The global semiconductor packaging material market is expected to grow at a CAGR of 4.5% during the forecast period, from 2021 to 2030. The growth of this market is attributed to the increasing demand for semiconductors in various applications such as automotive, consumer electronics, and industrial automation. The increasing demand for semiconductors in these applications has led to an increase in the number of devices being manufactured and sold globally. This has resulted in an increased need for semiconductor packaging materials which are used as a protective layer between the silicon wafer and its package or substrate.
Organic substrates are expected to be one of the fastest-growing segments during the forecast period due to their low cost and ease of use when compared with other types of substrates such as ceramic packages or solder balls. Organic substrates are also used extensively by manufacturers because they can be easily recycled after use without any loss in quality or performance.
- The growth of the semiconductor packaging material market is driven by the increasing demand for electronic devices, such as smartphones and tablets, which require more semiconductors per device than ever before.
- The increasing demand for high-end smartphones and tablets has led to an increase in the number of chips per device, which in turn has increased the demand for semiconductor packaging materials such as lead frames and ceramic substrates.
- Increasing adoption of 3D ICs will also drive the growth of this market.
- Increasing adoption of IoT devices will also drive this market.
Industry Growth Insights published a new data on “Semiconductor Packaging Material Market”. The research report is titled “Semiconductor Packaging Material Market research by Types (Organic Substrates, Bonding Wires, Encapsulation Resins, Ceramic Packages, Solder Balls, Wafer Level Packaging Dielectrics, Others), By Applications (Semiconductor Packaging, Others), By Players/Companies Henkel AG & Company, KGaA (Germany), Hitachi Chemical Company, Ltd. (Japan), Sumitomo Chemical Co., Ltd. (Japan), Kyocera Chemical Corporation (Japan), Mitsui High-tec, Inc. (Japan), Toray Industries, Inc. (Japan), Alent plc (U.K.), LG Chem (South Korea), BASF SE (Germany), Tanaka Kikinzoku Group (Japan), E. I. du Pont de Nemours and Company (U.S.), Honeywell International Inc. (U.S.), Toppan Printing Co., Ltd. (Japan), Nippon Micrometal Corporation (Japan), Alpha Advanced Materials (U.S.)”.
Scope Of The Report
Report Attributes
Report Details
Report Title
Semiconductor Packaging Material Market Research Report
By Type
Organic Substrates, Bonding Wires, Encapsulation Resins, Ceramic Packages, Solder Balls, Wafer Level Packaging Dielectrics, Others
By Application
Semiconductor Packaging, Others
By Companies
Henkel AG & Company, KGaA (Germany), Hitachi Chemical Company, Ltd. (Japan), Sumitomo Chemical Co., Ltd. (Japan), Kyocera Chemical Corporation (Japan), Mitsui High-tec, Inc. (Japan), Toray Industries, Inc. (Japan), Alent plc (U.K.), LG Chem (South Korea), BASF SE (Germany), Tanaka Kikinzoku Group (Japan), E. I. du Pont de Nemours and Company (U.S.), Honeywell International Inc. (U.S.), Toppan Printing Co., Ltd. (Japan), Nippon Micrometal Corporation (Japan), Alpha Advanced Materials (U.S.)
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
236
Number of Tables & Figures
166
Customization Available
Yes, the report can be customized as per your need.
Global Semiconductor Packaging Material Market Report Segments:
The global Semiconductor Packaging Material market is segmented on the basis of:
Types
Organic Substrates, Bonding Wires, Encapsulation Resins, Ceramic Packages, Solder Balls, Wafer Level Packaging Dielectrics, Others
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Semiconductor Packaging, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Henkel AG & Company
- KGaA (Germany)
- Hitachi Chemical Company, Ltd. (Japan)
- Sumitomo Chemical Co., Ltd. (Japan)
- Kyocera Chemical Corporation (Japan)
- Mitsui High-tec, Inc. (Japan)
- Toray Industries, Inc. (Japan)
- Alent plc (U.K.)
- LG Chem (South Korea)
- BASF SE (Germany)
- Tanaka Kikinzoku Group (Japan)
- E. I. du Pont de Nemours and Company (U.S.)
- Honeywell International Inc. (U.S.)
- Toppan Printing Co., Ltd. (Japan)
- Nippon Micrometal Corporation (Japan)
- Alpha Advanced Materials (U.S.)
Highlights of The Semiconductor Packaging Material Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Organic Substrates
- Bonding Wires
- Encapsulation Resins
- Ceramic Packages
- Solder Balls
- Wafer Level Packaging Dielectrics
- Others
- By Application:
- Semiconductor Packaging
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Semiconductor Packaging Material Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Semiconductor packaging material is a material that is used to protect electronic devices from the environment and to provide a means of attaching the device to other components. The most common type of semiconductor packaging material is plastic, but metal and glass are also used.
Some of the key players operating in the semiconductor packaging material market are Henkel AG & Company, KGaA (Germany), Hitachi Chemical Company, Ltd. (Japan), Sumitomo Chemical Co., Ltd. (Japan), Kyocera Chemical Corporation (Japan), Mitsui High-tec, Inc. (Japan), Toray Industries, Inc. (Japan), Alent plc (U.K.), LG Chem (South Korea), BASF SE (Germany), Tanaka Kikinzoku Group (Japan), E. I. du Pont de Nemours and Company (U.S.), Honeywell International Inc. (U.S.), Toppan Printing Co., Ltd. (Japan), Nippon Micrometal Corporation (Japan), Alpha Advanced Materials (U.S.).
