The global semiconductor processing equipment market is expected to grow at a CAGR of 4.5% during the forecast period, from 2021 to 2030. The growth in this market is driven by the increasing demand for semiconductors and the need for advanced manufacturing processes. The lithography segment accounted for the largest share of this market in 2018, followed by wafer surface conditioning and cleaning processes segments. Assembly & packaging application accounted for the largest share of this market in 2018, followed by dicing, bonding and metrology applications. North America was estimated to account for the largest share of this market in 2018, followed by Europe and Asia Pacific respectively.
Some Of The Growth Factors Of This Market:
- The semiconductor industry is one of the fastest growing industries in the world.
- The semiconductor industry is a global market with many players, which means that there are many opportunities for growth and expansion.
- The demand for semiconductors has been increasing steadily over the past few years, which has led to an increase in production and investment in new equipment and facilities to meet this demand. .
- There are a number of factors that have contributed to the growth of this market including:.
Industry Growth Insights published a new data on “Semiconductor Processing Equipment Market”. The research report is titled “Semiconductor Processing Equipment Market research by Types (Lithography, Wafer Surface Conditioning, Cleaning Processes), By Applications (Assembly & Packaging, Dicing, Bonding, Metrology), By Players/Companies Tokyo Electron, LAM RESEARCH, ASML Holdings, Applied Materials, KLA-Tencor Corporation, Screen Holdings, Teradyne, Advantest, Hitachi High-Technologies, Plasma-Therm”.
Scope Of The Report
Report Attributes
Report Details
Report Title
Semiconductor Processing Equipment Market Research Report
By Type
Lithography, Wafer Surface Conditioning, Cleaning Processes
By Application
Assembly & Packaging, Dicing, Bonding, Metrology
By Companies
Tokyo Electron, LAM RESEARCH, ASML Holdings, Applied Materials, KLA-Tencor Corporation, Screen Holdings, Teradyne, Advantest, Hitachi High-Technologies, Plasma-Therm
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
235
Number of Tables & Figures
165
Customization Available
Yes, the report can be customized as per your need.
Global Semiconductor Processing Equipment Market Report Segments:
The global Semiconductor Processing Equipment market is segmented on the basis of:
Types
Lithography, Wafer Surface Conditioning, Cleaning Processes
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Assembly & Packaging, Dicing, Bonding, Metrology
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Tokyo Electron
- LAM RESEARCH
- ASML Holdings
- Applied Materials
- KLA-Tencor Corporation
- Screen Holdings
- Teradyne
- Advantest
- Hitachi High-Technologies
- Plasma-Therm
Highlights of The Semiconductor Processing Equipment Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Lithography
- Wafer Surface Conditioning
- Cleaning Processes
- By Application:
- Assembly & Packaging
- Dicing
- Bonding
- Metrology
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Semiconductor Processing Equipment Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Semiconductor processing equipment is used to create semiconductors, such as microchips and transistors. This equipment includes furnaces, ovens, and other tools that are used to heat materials so they can be turned into chips.
Some of the key players operating in the semiconductor processing equipment market are Tokyo Electron, LAM RESEARCH, ASML Holdings, Applied Materials, KLA-Tencor Corporation, Screen Holdings, Teradyne, Advantest, Hitachi High-Technologies, Plasma-Therm.
