The global semiconductor package substrates in mobile devices market is projected to grow at a CAGR of 5.5% during the forecast period, from 2021 to 2030. The growth of this market is attributed to the increasing demand for smartphones and tablets with high-end features and specifications. The demand for these devices has increased due to their ability to provide a better user experience than other devices such as laptops or desktops.
Some Of The Growth Factors Of This Market:
- The demand for semiconductor package substrates in mobile devices is driven by the need to reduce power consumption and increase performance of mobile devices.
- The demand for semiconductor package substrates in mobile devices is also driven by the need to reduce size and weight of mobile devices, which will be achieved through integration of more functions on a single chip.
- The demand for semiconductor package substrates in mobile devices is also driven by the need to improve battery life, which will be achieved through integration of more functions on a single chip and reduction in power consumption per function integrated on a single chip.
- The demand for semiconductor package substrates in mobile devices is also driven by the need to improve user experience, which will be achieved through integration of more functions on a single chip.
- The demand for semiconductor package substrates in mobile devices is also driven by the need to provide better security features.
Industry Growth Insights published a new data on “Semiconductor Package Substrates in Mobile Devices Market”. The research report is titled “Semiconductor Package Substrates in Mobile Devices Market research by Types (MCP/UTCSP, FC-CSP, SiP, PBGA/CSP, BOC, FMC), By Applications (Smartphones, Tablets, Notebook PCs, Others), By Players/Companies SIMMTECH, KYOCERA, Eastern, LG Innotek, Samsung Electro-Mechanics, Daeduck, Unimicron, ASE Group, TTM Technologies”.
Scope Of The Report
Report Attributes
Report Details
Report Title
Semiconductor Package Substrates in Mobile Devices Market Research Report
By Type
MCP/UTCSP, FC-CSP, SiP, PBGA/CSP, BOC, FMC
By Application
Smartphones, Tablets, Notebook PCs, Others
By Companies
SIMMTECH, KYOCERA, Eastern, LG Innotek, Samsung Electro-Mechanics, Daeduck, Unimicron, ASE Group, TTM Technologies
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
245
Number of Tables & Figures
172
Customization Available
Yes, the report can be customized as per your need.
Global Semiconductor Package Substrates in Mobile Devices Market Report Segments:
The global Semiconductor Package Substrates in Mobile Devices market is segmented on the basis of:
Types
MCP/UTCSP, FC-CSP, SiP, PBGA/CSP, BOC, FMC
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Smartphones, Tablets, Notebook PCs, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- SIMMTECH
- KYOCERA
- Eastern
- LG Innotek
- Samsung Electro-Mechanics
- Daeduck
- Unimicron
- ASE Group
- TTM Technologies
Highlights of The Semiconductor Package Substrates in Mobile Devices Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- MCP/UTCSP
- FC-CSP
- SiP
- PBGA/CSP
- BOC
- FMC
- By Application:
- Smartphones
- Tablets
- Notebook PCs
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Semiconductor Package Substrates in Mobile Devices Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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- Correctly Positioning New Products
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- Product & Brand Management
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Semiconductor package substrates are the material that is used to create the outer casing of a mobile device. This includes things like the plastic or metal body, buttons, ports and other features.
Some of the major players in the semiconductor package substrates in mobile devices market are SIMMTECH, KYOCERA, Eastern, LG Innotek, Samsung Electro-Mechanics, Daeduck, Unimicron, ASE Group, TTM Technologies.
