Latest Update: Impact of current COVID-19 situation has been considered in this report while making the analysis.
Global Semiconductor Packaging and Test Equipment Market by Type (Wafer Probe Station, Die Bonder, Dicing Machine, Test handler, Sorter), By Application (Integrated Device Manufacturer (IDMs), Outsourced Semiconductor Assembly and Test (OSAT)) And By Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast From 2022 To 2030-report

Global Semiconductor Packaging and Test Equipment Market by Type (Wafer Probe Station, Die Bonder, Dicing Machine, Test handler, Sorter), By Application (Integrated Device Manufacturer (IDMs), Outsourced Semiconductor Assembly and Test (OSAT)) And By Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast From 2022 To 2030

Report ID: 211716 3300 Machinery & Equipment 377 247 Pages 4.6 (43)
                                          

The global semiconductor packaging and test equipment market is expected to grow at a CAGR of 4.5% during the forecast period, from 2021 to 2030. The growth of this market is driven by the increasing demand for semiconductors in various applications such as smartphones, tablets, laptops, and other consumer electronics devices. The increasing demand for semiconductors in these applications has led to an increase in the number of wafer probe stations and die bonders being used by IDMs and OSATs. The global semiconductor packaging and test equipment market is segmented on the basis of type into wafer probe station, die bonder, dicing machine, test handler, sorter; on the basis of application into integrated device manufacturers (IDMs) and outsourced semiconductor assembly & test (OSAT); on the basis of region into North America (NA), Latin America (LA), Europe (EU), Asia Pacific & Middle East & Africa (APMEA).

Some Of The Growth Factors Of This Market:

  1. The growth of the semiconductor packaging and test equipment market is driven by the increasing demand for high-end smartphones, tablets, laptops, and other electronic devices in emerging economies such as India and China.
  2. The increasing demand for high-end smartphones in emerging economies such as India and China has led to an increase in the number of manufacturers that are investing heavily in R&D activities for developing innovative technologies that can be used in these devices.
  3. In addition, the growing need for advanced technologies such as IoT (Internet of Things) will also drive the growth of this market during the forecast period.
  4. Increasing investments by governments across Asia Pacific region on research & development activities will also fuel this market's growth.

Industry Growth Insights published a new data on “Semiconductor Packaging and Test Equipment Market”. The research report is titled “Semiconductor Packaging and Test Equipment Market research by Types (Wafer Probe Station, Die Bonder, Dicing Machine, Test handler, Sorter), By Applications (Integrated Device Manufacturer (IDMs), Outsourced Semiconductor Assembly and Test (OSAT)), By Players/Companies TEL, DISCO, ASM, Tokyo Seimitsu, Besi, Semes, Cohu, Inc., Techwing, Kulicke & Soffa Industries, Fasford, Advantest, Hanmi semiconductor, Shinkawa, Shen Zhen Sidea, DIAS Automation”.

Scope Of The Report

Report Attributes

Report Details

Report Title

Semiconductor Packaging and Test Equipment Market Research Report

By Type

Wafer Probe Station, Die Bonder, Dicing Machine, Test handler, Sorter

By Application

Integrated Device Manufacturer (IDMs), Outsourced Semiconductor Assembly and Test (OSAT)

By Companies

TEL, DISCO, ASM, Tokyo Seimitsu, Besi, Semes, Cohu, Inc., Techwing, Kulicke & Soffa Industries, Fasford, Advantest, Hanmi semiconductor, Shinkawa, Shen Zhen Sidea, DIAS Automation

Regions Covered

North America, Europe, APAC, Latin America, MEA

Base Year

2021

Historical Year

2019 to 2020 (Data from 2010 can be provided as per availability)

Forecast Year

2030

Number of Pages

247

Number of Tables & Figures

173

Customization Available

Yes, the report can be customized as per your need.


Global Semiconductor Packaging and Test Equipment Industry Outlook


Global Semiconductor Packaging and Test Equipment Market Report Segments:

The global Semiconductor Packaging and Test Equipment market is segmented on the basis of:

Types

Wafer Probe Station, Die Bonder, Dicing Machine, Test handler, Sorter

The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.

Applications

Integrated Device Manufacturer (IDMs), Outsourced Semiconductor Assembly and Test (OSAT)

The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.

