The global semiconductor wafer grinding equipment market is expected to grow at a CAGR of 4.5% during the forecast period, to reach USD 1.2 billion by 2030. The growth of this market is driven by the increasing demand for semiconductors in various applications such as smartphones, tablets, and other electronic devices. The increasing demand for high-performance chips has led to an increase in the number of foundries and IDMs across the globe. This has resulted in an increased need for wafer grinding equipment which are used to grind silicon wafers into thin slices that can be processed further into chips or integrated circuits (ICs).
The cylindrical grinding segment accounted for over 50% share of the global semiconductor wafer grinding equipment market in 2017 and is expected to maintain its dominance throughout the forecast period due to its higher production capacity compared with surface grinding machines. Surface grinder machines are more expensive than cylindrical grinders due their complex design and manufacturing process which makes them less cost-effective than cylindrical grinders when it comes to production capacity per hour.
- The semiconductor wafer grinding equipment market is expected to grow at a CAGR of 4.5% from 2017 to 2022.
- The growth of the semiconductor wafer grinding equipment market is driven by the increasing demand for semiconductors in various industries such as automotive, aerospace and defense, consumer electronics, and healthcare.
- Increasing demand for high-end products such as smartphones and tablets has led to an increase in the production of semiconductors which has increased the demand for semiconductor wafer grinding equipment.
- The increasing adoption of advanced technologies such as IoT (Internet of Things) will also drive the growth of this market.
- Increasing investments by governments in research & development activities will also fuel this market.
Industry Growth Insights published a new data on “Semiconductor Wafer Grinding Equipment Market”. The research report is titled “Semiconductor Wafer Grinding Equipment Market research by Types (Cylindrical Grinding, Surface Grinding, Other), By Applications (Foundries, Memory Manufacturers, IDMs), By Players/Companies Applied Materials, Ebara Corporation, Lapmaster, Logitech, Entrepix, Revasum, Tokyo Seimitsu, Logomatic”.
Scope Of The Report
Report Attributes
Report Details
Report Title
Semiconductor Wafer Grinding Equipment Market Research Report
By Type
Cylindrical Grinding, Surface Grinding, Other
By Application
Foundries, Memory Manufacturers, IDMs
By Companies
Applied Materials, Ebara Corporation, Lapmaster, Logitech, Entrepix, Revasum, Tokyo Seimitsu, Logomatic
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
240
Number of Tables & Figures
168
Customization Available
Yes, the report can be customized as per your need.
Global Semiconductor Wafer Grinding Equipment Market Report Segments:
The global Semiconductor Wafer Grinding Equipment market is segmented on the basis of:
Types
Cylindrical Grinding, Surface Grinding, Other
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Foundries, Memory Manufacturers, IDMs
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Applied Materials
- Ebara Corporation
- Lapmaster
- Logitech
- Entrepix
- Revasum
- Tokyo Seimitsu
- Logomatic
Highlights of The Semiconductor Wafer Grinding Equipment Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Cylindrical Grinding
- Surface Grinding
- Other
- By Application:
- Foundries
- Memory Manufacturers
- IDMs
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Semiconductor Wafer Grinding Equipment Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Semiconductor wafer grinding equipment is a machine that is used to grind semiconductor wafers. It uses a rotating disc or wheel to create small chips from the larger pieces of silicon.
Some of the major players in the semiconductor wafer grinding equipment market are Applied Materials, Ebara Corporation, Lapmaster, Logitech, Entrepix, Revasum, Tokyo Seimitsu, Logomatic.