The semiconductor package substrates in mobile devices market is expected to grow at a compound annual growth rate of 5.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Semiconductor Package Substrates in Mobile Devices Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Semiconductor Package Substrates in Mobile Devices Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Semiconductor Package Substrates in Mobile Devices Market - Supply Chain
4.5. Global Semiconductor Package Substrates in Mobile Devices Market Forecast
4.5.1. Semiconductor Package Substrates in Mobile Devices Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Semiconductor Package Substrates in Mobile Devices Market Size (000 Units) and Y-o-Y Growth
4.5.3. Semiconductor Package Substrates in Mobile Devices Market Absolute $ Opportunity
5. Global Semiconductor Package Substrates in Mobile Devices Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Semiconductor Package Substrates in Mobile Devices Market Size and Volume Forecast by Type
5.3.1. MCP/UTCSP
5.3.2. FC-CSP
5.3.3. SiP
5.3.4. PBGA/CSP
5.3.5. BOC
5.3.6. FMC
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Semiconductor Package Substrates in Mobile Devices Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Semiconductor Package Substrates in Mobile Devices Market Size and Volume Forecast by Application
6.3.1. Smartphones
6.3.2. Tablets
6.3.3. Notebook PCs
6.3.4. Others
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Semiconductor Package Substrates in Mobile Devices Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Semiconductor Package Substrates in Mobile Devices Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Semiconductor Package Substrates in Mobile Devices Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Semiconductor Package Substrates in Mobile Devices Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Semiconductor Package Substrates in Mobile Devices Demand Share Forecast, 2019-2026
9. North America Semiconductor Package Substrates in Mobile Devices Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Semiconductor Package Substrates in Mobile Devices Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Semiconductor Package Substrates in Mobile Devices Market Size and Volume Forecast by Application
9.4.1. Smartphones
9.4.2. Tablets
9.4.3. Notebook PCs
9.4.4. Others
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Semiconductor Package Substrates in Mobile Devices Market Size and Volume Forecast by Type
9.7.1. MCP/UTCSP
9.7.2. FC-CSP
9.7.3. SiP
9.7.4. PBGA/CSP
9.7.5. BOC
9.7.6. FMC
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Semiconductor Package Substrates in Mobile Devices Demand Share Forecast, 2019-2026
10. Latin America Semiconductor Package Substrates in Mobile Devices Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Semiconductor Package Substrates in Mobile Devices Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Semiconductor Package Substrates in Mobile Devices Market Size and Volume Forecast by Application
10.4.1. Smartphones
10.4.2. Tablets
10.4.3. Notebook PCs
10.4.4. Others
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Semiconductor Package Substrates in Mobile Devices Market Size and Volume Forecast by Type
10.7.1. MCP/UTCSP
10.7.2. FC-CSP
10.7.3. SiP
10.7.4. PBGA/CSP
10.7.5. BOC
10.7.6. FMC
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Semiconductor Package Substrates in Mobile Devices Demand Share Forecast, 2019-2026
11. Europe Semiconductor Package Substrates in Mobile Devices Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Semiconductor Package Substrates in Mobile Devices Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Semiconductor Package Substrates in Mobile Devices Market Size and Volume Forecast by Application
11.4.1. Smartphones
11.4.2. Tablets
11.4.3. Notebook PCs
11.4.4. Others
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Semiconductor Package Substrates in Mobile Devices Market Size and Volume Forecast by Type
11.7.1. MCP/UTCSP
11.7.2. FC-CSP
11.7.3. SiP
11.7.4. PBGA/CSP
11.7.5. BOC
11.7.6. FMC
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Semiconductor Package Substrates in Mobile Devices Demand Share, 2019-2026
12. Asia Pacific Semiconductor Package Substrates in Mobile Devices Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Semiconductor Package Substrates in Mobile Devices Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Semiconductor Package Substrates in Mobile Devices Market Size and Volume Forecast by Application
12.4.1. Smartphones
12.4.2. Tablets
12.4.3. Notebook PCs
12.4.4. Others
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Semiconductor Package Substrates in Mobile Devices Market Size and Volume Forecast by Type
12.7.1. MCP/UTCSP
12.7.2. FC-CSP
12.7.3. SiP
12.7.4. PBGA/CSP
12.7.5. BOC
12.7.6. FMC
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Semiconductor Package Substrates in Mobile Devices Demand Share, 2019-2026
13. Middle East & Africa Semiconductor Package Substrates in Mobile Devices Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Semiconductor Package Substrates in Mobile Devices Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Semiconductor Package Substrates in Mobile Devices Market Size and Volume Forecast by Application
13.4.1. Smartphones
13.4.2. Tablets
13.4.3. Notebook PCs
13.4.4. Others
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Semiconductor Package Substrates in Mobile Devices Market Size and Volume Forecast by Type
13.7.1. MCP/UTCSP
13.7.2. FC-CSP
13.7.3. SiP
13.7.4. PBGA/CSP
13.7.5. BOC
13.7.6. FMC
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Semiconductor Package Substrates in Mobile Devices Demand Share, 2019-2026
14. Competition Landscape
14.1. Global Semiconductor Package Substrates in Mobile Devices Market: Market Share Analysis
14.2. Semiconductor Package Substrates in Mobile Devices Distributors and Customers
14.3. Semiconductor Package Substrates in Mobile Devices Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. SIMMTECH
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. KYOCERA
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. Eastern
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. LG Innotek
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. Samsung Electro-Mechanics
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. Daeduck
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. Unimicron
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. ASE Group
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. TTM Technologies
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. COMPANY 10
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. COMPANY 11
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. COMPANY 12
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. COMPANY 13
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. COMPANY 14
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. COMPANY 15
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. COMPANY 16
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic&n