Some of the companies that are profiled in this report are:

  1. TEL
  2. DISCO
  3. ASM
  4. Tokyo Seimitsu
  5. Besi
  6. Semes
  7. Cohu, Inc.
  8. Techwing
  9. Kulicke & Soffa Industries
  10. Fasford
  11. Advantest
  12. Hanmi semiconductor
  13. Shinkawa
  14. Shen Zhen Sidea
  15. DIAS Automation

Global Semiconductor Packaging and Test Equipment Market Overview


Highlights of The Semiconductor Packaging and Test Equipment Market Report:

  1. The market structure and projections for the coming years.
  2. Drivers, restraints, opportunities, and current trends of market.
  3. Historical data and forecast.
  4. Estimations for the forecast period 2030.
  5. Developments and trends in the market.
  6. By Type:

    1. Wafer Probe Station
    2. Die Bonder
    3. Dicing Machine
    4. Test handler
    5. Sorter
  1. By Application:

    1. Integrated Device Manufacturer (IDMs)
    2. Outsourced Semiconductor Assembly and Test (OSAT)
  1. Market scenario by region, sub-region, and country.
  2. Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
  3. Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
  4. Government Policies, Macro & Micro economic factors are also included in the report.

We have studied the Semiconductor Packaging and Test Equipment Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.

Regional Analysis

  • North America
  • Europe
  • Asia Pacific
  • Middle East & Africa
  • Latin America

Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.

The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.

How you may use our products:

  • Correctly Positioning New Products
  • Market Entry Strategies
  • Business Expansion Strategies
  • Consumer Insights
  • Understanding Competition Scenario
  • Product & Brand Management
  • Channel & Customer Management
  • Identifying Appropriate Advertising Appeals

Global Semiconductor Packaging and Test Equipment Market Statistics

8 Reasons to Buy This Report

  1. Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
  2. Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
  3. Implemented Robust Methodology to Prepare the Report
  4. Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
  5. Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
  6. Provides Information About the Top-winning Strategies Implemented by Industry Players.
  7. In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
  8. Customization of the Report Available

Frequently Asked Questions?


Semiconductor packaging and test equipment is used to package semiconductors, measure their electrical properties, and test them for functionality. This equipment can include heat sinks, soldering stations, ovens, and more.

Some of the major players in the semiconductor packaging and test equipment market are TEL, DISCO, ASM, Tokyo Seimitsu, Besi, Semes, Cohu, Inc., Techwing, Kulicke & Soffa Industries, Fasford, Advantest, Hanmi semiconductor, Shinkawa, Shen Zhen Sidea, DIAS Automation.

The semiconductor packaging and test equipment market is expected to grow at a compound annual growth rate of 4.5%.

                                            
1. Executive Summary

2. Assumptions and Acronyms Used

3. Research Methodology

4. Semiconductor Packaging and Test Equipment Market Overview
   4.1. Introduction
      4.1.1. Market Taxonomy
      4.1.2. Market Definition
   4.2. Macro-Economic Factors
      4.2.1. Industry Outlook
   4.3. Semiconductor Packaging and Test Equipment Market Dynamics
      4.3.1. Market Drivers
      4.3.2. Market Restraints
      4.3.3. Opportunity
      4.3.4. Market Trends
   4.4. Semiconductor Packaging and Test Equipment Market - Supply Chain
   4.5. Global Semiconductor Packaging and Test Equipment Market Forecast
      4.5.1. Semiconductor Packaging and Test Equipment Market Size (US$ Mn) and Y-o-Y Growth
      4.5.2. Semiconductor Packaging and Test Equipment Market Size (000’ Units) and Y-o-Y Growth
      4.5.3. Semiconductor Packaging and Test Equipment Market Absolute $ Opportunity

5. Global Semiconductor Packaging and Test Equipment Market Analysis and Forecast by Type
   5.1. Market Trends
   5.2. Introduction
      5.2.1. Basis Point Share (BPS) Analysis by Type
      5.2.2. Y-o-Y Growth Projections by Type
   5.3. Semiconductor Packaging and Test Equipment Market Size and Volume Forecast by Type
      5.3.1. Wafer Probe Station
      5.3.2. Die Bonder
      5.3.3. Dicing Machine
      5.3.4. Test handler
      5.3.5. Sorter
   5.4. Absolute $ Opportunity Assessment by Type
   5.5. Market Attractiveness/Growth Potential Analysis by Type

6. Global Semiconductor Packaging and Test Equipment Market Analysis and Forecast by Application
   6.1. Market Trends
   6.2. Introduction
      6.2.1. Basis Point Share (BPS) Analysis by Application
      6.2.2. Y-o-Y Growth Projections by Application
   6.3. Semiconductor Packaging and Test Equipment Market Size and Volume Forecast by Application
      6.3.1. Integrated Device Manufacturer (IDMs)
      6.3.2. Outsourced Semiconductor Assembly and Test (OSAT)
   6.4. Absolute $ Opportunity Assessment by Application
   6.5. Market Attractiveness/Growth Potential Analysis by Application

