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Semiconductor Package Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Semiconductor Package Market Size and Volume Forecast by Application
9.4.1. Consumer Electronics
9.4.2. Automotive Industry
9.4.3. Aerospace and Defense
9.4.4. Medical Devices
9.4.5. Communications and Telecom
9.4.6. Others
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Semiconductor Package Market Size and Volume Forecast by Type
9.7.1. Flip Chip
9.7.2. Embedded Die
9.7.3. Fan-in Wafer Level Packaging (Fi Wlp)
9.7.4. Fan-out Wafer Level Packaging
9.7.5. Others
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Semiconductor Package Demand Share Forecast, 2019-2026
10. Latin America Semiconductor Package Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Semiconductor Package Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Semiconductor Package Market Size and Volume Forecast by Application
10.4.1. Consumer Electronics
10.4.2. Automotive Industry
10.4.3. Aerospace and Defense
10.4.4. Medical Devices
10.4.5. Communications and Telecom
10.4.6. Others
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Semiconductor Package Market Size and Volume Forecast by Type
10.7.1. Flip Chip
10.7.2. Embedded Die
10.7.3. Fan-in Wafer Level Packaging (Fi Wlp)
10.7.4. Fan-out Wafer Level Packaging
10.7.5. Others
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Semiconductor Package Demand Share Forecast, 2019-2026
11. Europe Semiconductor Package Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Semiconductor Package Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Semiconductor Package Market Size and Volume Forecast by Application
11.4.1. Consumer Electronics
11.4.2. Automotive Industry
11.4.3. Aerospace and Defense
11.4.4. Medical Devices
11.4.5. Communications and Telecom
11.4.6. Others
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Semiconductor Package Market Size and Volume Forecast by Type
11.7.1. Flip Chip
11.7.2. Embedded Die
11.7.3. Fan-in Wafer Level Packaging (Fi Wlp)
11.7.4. Fan-out Wafer Level Packaging
11.7.5. Others
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Semiconductor Package Demand Share, 2019-2026
12. Asia Pacific Semiconductor Package Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Semiconductor Package Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Semiconductor Package Market Size and Volume Forecast by Application
12.4.1. Consumer Electronics
12.4.2. Automotive Industry
12.4.3. Aerospace and Defense
12.4.4. Medical Devices
12.4.5. Communications and Telecom
12.4.6. Others
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Semiconductor Package Market Size and Volume Forecast by Type
12.7.1. Flip Chip
12.7.2. Embedded Die
12.7.3. Fan-in Wafer Level Packaging (Fi Wlp)
12.7.4. Fan-out Wafer Level Packaging
12.7.5. Others
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Semiconductor Package Demand Share, 2019-2026
13. Middle East & Africa Semiconductor Package Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Semiconductor Package Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Semiconductor Package Market Size and Volume Forecast by Application
13.4.1. Consumer Electronics
13.4.2. Automotive Industry
13.4.3. Aerospace and Defense
13.4.4. Medical Devices
13.4.5. Communications and Telecom
13.4.6. Others
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Semiconductor Package Market Size and Volume Forecast by Type
13.7.1. Flip Chip
13.7.2. Embedded Die
13.7.3. Fan-in Wafer Level Packaging (Fi Wlp)
13.7.4. Fan-out Wafer Level Packaging
13.7.5. Others
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Semiconductor Package Demand Share, 2019-2026
14. Competition Landscape
14.1. Global Semiconductor Package Market: Market Share Analysis
14.2. Semiconductor Package Distributors and Customers
14.3. Semiconductor Package Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. SPIL
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. ASE
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. Amkor
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. JCET
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. TFME
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. Siliconware Precision Industries
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. Powertech Technology Inc
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. TSMC
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. Nepes
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. Walton Advanced Engineering
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. Unisem
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. Huatian
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. Chipbond
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. UTAC
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. Chipmos
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. China Wafer Level CSP
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. Lingsen Precision
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. Tianshui Huatian Technology Co., Ltd
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. King Yuan Electronics CO., Ltd.
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. Formosa
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook