The global semiconductor packaging materials market is expected to grow at a CAGR of 4.5% during the forecast period, from 2021 to 2030. The growth of this market is driven by the increasing demand for semiconductors in various applications such as smartphones, tablets, and other consumer electronics devices. The increasing demand for these devices has led to an increase in the production of semiconductors which has resulted in an increased need for packaging materials.
Organic substrates are expected to be the fastest growing type of packaging material during the forecast period due to their low cost and high flexibility. Lead frames are also expected to grow at a significant rate due to their ability to withstand high temperatures and provide good thermal conductivity which helps dissipate heat generated by integrated circuits (ICs). Bonding wires are also expected to grow significantly during this time period due mainly because they offer excellent electrical conductivity and can be used with any type of substrate or lead frame material.
- The demand for semiconductor packaging materials is also driven by the need for better thermal management in order to reduce power consumption and increase battery life span in mobile devices such as smartphones and tablets, which are becoming increasingly popular among consumers worldwide.
- In addition, there has been an increased focus on reducing carbon emissions through sustainable manufacturing practices that have led manufacturers towards using more environmentally friendly material alternatives such as biodegradable plastics or recycled paperboard instead of traditional plastic or metal foils used in semiconductor packaging materials production processes; this has also contributed towards driving up demand for these products over time 5) Increasing investments by governments across Asia Pacific into research & development activities related to electronics manufacturing will also drive up demand for these products over time.
Industry Growth Insights published a new data on “Semiconductor Packaging Materials Market”. The research report is titled “Semiconductor Packaging Materials Market research by Types (Organic Substrates, Lead Frames, Bonding Wires, Other), By Applications (IDM (Integrated Device Manufacturers), OSAT (Outsourced Semiconductor Assembly and Test Companies)), By Players/Companies Amkor Technology, DuPont, BASF, Henkel, Honeywell, Kyocera, Toppan Printing, Hitachi Chemical, ASM Pacific Technology, Beijing Kehua New Chemical Technology”.
Scope Of The Report
Report Attributes
Report Details
Report Title
Semiconductor Packaging Materials Market Research Report
By Type
Organic Substrates, Lead Frames, Bonding Wires, Other
By Application
IDM (Integrated Device Manufacturers), OSAT (Outsourced Semiconductor Assembly and Test Companies)
By Companies
Amkor Technology, DuPont, BASF, Henkel, Honeywell, Kyocera, Toppan Printing, Hitachi Chemical, ASM Pacific Technology, Beijing Kehua New Chemical Technology
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
234
Number of Tables & Figures
164
Customization Available
Yes, the report can be customized as per your need.
Global Semiconductor Packaging Materials Market Report Segments:
The global Semiconductor Packaging Materials market is segmented on the basis of:
Types
Organic Substrates, Lead Frames, Bonding Wires, Other
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
IDM (Integrated Device Manufacturers), OSAT (Outsourced Semiconductor Assembly and Test Companies)
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Amkor Technology
- DuPont
- BASF
- Henkel
- Honeywell
- Kyocera
- Toppan Printing
- Hitachi Chemical
- ASM Pacific Technology
- Beijing Kehua New Chemical Technology
Highlights of The Semiconductor Packaging Materials Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Organic Substrates
- Lead Frames
- Bonding Wires
- Other
- By Application:
- IDM (Integrated Device Manufacturers)
- OSAT (Outsourced Semiconductor Assembly and Test Companies)
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Semiconductor Packaging Materials Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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- Correctly Positioning New Products
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Semiconductor packaging materials are the materials used to package semiconductors. They can be divided into two categories: lead-free and lead-based. Lead-free packaging is typically made of plastics, while lead-based packaging is made of metals like brass or aluminum.
Some of the major companies in the semiconductor packaging materials market are Amkor Technology, DuPont, BASF, Henkel, Honeywell, Kyocera, Toppan Printing, Hitachi Chemical, ASM Pacific Technology, Beijing Kehua New Chemical Technology.