7. Global Semiconductor Packaging and Test Equipment Market Analysis and Forecast by Sales Channel
   7.1. Market Trends
   7.2. Introduction
      7.2.1. Basis Point Share (BPS) Analysis by Sales Channel 
      7.2.2. Y-o-Y Growth Projections by Sales Channel
   7.3. Semiconductor Packaging and Test Equipment Market Size and Volume Forecast by Sales Channel 
      7.3.1. Manufacturer/Distributor/Service Provider
      7.3.2. Aftermarket
   7.4. Absolute $ Opportunity Assessment by Sales Channel
   7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel

8. Global Semiconductor Packaging and Test Equipment Market Analysis and Forecast by Region
   8.1. Market Trends
   8.2. Introduction
      8.2.1. Basis Point Share (BPS) Analysis by Region
      8.2.2. Y-o-Y Growth Projections by Region
   8.3. Semiconductor Packaging and Test Equipment Market Size and Volume Forecast by Region
      8.3.1. North America
      8.3.2. Latin America
      8.3.3. Europe
      8.3.4. Asia Pacific
      8.3.5. Middle East and Africa (MEA)
   8.4. Absolute $ Opportunity Assessment by Region
   8.5. Market Attractiveness/Growth Potential Analysis by Region
   8.6. Global Semiconductor Packaging and Test Equipment Demand Share Forecast, 2019-2026

9. North America Semiconductor Packaging and Test Equipment Market Analysis and Forecast
   9.1. Introduction
      9.1.1. Basis Point Share (BPS) Analysis by Country
      9.1.2. Y-o-Y Growth Projections by Country
   9.2. North America Semiconductor Packaging and Test Equipment Market Size and Volume Forecast by Country
      9.2.1. U.S.
      9.2.2. Canada
   9.3. Absolute $ Opportunity Assessment by Country
   9.4. North America Semiconductor Packaging and Test Equipment Market Size and Volume Forecast by Application
      9.4.1. Integrated Device Manufacturer (IDMs)
      9.4.2. Outsourced Semiconductor Assembly and Test (OSAT)
   9.5. Basis Point Share (BPS) Analysis by Application
   9.6. Y-o-Y Growth Projections by Application
   9.7. North America Semiconductor Packaging and Test Equipment Market Size and Volume Forecast by Type
      9.7.1. Wafer Probe Station
      9.7.2. Die Bonder
      9.7.3. Dicing Machine
      9.7.4. Test handler
      9.7.5. Sorter
   9.8. Basis Point Share (BPS) Analysis by Type
   9.9. Y-o-Y Growth Projections by Type
   9.10. Market Attractiveness/Growth Potential Analysis
      9.10.1. By Country
      9.10.2. By Product Type
      9.10.3. By Application
      9.10.4. By Sales Channel
   9.11. North America Semiconductor Packaging and Test Equipment Demand Share Forecast, 2019-2026

10. Latin America Semiconductor Packaging and Test Equipment Market Analysis and Forecast
   10.1. Introduction
      10.1.1. Basis Point Share (BPS) Analysis by Country
      10.1.2. Y-o-Y Growth Projections by Country
      10.1.3. Latin America Average Pricing Analysis
   10.2. Latin America Semiconductor Packaging and Test Equipment Market Size and Volume Forecast by Country
      10.2.1. Brazil
      10.2.2. Mexico
      10.2.3. Rest of Latin America
   10.3. Absolute $ Opportunity Assessment by Country
   10.4. Latin America Semiconductor Packaging and Test Equipment Market Size and Volume Forecast by Application
      10.4.1. Integrated Device Manufacturer (IDMs)
      10.4.2. Outsourced Semiconductor Assembly and Test (OSAT)
   10.5. Basis Point Share (BPS) Analysis by Application
   10.6. Y-o-Y Growth Projections by Application
   10.7. Latin America Semiconductor Packaging and Test Equipment Market Size and Volume Forecast by Type
      10.7.1. Wafer Probe Station
      10.7.2. Die Bonder
      10.7.3. Dicing Machine
      10.7.4. Test handler
      10.7.5. Sorter
   10.8. Basis Point Share (BPS) Analysis by Type
   10.9. Y-o-Y Growth Projections by Type
   10.10. Market Attractiveness/Growth Potential Analysis
      10.10.1. By Country
      10.10.2. By Product Type
      10.10.3. By Application
      10.10.4. By Sales Channel
   10.11. Latin America Semiconductor Packaging and Test Equipment Demand Share Forecast, 2019-2026