The semiconductor processing equipment market is expected to register a CAGR of 4.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Semiconductor Processing Equipment Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Semiconductor Processing Equipment Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Semiconductor Processing Equipment Market - Supply Chain
4.5. Global Semiconductor Processing Equipment Market Forecast
4.5.1. Semiconductor Processing Equipment Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Semiconductor Processing Equipment Market Size (000 Units) and Y-o-Y Growth
4.5.3. Semiconductor Processing Equipment Market Absolute $ Opportunity
5. Global Semiconductor Processing Equipment Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Semiconductor Processing Equipment Market Size and Volume Forecast by Type
5.3.1. Lithography
5.3.2. Wafer Surface Conditioning
5.3.3. Cleaning Processes
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Semiconductor Processing Equipment Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Semiconductor Processing Equipment Market Size and Volume Forecast by Application
6.3.1. Assembly & Packaging
6.3.2. Dicing
6.3.3. Bonding
6.3.4. Metrology
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Semiconductor Processing Equipment Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Semiconductor Processing Equipment Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Semiconductor Processing Equipment Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Semiconductor Processing Equipment Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Semiconductor Processing Equipment Demand Share Forecast, 2019-2029
9. North America Semiconductor Processing Equipment Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Semiconductor Processing Equipment Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Semiconductor Processing Equipment Market Size and Volume Forecast by Application
9.4.1. Assembly & Packaging
9.4.2. Dicing
9.4.3. Bonding
9.4.4. Metrology
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Semiconductor Processing Equipment Market Size and Volume Forecast by Type
9.7.1. Lithography
9.7.2. Wafer Surface Conditioning
9.7.3. Cleaning Processes
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Semiconductor Processing Equipment Demand Share Forecast, 2019-2029
10. Latin America Semiconductor Processing Equipment Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Semiconductor Processing Equipment Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Semiconductor Processing Equipment Market Size and Volume Forecast by Application
10.4.1. Assembly & Packaging
10.4.2. Dicing
10.4.3. Bonding
10.4.4. Metrology
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Semiconductor Processing Equipment Market Size and Volume Forecast by Type
10.7.1. Lithography
10.7.2. Wafer Surface Conditioning
10.7.3. Cleaning Processes
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Semiconductor Processing Equipment Demand Share Forecast, 2019-2029
11. Europe Semiconductor Processing Equipment Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Semiconductor Processing Equipment Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Semiconductor Processing Equipment Market Size and Volume Forecast by Application
11.4.1. Assembly & Packaging
11.4.2. Dicing
11.4.3. Bonding
11.4.4. Metrology
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Semiconductor Processing Equipment Market Size and Volume Forecast by Type
11.7.1. Lithography
11.7.2. Waer Surface Conditioning
11.7.3. Cleaning Processes
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Semiconductor Processing Equipment Demand Share, 2019-2029
12. Asia Pacific Semiconductor Processing Equipment Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Semiconductor Processing Equipment Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Semiconductor Processing Equipment Market Size and Volume Forecast by Application
12.4.1. Assembly & Packaging
12.4.2. Dicing
12.4.3. Bonding
12.4.4. Metrology
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Semiconductor Processing Equipment Market Size and Volume Forecast by Type
12.7.1. Lithography
12.7.2. Wafer Surface Conditioning
12.7.3. Cleaning Processes
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Semiconductor Processing Equipment Demand Share, 2019-2029
13. Middle East & Africa Semiconductor Processing Equipment Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Semiconductor Processing Equipment Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Semiconductor Processing Equipment Market Size and Volume Forecast by Application
13.4.1. Assembly & Packaging
13.4.2. Dicing
13.4.3. Bonding
13.4.4. Metrology
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Semiconductor Processing Equipment Market Size and Volume Forecast by Type
13.7.1. Lithography
13.7.2. Wafer Surface Conditioning
13.7.3. Cleaning Processes
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Semiconductor Processing Equipment Demand Share, 2019-2029
14. Competition Landscape
14.1. Global Semiconductor Processing Equipment Market: Market Share Analysis
14.2. Semiconductor Processing Equipment Distributors and Customers
14.3. Semiconductor Processing Equipment Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. Tokyo Electron
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. LAM RESEARCH
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. ASML Holdings
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. Applied Materials
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. KLA-Tencor Corporation
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. Screen Holdings
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. Teradyne
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. Advantest
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. Hitachi High-Technologies
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. Plasma-Therm
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. COMPANY 11
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. COMPANY 12
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. COMPANY 13
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. COMPANY 14
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. COMPANY 15
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. COMPANY 16
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