The semiconductor packaging materials market is expected to grow at a compound annual growth rate of 4.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Semiconductor Packaging Materials Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Semiconductor Packaging Materials Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Semiconductor Packaging Materials Market - Supply Chain
4.5. Global Semiconductor Packaging Materials Market Forecast
4.5.1. Semiconductor Packaging Materials Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Semiconductor Packaging Materials Market Size (000 Units) and Y-o-Y Growth
4.5.3. Semiconductor Packaging Materials Market Absolute $ Opportunity
5. Global Semiconductor Packaging Materials Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Semiconductor Packaging Materials Market Size and Volume Forecast by Type
5.3.1. Organic Substrates
5.3.2. Lead Frames
5.3.3. Bonding Wires
5.3.4. Other
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Semiconductor Packaging Materials Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Semiconductor Packaging Materials Market Size and Volume Forecast by Application
6.3.1. IDM (Integrated Device Manufacturers)
6.3.2. OSAT (Outsourced Semiconductor Assembly and Test Companies)
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Semiconductor Packaging Materials Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Semiconductor Packaging Materials Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Semiconductor Packaging Materials Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Semiconductor Packaging Materials Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Semiconductor Packaging Materials Demand Share Forecast, 2019-2026
9. North America Semiconductor Packaging Materials Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Semiconductor Packaging Materials Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Semiconductor Packaging Materials Market Size and Volume Forecast by Application
9.4.1. IDM (Integrated Device Manufacturers)
9.4.2. OSAT (Outsourced Semiconductor Assembly and Test Companies)
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Semiconductor Packaging Materials Market Size and Volume Forecast by Type
9.7.1. Organic Substrates
9.7.2. Lead Frames
9.7.3. Bonding Wires
9.7.4. Other
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Semiconductor Packaging Materials Demand Share Forecast, 2019-2026
10. Latin America Semiconductor Packaging Materials Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Semiconductor Packaging Materials Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Semiconductor Packaging Materials Market Size and Volume Forecast by Application
10.4.1. IDM (Integrated Device Manufacturers)
10.4.2. OSAT (Outsourced Semiconductor Assembly and Test Companies)
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Semiconductor Packaging Materials Market Size and Volume Forecast by Type
10.7.1. Organic Substrates
10.7.2. Lead Frames
10.7.3. Bonding Wires
10.7.4. Other
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Semiconductor Packaging Materials Demand Share Forecast, 2019-2026
11. Europe Semiconductor Packaging Materials Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Semiconductor Packaging Materials Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Semiconductor Packaging Materials Market Size and Volume Forecast by Application
11.4.1. IDM (Integrated Device Manufacturers)
11.4.2. OSAT (Outsourced Semiconductor Assembly and Test Companies)
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Semiconductor Packaging Materials Market Size and Volume Forecast by Type
11.7.1. Organic Substrates
11.7.2. Lead Frames
11.7.3. Bonding Wires
11.7.4. Other
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Semiconductor Packaging Materials Demand Share, 2019-2026
12. Asia Pacific Semiconductor Packaging Materials Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Semiconductor Packaging Materials Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Semiconductor Packaging Materials Market Size and Volume Forecast by Application
12.4.1. IDM (Integrated Device Manufacturers)
12.4.2. OSAT (Outsourced Semiconductor Assembly and Test Companies)
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Semiconductor Packaging Materials Market Size and Volume Forecast by Type
12.7.1. Organic Substrates
12.7.2. Lead Frames
12.7.3. Bonding Wires
12.7.4. Other
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Semiconductor Packaging Materials Demand Share, 2019-2026
13. Middle East & Africa Semiconductor Packaging Materials Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Semiconductor Packaging Materials Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Semiconductor Packaging Materials Market Size and Volume Forecast by Application
13.4.1. IDM (Integrated Device Manufacturers)
13.4.2. OSAT (Outsourced Semiconductor Assembly and Test Companies)
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Semiconductor Packaging Materials Market Size and Volume Forecast by Type
13.7.1. Organic Substrates
13.7.2. Lead Frames
13.7.3. Bonding Wires
13.7.4. Other
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Semiconductor Packaging Materials Demand Share, 2019-2026
14. Competition Landscape
14.1. Global Semiconductor Packaging Materials Market: Market Share Analysis
14.2. Semiconductor Packaging Materials Distributors and Customers
14.3. Semiconductor Packaging Materials Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. Amkor Technology
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. DuPont
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. BASF
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. Henkel
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. Honeywell
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. Kyocera
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. Toppan Printing
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. Hitachi Chemical
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. ASM Pacific Technology
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. Beijing Kehua New Chemical Technology
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. COMPANY 11
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. COMPANY 12
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. COMPANY 13
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. COMPANY 14
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. COMPANY 15
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. COMPANY 16
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