11. Europe Semiconductor Packaging and Test Equipment Market Analysis and Forecast
   11.1. Introduction
      11.1.1. Basis Point Share (BPS) Analysis by Country
      11.1.2. Y-o-Y Growth Projections by Country
      11.1.3. Europe Average Pricing Analysis
   11.2. Europe Semiconductor Packaging and Test Equipment Market Size and Volume Forecast by Country
      11.2.1. Germany
      11.2.2. France
      11.2.3. Italy
      11.2.4. U.K.
      11.2.5. Spain
      11.2.6. Russia
      11.2.7. Rest of Europe
   11.3. Absolute $ Opportunity Assessment by Country
   11.4. Europe Semiconductor Packaging and Test Equipment Market Size and Volume Forecast by Application
      11.4.1. Integrated Device Manufacturer (IDMs)
      11.4.2. Outsourced Semiconductor Assembly and Test (OSAT)
   11.5. Basis Point Share (BPS) Analysis by Application
   11.6. Y-o-Y Growth Projections by Application
   11.7. Europe Semiconductor Packaging nd Test Equipment Market Size and Volume Forecast by Type
      11.7.1. Wafer Probe Station
      11.7.2. Die Bonder
      11.7.3. Dicing Machine
      11.7.4. Test handler
      11.7.5. Sorter
   11.8. Basis Point Share (BPS) Analysis by Type
   11.9. Y-o-Y Growth Projections by Type
   11.10. Market Attractiveness/Growth Potential Analysis
      11.10.1. By Country
      11.10.2. By Product Type
      11.10.3. By Application
      11.10.4. By Sales Channel
   11.11. Europe Semiconductor Packaging and Test Equipment Demand Share, 2019-2026

12. Asia Pacific Semiconductor Packaging and Test Equipment Market Analysis and Forecast
   12.1. Introduction
      12.1.1. Basis Point Share (BPS) Analysis by Country
      12.1.2. Y-o-Y Growth Projections by Country
      12.1.3. Asia Pacific Average Pricing Analysis
   12.2. Asia Pacific Semiconductor Packaging and Test Equipment Market Size and Volume Forecast by Country
      12.2.1. China
      12.2.2. Japan
      12.2.3. South Korea
      12.2.4. India
      12.2.5. Australia
      12.2.6. Rest of Asia Pacific (APAC)
   12.3. Absolute $ Opportunity Assessment by Country
   12.4. Asia Pacific Semiconductor Packaging and Test Equipment Market Size and Volume Forecast by Application
      12.4.1. Integrated Device Manufacturer (IDMs)
      12.4.2. Outsourced Semiconductor Assembly and Test (OSAT)
   12.5. Basis Point Share (BPS) Analysis by Application
   12.6. Y-o-Y Growth Projections by Application
   12.7. Asia Pacific Semiconductor Packaging and Test Equipment Market Size and Volume Forecast by Type
      12.7.1. Wafer Probe Station
      12.7.2. Die Bonder
      12.7.3. Dicing Machine
      12.7.4. Test handler
      12.7.5. Sorter
   12.8. Basis Point Share (BPS) Analysis by Type
   12.9. Y-o-Y Growth Projections by Type
   12.10. Market Attractiveness/Growth Potential Analysis
      12.10.1. By Country
      12.10.2. By Product Type
      12.10.3. By Application
      12.10.4. By Sales Channel
   12.11. Asia Pacific Semiconductor Packaging and Test Equipment Demand Share, 2019-2026

13. Middle East & Africa Semiconductor Packaging and Test Equipment Market Analysis and Forecast
   13.1. Introduction
      13.1.1. Basis Point Share (BPS) Analysis by Country
      13.1.2. Y-o-Y Growth Projections by Country
      13.1.3. Asia Pacific Average Pricing Analysis
   13.2. Middle East & Africa Semiconductor Packaging and Test Equipment Market Size and Volume Forecast by Country
      13.2.1. Saudi Arabia
      13.2.2. South Africa
      13.2.3. UAE
      13.2.4. Rest of Middle East & Africa (MEA)
   13.3. Absolute $ Opportunity Assessment by Country
   13.4. Middle East & Africa Semiconductor Packaging and Test Equipment Market Size and Volume Forecast by Application
      13.4.1. Integrated Device Manufacturer (IDMs)
      13.4.2. Outsourced Semiconductor Assembly and Test (OSAT)
   13.5. Basis Point Share (BPS) Analysis by Application
   13.6. Y-o-Y Growth Projections by Application
   13.7. Middle East & Africa Semiconductor Packaging and Test Equipment Market Size and Volume Forecast by Type
      13.7.1. Wafer Probe Station
      13.7.2. Die Bonder
      13.7.3. Dicing Machine
      13.7.4. Test handler
      13.7.5. Sorter
   13.8. Basis Point Share (BPS) Analysis by Type
   13.9. Y-o-Y Growth Projections by Type
   13.10. Market Attractiveness/Growth Potential Analysis
      13.10.1. By Country
      13.10.2. By Product Type
      13.10.3. By Application
      13.10.4. By Sales Channel
   13.11. Middle East & Africa Semiconductor Packaging and Test Equipment Demand Share, 2019-2026

