The global semiconductor production equipment market is expected to grow at a CAGR of 4.5% during the forecast period, from 2021 to 2030. The growth in this market is attributed to the increasing demand for semiconductors in various applications such as smartphones, tablets, and other consumer electronics devices. The demand for semiconductors is also increasing due to the growing need for data storage and processing capabilities.
The global semiconductor production equipment market by type includes dicing machines, probing machines, sliced wafer demounting machines, cleaning machines and wafer edge grinding machine. The segment of dicing machine accounted for the largest share of this market in 2018 owing to its high usage in manufacturing chips with a size less than 1mm2.Probing machines are used for testing electrical connections on integrated circuits (ICs) or printed circuit boards (PCBs). Sliced wafer demounting machine is used for separating ICs from silicon wafers after they have been cut into thin slices using a dicing machine or saw blade. Cleaning machine removes contaminants from ICs or PCBs before they are assembled into finished products while Wafer edge grinding machine grinds edges of silicon wafers that have been cut using a saw blade or dicing machine so that they can be mounted on carriers which will then be inserted into an automatic assembly line where it will be processed further before being packaged as finished products.
Some Of The Growth Factors Of This Market:
- The growth of the semiconductor production equipment market is driven by the increasing demand for semiconductors in various industries such as automotive, consumer electronics, and healthcare.
- Increasing investments in research and development activities by companies to develop new products with better performance are also driving the growth of this market.
- The high cost associated with manufacturing semiconductors is a major restraint for this market.
- Asia Pacific region will be one of the fastest growing regions in terms of demand for semiconductor production equipment.
Industry Growth Insights published a new data on “Semiconductor Production Equipment Market”. The research report is titled “Semiconductor Production Equipment Market research by Types (Dicing Machine, Probing Machines, Sliced Wafer Demounting, Cleaning Machine, Wafer Edge Grinding Machine, Polish Grinders, Others), By Applications (Wafer Edge Grinding, Polish, Cleaning, Others), By Players/Companies Qualcomm Technologies, Inc. (US), Micron Technology Inc. (US), Intel Corporation (US), Applied Materials Inc. (US), AlsilMaterial (US), Atecom Technology Co., Ltd (Taiwan), Tokyo Electron Limited (Japan), LAM RESEARCH Corporation (US), KLA-Tencor Corporation (US), Screen Holdings Co., Ltd (Japan), Teradyne Inc. (US), ASML Holdings N.V. (Netherlands), Samsung Group (South Korea)”.
Scope Of The Report
Report Attributes
Report Details
Report Title
Semiconductor Production Equipment Market Research Report
By Type
Dicing Machine, Probing Machines, Sliced Wafer Demounting, Cleaning Machine, Wafer Edge Grinding Machine, Polish Grinders, Others
By Application
Wafer Edge Grinding, Polish, Cleaning, Others
By Companies
Qualcomm Technologies, Inc. (US), Micron Technology Inc. (US), Intel Corporation (US), Applied Materials Inc. (US), AlsilMaterial (US), Atecom Technology Co., Ltd (Taiwan), Tokyo Electron Limited (Japan), LAM RESEARCH Corporation (US), KLA-Tencor Corporation (US), Screen Holdings Co., Ltd (Japan), Teradyne Inc. (US), ASML Holdings N.V. (Netherlands), Samsung Group (South Korea)
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
241
Number of Tables & Figures
169
Customization Available
Yes, the report can be customized as per your need.
Global Semiconductor Production Equipment Market Report Segments:
The global Semiconductor Production Equipment market is segmented on the basis of:
Types
Dicing Machine, Probing Machines, Sliced Wafer Demounting, Cleaning Machine, Wafer Edge Grinding Machine, Polish Grinders, Others
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Wafer Edge Grinding, Polish, Cleaning, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Qualcomm Technologies, Inc. (US)
- Micron Technology Inc. (US)
- Intel Corporation (US)
- Applied Materials Inc. (US)
- AlsilMaterial (US)
- Atecom Technology Co., Ltd (Taiwan)
- Tokyo Electron Limited (Japan)
- LAM RESEARCH Corporation (US)
- KLA-Tencor Corporation (US)
- Screen Holdings Co., Ltd (Japan)
- Teradyne Inc. (US)
- ASML Holdings N.V. (Netherlands)
- Samsung Group (South Korea)
Highlights of The Semiconductor Production Equipment Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Dicing Machine
- Probing Machines
- Sliced Wafer Demounting
- Cleaning Machine
- Wafer Edge Grinding Machine
- Polish Grinders
- Others
- By Application:
- Wafer Edge Grinding
- Polish
- Cleaning
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Semiconductor Production Equipment Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Semiconductor production equipment is used to produce semiconductors. This equipment includes furnaces, ovens, and other tools used in the manufacturing process.
Some of the key players operating in the semiconductor production equipment market are Qualcomm Technologies, Inc. (US), Micron Technology Inc. (US), Intel Corporation (US), Applied Materials Inc. (US), AlsilMaterial (US), Atecom Technology Co., Ltd (Taiwan), Tokyo Electron Limited (Japan), LAM RESEARCH Corporation (US), KLA-Tencor Corporation (US), Screen Holdings Co., Ltd (Japan), Teradyne Inc. (US), ASML Holdings N.V.‚Â (Netherlands), Samsung Group (South Korea).
