Market Overview:
The global semiconductor packaging used solder paste market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for miniaturized and high-performance electronic devices, rising demand for advanced packaging technologies, and growing trend of 3D printing in the semiconductor industry. The global semiconductor packaging used solder paste market is segmented on the basis of type, application, and region. On the basis of type, it is divided into rosin based pastes, water soluble fluxes, and no-clean fluxes. Rosin based pastes are expected to hold a major share in this market due to their low cost and easy availability as compared to other types of solder paste. On the basis of application, it is segmented into computer & peripherals; communications; consumer electronics; automotive; industrial/medical equipment; military/aerospace applications among others.
Product Definition:
The solder paste is an adhesive material used to attach electronic components to a printed circuit board. The paste is a mixture of flux and solder, which is applied to the surface of the component and then heated, melting the solder and bonding the component to the board.
Rosin Based Pastes:
The global rosin-based pastes, it's usage and growth factor in the semiconductor packaging used solder paste market is expected to grow at a significant pace over the forecast period. Rosin-based pastes are widely used for surface mount device (SMD) assembly owing to its superior thermal conductivity property.
Water Soluble Fluxes:
Water soluble fluxes are used to solder paste in electronics packaging. It is a solution of materials that reacts with the metal surface and helps in providing an even, uniform, and strong bond between the paste and the PCB. The major raw materials include tin (Sn) or lead (Pb) or both combined; also called soldering material; along with water which acts as a solvent for these materials.
Application Insights:
The demand for the product is expected to witness growth owing to its application in various electronic products such as computers, mobile phones, networking devices, consumer electronics and office equipment. The computer application segment accounted for a market share of over 30% in 2017 and is projected to grow at a CAGR exceeding 5% from 2018 to 2030.
The use of the product eliminates any fluxing or clean-up procedures which saves costs and time. It also offers superior thermal resistance properties which makes it an ideal choice for high-temperature applications including automotive electronics (junction box), industrial/medical equipment & appliances (heating elements) along with excellent moisture resistance that enables its use in high humidity conditions without corrosion or degradation issues. These factors are likely to increase industry penetration over the coming years.
Regional Analysis:
Asia Pacific is expected to be the fastest-growing regional market with a CAGR of XX% from 2018 to 2030 owing to rapid industrialization and increasing foreign investments in the region. The presence of major electronics manufacturing companies such as Wistron Corporation; Quanta Computer, Inc.; Inventec Corporation; Foxconn Technology Group Co., Ltd.; Compal Electronics, Inc.; and Pegatron Corp. will drive demand for electronic components packaging materials in this region over the forecast period.
North America was valued at USD X million in 2017 as it is one of the largest producers of semiconductors globally along with U.S.
Growth Factors:
- Increasing demand for semiconductor packaging from the electronics industry
- Growing popularity of miniaturized and high-density semiconductor packages
- Proliferation of 3D IC technology and advanced packaging solutions
- Rising demand for lead-free solder paste in the global market
- Technological advancements in semiconductor packaging materials and processes
Scope Of The Report
Report Attributes
Report Details
Report Title
Semiconductor Packaging Used Solder Paste Market Research Report
By Type
Rosin Based Pastes, Water Soluble Fluxes, No-clean Flux
By Application
Computer, Communications, Consumer, Automotive, Industrial/Medical, Military/Aerospace
By Companies
Senju, Alent (Alpha), Tamura, Henkel, Indium, Kester (ITW), Shengmao, Inventec, KOKI, AIM, Nihon Superior, KAWADA, Yashida, Tongfang Tech, Shenzhen Bright, Yong An
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
234
Number of Tables & Figures
164
Customization Available
Yes, the report can be customized as per your need.
Global Semiconductor Packaging Used Solder Paste Market Report Segments:
The global Semiconductor Packaging Used Solder Paste market is segmented on the basis of:
Types
Rosin Based Pastes, Water Soluble Fluxes, No-clean Flux
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Computer, Communications, Consumer, Automotive, Industrial/Medical, Military/Aerospace
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Senju
- Alent (Alpha)
- Tamura
- Henkel
- Indium
- Kester (ITW)
- Shengmao
- Inventec
- KOKI
- AIM
- Nihon Superior
- KAWADA
- Yashida
- Tongfang Tech
- Shenzhen Bright
- Yong An
Highlights of The Semiconductor Packaging Used Solder Paste Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Rosin Based Pastes
- Water Soluble Fluxes
- No-clean Flux
- By Application:
- Computer
- Communications
- Consumer
- Automotive
- Industrial/Medical
- Military/Aerospace
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Semiconductor Packaging Used Solder Paste Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Semiconductor packaging is a type of solder paste that is used to attach semiconductor components together. It is also used to form electrical connections between the components.
Some of the major companies in the semiconductor packaging used solder paste market are Senju, Alent (Alpha), Tamura, Henkel, Indium, Kester (ITW), Shengmao, Inventec, KOKI, AIM, Nihon Superior, KAWADA, Yashida, Tongfang Tech, Shenzhen Bright, Yong An.