14. Competition Landscape
   14.1. Global Semiconductor Packaging and Test Equipment Market: Market Share Analysis
   14.2. Semiconductor Packaging and Test Equipment Distributors and Customers
   14.3. Semiconductor Packaging and Test Equipment Market: Competitive Dashboard
   14.4. Company Profiles (Details – Overview, Financials, Developments, Strategy) 
      14.4.1. TEL
         14.4.1.1. Overview
         14.4.1.2. Financials
         14.4.1.3. Developments
         14.4.1.4. Strategic Outlook
      14.4.2. DISCO
         14.4.2.1. Overview
         14.4.2.2. Financials
         14.4.2.3. Developments
         14.4.2.4. Strategic Outlook
      14.4.3. ASM
         14.4.3.1. Overview
         14.4.3.2. Financials
         14.4.3.3. Developments
         14.4.3.4. Strategic Outlook
      14.4.4. Tokyo Seimitsu
         14.4.4.1. Overview
         14.4.4.2. Financials
         14.4.4.3. Developments
         14.4.4.4. Strategic Outlook
      14.4.5. Besi
         14.4.5.1. Overview
         14.4.5.2. Financials
         14.4.5.3. Developments
         14.4.5.4. Strategic Outlook
      14.4.6. Semes
         14.4.6.1. Overview
         14.4.6.2. Financials
         14.4.6.3. Developments
         14.4.6.4. Strategic Outlook
      14.4.7. Cohu, Inc.
         14.4.7.1. Overview
         14.4.7.2. Financials
         14.4.7.3. Developments
         14.4.7.4. Strategic Outlook
      14.4.8. Techwing
         14.4.8.1. Overview
         14.4.8.2. Financials
         14.4.8.3. Developments
         14.4.8.4. Strategic Outlook
      14.4.9. Kulicke & Soffa Industries
         14.4.9.1. Overview
         14.4.9.2. Financials
         14.4.9.3. Developments
         14.4.9.4. Strategic Outlook
      14.4.10. Fasford
         14.4.10.1. Overview
         14.4.10.2. Financials
         14.4.10.3. Developments
         14.4.10.4. Strategic Outlook
      14.4.11. Advantest
         14.4.11.1. Overview
         14.4.11.2. Financials
         14.4.11.3. Developments
         14.4.11.4. Strategic Outlook
      14.4.12. Hanmi semiconductor
         14.4.12.1. Overview
         14.4.12.2. Financials
         14.4.12.3. Developments
         14.4.12.4. Strategic Outlook
      14.4.13. Shinkawa
         14.4.13.1. Overview
         14.4.13.2. Financials
         14.4.13.3. Developments
         14.4.13.4. Strategic Outlook
      14.4.14. Shen Zhen Sidea
         14.4.14.1. Overview
         14.4.14.2. Financials
         14.4.14.3. Developments
         14.4.14.4. Strategic Outlook
      14.4.15. DIAS Automation
         14.4.15.1. Overview
         14.4.15.2. Financials
         14.4.15.3. Developments
         14.4.15.4. Strategic Outlook
      14.4.16. COMPANY 16
         14.4.16.1. Overview
         14.4.16.2. Financials
         14.4.16.3. Developments
         14.4.16.4. Strategic Outlook
      14.4.17. COMPANY 17
         14.4.17.1. Overview
         14.4.17.2. Financials
         14.4.17.3. Developments
         14.4.17.4. Strategic Outlook
      14.4.18. COMPANY 18
         14.4.18.1. Overview
         14.4.18.2. Financials
         14.4.18.3. Developments
         14.4.18.4. Strategic Outlook
      14.4.19. COMPANY 19
         14.4.19.1. Overview
         14.4.19.2. Financials
         14.4.19.3. Developments
         14.4.19.4. Strategic Outlook
      14.4.20. COMPANY 20
         14.4.20.1. Overview
         14.4.20.2. Financials
         14.4.20.3. Developments
         14.4.20.4. Strategic Outlook

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