The semiconductor packaging material market is expected to register a CAGR of 4.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Semiconductor Packaging Material Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Semiconductor Packaging Material Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Semiconductor Packaging Material Market - Supply Chain
4.5. Global Semiconductor Packaging Material Market Forecast
4.5.1. Semiconductor Packaging Material Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Semiconductor Packaging Material Market Size (000 Units) and Y-o-Y Growth
4.5.3. Semiconductor Packaging Material Market Absolute $ Opportunity
5. Global Semiconductor Packaging Material Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Semiconductor Packaging Material Market Size and Volume Forecast by Type
5.3.1. Organic Substrates
5.3.2. Bonding Wires
5.3.3. Encapsulation Resins
5.3.4. Ceramic Packages
5.3.5. Solder Balls
5.3.6. Wafer Level Packaging Dielectrics
5.3.7. Others
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Semiconductor Packaging Material Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Semiconductor Packaging Material Market Size and Volume Forecast by Application
6.3.1. Semiconductor Packaging
6.3.2. Others
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Semiconductor Packaging Material Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Semiconductor Packaging Material Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Semiconductor Packaging Material Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Semiconductor Packaging Material Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Semiconductor Packaging Material Demand Share Forecast, 2019-2026
9. North America Semiconductor Packaging Material Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Semiconductor Packaging Material Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Semiconductor Packaging Material Market Size and Volume Forecast by Application
9.4.1. Semiconductor Packaging
9.4.2. Others
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Semiconductor Packaging Material Market Size and Volume Forecast by Type
9.7.1. Organic Substrates
9.7.2. Bonding Wires
9.7.3. Encapsulation Resins
9.7.4. Ceramic Packages
9.7.5. Solder Balls
9.7.6. Wafer Level Packaging Dielectrics
9.7.7. Others
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Semiconductor Packaging Material Demand Share Forecast, 2019-2026
10. Latin America Semiconductor Packaging Material Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Semiconductor Packaging Material Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Semiconductor Packaging Material Market Size and Volume Forecast by Application
10.4.1. Semiconductor Packaging
10.4.2. Others
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Semiconductor Packaging Material Market Size and Volume Forecast by Type
10.7.1. Organic Substrates
10.7.2. Bonding Wires
10.7.3. Encapsulation Resins
10.7.4. Ceramic Packages
10.7.5. Solder Balls
10.7.6. Wafer Level Packaging Dielectrics
10.7.7. Others
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Semiconductor Packaging Material Demand Share Forecast, 2019-2026
11. Europe Semiconductor Packaging Material Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Semiconductor Packaging Material Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Semiconductor Packaging Material Market Size and Volume Forecast by Application
11.4.1. Semiconductor Packaging
11.4.2. Others
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Semiconductor Packaging Material Market Size and Volume Forecast by Type
11.7.1. Organic Substrates
11.7.2. Bonding Wires
11.7.3. Encapsulation Resins
11.7.4. Ceramic Packages
11.7.5. Solder Balls
11.7.6. Wafer Level Packaging Dielectrics
11.7.7. Others
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Semiconductor Packaging Material Demand Share, 2019-2026
12. Asia Pacific Semiconductor Packaging Material Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Semiconductor Packaging Material Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Semiconductor Packaging Material Market Size and Volume Forecast by Application
12.4.1. Semiconductor Packaging
12.4.2. Others
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Semiconductor Packaging Material Market Size and Volume Forecast by Type
12.7.1. Organic Substrates
12.7.2. Bonding Wires
12.7.3. Encapsulation Resins
12.7.4. Ceramic Packages
12.7.5. Solder Balls
12.7.6. Wafer Level Packaging Dielectrics
12.7.7. Others
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Semiconductor Packaging Material Demand Share, 2019-2026
13. Middle East & Africa Semiconductor Packaging Material Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Semiconductor Packaging Material Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Semiconductor Packaging Material Market Size and Volume Forecast by Application
13.4.1. Semiconductor Packaging
13.4.2. Others
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Semiconductor Packaging Material Market Size and Volume Forecast by Type
13.7.1. Organic Substrates
13.7.2. Bonding Wires
13.7.3. Encapsulation Resins
13.7.4. Ceramic Packages
13.7.5. Solder Balls
13.7.6. Wafer Level Packaging Dielectrics
13.7.7. Others
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Semiconductor Packaging Material Demand Share, 2019-2026
14. Competition Landscape
14.1. Global Semiconductor Packaging Material Market: Market Share Analysis
14.2. Semiconductor Packaging Material Distributors and Customers
14.3. Semiconductor Packaging Material Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. Henkel AG & Company
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. KGaA (Germany)
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. Hitachi Chemical Company, Ltd. (Japan)
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. Sumitomo Chemical Co., Ltd. (Japan)
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. Kyocera Chemical Corporation (Japan)
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. Mitsui High-tec, Inc. (Japan)
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. Toray Industries, Inc. (Japan)
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. Alent plc (U.K.)
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. LG Chem (South Korea)
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. BASF SE (Germany)
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. Tanaka Kikinzoku Group (Japan)
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. E. I. du Pont de Nemours and Company (U.S.)
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. Honeywell International Inc. (U.S.)
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. Toppan Printing Co., Ltd. (Japan)
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. Nippon Micrometal Corporation (Japan)
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. Alpha Advanced Materials (U.S.)
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