The semiconductor wafer grinding equipment market is expected to register a CAGR of 4.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Semiconductor Wafer Grinding Equipment Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Semiconductor Wafer Grinding Equipment Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Semiconductor Wafer Grinding Equipment Market - Supply Chain
4.5. Global Semiconductor Wafer Grinding Equipment Market Forecast
4.5.1. Semiconductor Wafer Grinding Equipment Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Semiconductor Wafer Grinding Equipment Market Size (000 Units) and Y-o-Y Growth
4.5.3. Semiconductor Wafer Grinding Equipment Market Absolute $ Opportunity
5. Global Semiconductor Wafer Grinding Equipment Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Semiconductor Wafer Grinding Equipment Market Size and Volume Forecast by Type
5.3.1. Cylindrical Grinding
5.3.2. Surface Grinding
5.3.3. Other
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Semiconductor Wafer Grinding Equipment Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Semiconductor Wafer Grinding Equipment Market Size and Volume Forecast by Application
6.3.1. Foundries
6.3.2. Memory Manufacturers
6.3.3. IDMs
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Semiconductor Wafer Grinding Equipment Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Semiconductor Wafer Grinding Equipment Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Semiconductor Wafer Grinding Equipment Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Semiconductor Wafer Grinding Equipment Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Semiconductor Wafer Grinding Equipment Demand Share Forecast, 2019-2026
9. North America Semiconductor Wafer Grinding Equipment Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Semiconductor Wafer Grinding Equipment Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Semiconductor Wafer Grinding Equipment Market Size and Volume Forecast by Application
9.4.1. Foundries
9.4.2. Memory Manufacturers
9.4.3. IDMs
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Semiconductor Wafer Grinding Equipment Market Size and Volume Forecast by Type
9.7.1. Cylindrical Grinding
9.7.2. Surface Grinding
9.7.3. Other
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Semiconductor Wafer Grinding Equipment Demand Share Forecast, 2019-2026
10. Latin America Semiconductor Wafer Grinding Equipment Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Semiconductor Wafer Grinding Equipment Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Semiconductor Wafer Grinding Equipment Market Size and Volume Forecast by Application
10.4.1. Foundries
10.4.2. Memory Manufacturers
10.4.3. IDMs
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Semiconductor Wafer Grinding Equipment Market Size and Volume Forecast by Type
10.7.1. Cylindrical Grinding
10.7.2. Surface Grinding
10.7.3. Other
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Semiconductor Wafer Grinding Equipment Demand Share Forecast, 2019-2026
11. Europe Semiconductor Wafer Grinding Equipment Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Semiconductor Wafer Grinding Equipment Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Semiconductor Wafer Grinding Equipment Market Size and Volume Forecast by Application
11.4.1. Foundries
11.4.2. Memory Manufacturers
11.4.3. IDMs
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Semiconductor Wafer Grinding Equipment Market Size and Volume Forecast by Type
11.7.1.Cylindrical Grinding
11.7.2. Surface Grinding
11.7.3. Other
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Semiconductor Wafer Grinding Equipment Demand Share, 2019-2026
12. Asia Pacific Semiconductor Wafer Grinding Equipment Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Semiconductor Wafer Grinding Equipment Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Semiconductor Wafer Grinding Equipment Market Size and Volume Forecast by Application
12.4.1. Foundries
12.4.2. Memory Manufacturers
12.4.3. IDMs
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Semiconductor Wafer Grinding Equipment Market Size and Volume Forecast by Type
12.7.1. Cylindrical Grinding
12.7.2. Surface Grinding
12.7.3. Other
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Semiconductor Wafer Grinding Equipment Demand Share, 2019-2026
13. Middle East & Africa Semiconductor Wafer Grinding Equipment Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Semiconductor Wafer Grinding Equipment Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Semiconductor Wafer Grinding Equipment Market Size and Volume Forecast by Application
13.4.1. Foundries
13.4.2. Memory Manufacturers
13.4.3. IDMs
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Semiconductor Wafer Grinding Equipment Market Size and Volume Forecast by Type
13.7.1. Cylindrical Grinding
13.7.2. Surface Grinding
13.7.3. Other
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Semiconductor Wafer Grinding Equipment Demand Share, 2019-2026
14. Competition Landscape
14.1. Global Semiconductor Wafer Grinding Equipment Market: Market Share Analysis
14.2. Semiconductor Wafer Grinding Equipment Distributors and Customers
14.3. Semiconductor Wafer Grinding Equipment Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. Applied Materials
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. Ebara Corporation
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. Lapmaster
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. Logitech
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. Entrepix
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. Revasum
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. Tokyo Seimitsu
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. Logomatic
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. COMPANY9
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. COMPANY 10
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. COMPANY 11
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. COMPANY 12
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. COMPANY 13
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. COMPANY 14
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. COMPANY 15
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. COMPANY 16
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