The semiconductor packaging used solder paste market is expected to register a CAGR of 5.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Semiconductor Packaging Used Solder Paste Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Semiconductor Packaging Used Solder Paste Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Semiconductor Packaging Used Solder Paste Market - Supply Chain
4.5. Global Semiconductor Packaging Used Solder Paste Market Forecast
4.5.1. Semiconductor Packaging Used Solder Paste Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Semiconductor Packaging Used Solder Paste Market Size (000 Units) and Y-o-Y Growth
4.5.3. Semiconductor Packaging Used Solder Paste Market Absolute $ Opportunity
5. Global Semiconductor Packaging Used Solder Paste Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Semiconductor Packaging Used Solder Paste Market Size and Volume Forecast by Type
5.3.1. Rosin Based Pastes
5.3.2. Water Soluble Fluxes
5.3.3. No-clean Flux
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Semiconductor Packaging Used Solder Paste Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Semiconductor Packaging Used Solder Paste Market Size and Volume Forecast by Application
6.3.1. Computer
6.3.2. Communications
6.3.3. Consumer
6.3.4. Automotive
6.3.5. Industrial/Medical
6.3.6. Military/Aerospace
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Semiconductor Packaging Used Solder Paste Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Semiconductor Packaging Used Solder Paste Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Semiconductor Packaging Used Solder Paste Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Semiconductor Packaging Used Solder Paste Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Semiconductor Packaging Used Solder Paste Demand Share Forecast, 2019-2026
9. North America Semiconductor Packaging Used Solder Paste Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Semiconductor Packaging Used Solder Paste Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Semiconductor Packaging Used Solder Paste Market Size and Volume Forecast by Application
9.4.1. Computer
9.4.2. Communications
9.4.3. Consumer
9.4.4. Automotive
9.4.5. Industrial/Medical
9.4.6. Military/Aerospace
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Semiconductor Packaging Used Solder Paste Market Size and Volume Forecast by Type
9.7.1. Rosin Based Pastes
9.7.2. Water Soluble Fluxes
9.7.3. No-clean Flux
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Semiconductor Packaging Used Solder Paste Demand Share Forecast, 2019-2026
10. Latin America Semiconductor Packaging Used Solder Paste Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Semiconductor Packaging Used Solder Paste Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Semiconductor Packaging Used Solder Paste Market Size and Volume Forecast by Application
10.4.1. Computer
10.4.2. Communications
10.4.3. Consumer
10.4.4. Automotive
10.4.5. Industrial/Medical
10.4.6. Military/Aerospace
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Semiconductor Packaging Used Solder Paste Market Size and Volume Forecast by Type
10.7.1. Rosin Based Pastes
10.7.2. Water Soluble Fluxes
10.7.3. No-clean Flux
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Semiconductor Packaging Used Solder Paste Demand Share Forecast, 2019-2026
11. Europe Semiconductor Packaging Used Solder Paste Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Semiconductor Packaging Used Solder Paste Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Semiconductor Packaging Used Solder Paste Market Size and Volume Forecast by Application
11.4.1. Computer
11.4.2. Communications
11.4.3. Consumer
11.4.4. Automotive
11.4.5. Industrial/Medical
11.4.6. Military/Aerospace
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections y Application
11.7. Europe Semiconductor Packaging Used Solder Paste Market Size and Volume Forecast by Type
11.7.1. Rosin Based Pastes
11.7.2. Water Soluble Fluxes
11.7.3. No-clean Flux
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Semiconductor Packaging Used Solder Paste Demand Share, 2019-2026
12. Asia Pacific Semiconductor Packaging Used Solder Paste Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Semiconductor Packaging Used Solder Paste Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Semiconductor Packaging Used Solder Paste Market Size and Volume Forecast by Application
12.4.1. Computer
12.4.2. Communications
12.4.3. Consumer
12.4.4. Automotive
12.4.5. Industrial/Medical
12.4.6. Military/Aerospace
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Semiconductor Packaging Used Solder Paste Market Size and Volume Forecast by Type
12.7.1. Rosin Based Pastes
12.7.2. Water Soluble Fluxes
12.7.3. No-clean Flux
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Semiconductor Packaging Used Solder Paste Demand Share, 2019-2026
13. Middle East & Africa Semiconductor Packaging Used Solder Paste Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Semiconductor Packaging Used Solder Paste Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Semiconductor Packaging Used Solder Paste Market Size and Volume Forecast by Application
13.4.1. Computer
13.4.2. Communications
13.4.3. Consumer
13.4.4. Automotive
13.4.5. Industrial/Medical
13.4.6. Military/Aerospace
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Semiconductor Packaging Used Solder Paste Market Size and Volume Forecast by Type
13.7.1. Rosin Based Pastes
13.7.2. Water Soluble Fluxes
13.7.3. No-clean Flux
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Semiconductor Packaging Used Solder Paste Demand Share, 2019-2026
14. Competition Landscape
14.1. Global Semiconductor Packaging Used Solder Paste Market: Market Share Analysis
14.2. Semiconductor Packaging Used Solder Paste Distributors and Customers
14.3. Semiconductor Packaging Used Solder Paste Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. Senju
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. Alent (Alpha)
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. Tamura
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. Henkel
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. Indium
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. Kester (ITW)
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. Shengmao
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. Inventec
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. KOKI
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. AIM
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. Nihon Superior
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. KAWADA
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. Yashida
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. Tongfang Tech
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. Shenzhen Bright
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. Yong An
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