The semiconductor production equipment market is expected to register a CAGR of 4.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Semiconductor Production Equipment Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Semiconductor Production Equipment Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Semiconductor Production Equipment Market - Supply Chain
4.5. Global Semiconductor Production Equipment Market Forecast
4.5.1. Semiconductor Production Equipment Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Semiconductor Production Equipment Market Size (000 Units) and Y-o-Y Growth
4.5.3. Semiconductor Production Equipment Market Absolute $ Opportunity
5. Global Semiconductor Production Equipment Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Semiconductor Production Equipment Market Size and Volume Forecast by Type
5.3.1. Dicing Machine
5.3.2. Probing Machines
5.3.3. Sliced Wafer Demounting
5.3.4. Cleaning Machine
5.3.5. Wafer Edge Grinding Machine
5.3.6. Polish Grinders
5.3.7. Others
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Semiconductor Production Equipment Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Semiconductor Production Equipment Market Size and Volume Forecast by Application
6.3.1. Wafer Edge Grinding
6.3.2. Polish
6.3.3. Cleaning
6.3.4. Others
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Semiconductor Production Equipment Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Semiconductor Production Equipment Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Semiconductor Production Equipment Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Semiconductor Production Equipment Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Semiconductor Production Equipment Demand Share Forecast, 2019-2026
9. North America Semiconductor Production Equipment Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Semiconductor Production Equipment Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Semiconductor Production Equipment Market Size and Volume Forecast by Application
9.4.1. Wafer Edge Grinding
9.4.2. Polish
9.4.3. Cleaning
9.4.4. Others
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Semiconductor Production Equipment Market Size and Volume Forecast by Type
9.7.1. Dicing Machine
9.7.2. Probing Machines
9.7.3. Sliced Wafer Demounting
9.7.4. Cleaning Machine
9.7.5. Wafer Edge Grinding Machine
9.7.6. Polish Grinders
9.7.7. Others
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Semiconductor Production Equipment Demand Share Forecast, 2019-2026
10. Latin America Semiconductor Production Equipment Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Semiconductor Production Equipment Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Semiconductor Production Equipment Market Size and Volume Forecast by Application
10.4.1. Wafer Edge Grinding
10.4.2. Polish
10.4.3. Cleaning
10.4.4. Others
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Semiconductor Production Equipment Market Size and Volume Forecast by Type
10.7.1. Dicing Machine
10.7.2. Probing Machines
10.7.3. Sliced Wafer Demounting
10.7.4. Cleaning Machine
10.7.5. Wafer Edge Grinding Machine
10.7.6. Polish Grinders
10.7.7. Others
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Semiconductor Production Equipment Demand Share Forecast, 2019-2026
11. Europe Semiconductor Production Equipment Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Semiconductor Production Equipment Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Semiconductor Production Equipment Market Size and Volume Forecast by Application
11.4.1. Wafer Edge Grinding
11.4.2. Polish
11.4.3. Cleaning
11.4.4. Others
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Semiconductor Production Equipment Market Size and Volume Forecast by Type
11.7.1. Dicing Machine
11.7.2. Probing Machines
11.7.3. Sliced Wafer Demounting
11.7.4. Cleaning Machine
11.75. Wafer Edge Grinding Machine
11.7.6. Polish Grinders
11.7.7. Others
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Semiconductor Production Equipment Demand Share, 2019-2026
12. Asia Pacific Semiconductor Production Equipment Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Semiconductor Production Equipment Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Semiconductor Production Equipment Market Size and Volume Forecast by Application
12.4.1. Wafer Edge Grinding
12.4.2. Polish
12.4.3. Cleaning
12.4.4. Others
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Semiconductor Production Equipment Market Size and Volume Forecast by Type
12.7.1. Dicing Machine
12.7.2. Probing Machines
12.7.3. Sliced Wafer Demounting
12.7.4. Cleaning Machine
12.7.5. Wafer Edge Grinding Machine
12.7.6. Polish Grinders
12.7.7. Others
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Semiconductor Production Equipment Demand Share, 2019-2026
13. Middle East & Africa Semiconductor Production Equipment Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Semiconductor Production Equipment Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Semiconductor Production Equipment Market Size and Volume Forecast by Application
13.4.1. Wafer Edge Grinding
13.4.2. Polish
13.4.3. Cleaning
13.4.4. Others
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Semiconductor Production Equipment Market Size and Volume Forecast by Type
13.7.1. Dicing Machine
13.7.2. Probing Machines
13.7.3. Sliced Wafer Demounting
13.7.4. Cleaning Machine
13.7.5. Wafer Edge Grinding Machine
13.7.6. Polish Grinders
13.7.7. Others
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Semiconductor Production Equipment Demand Share, 2019-2026
14. Competition Landscape
14.1. Global Semiconductor Production Equipment Market: Market Share Analysis
14.2. Semiconductor Production Equipment Distributors and Customers
14.3. Semiconductor Production Equipment Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. Qualcomm Technologies, Inc. (US)
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. Micron Technology Inc. (US)
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. Intel Corporation (US)
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. Applied Materials Inc. (US)
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. AlsilMaterial (US)
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. Atecom Technology Co., Ltd (Taiwan)
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. Tokyo Electron Limited (Japan)
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. LAM RESEARCH Corporation (US)
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. KLA-Tencor Corporation (US)
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. Screen Holdings Co., Ltd (Japan)
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. Teradyne Inc. (US)
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. ASML Holdings N.V. (Netherlands)
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. Samsung Group (South Korea)
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. COMPANY 14
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. COMPANY 15
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. COMPANY 16
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
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