Market Overview:
The global semiconductor wafer polishing equipment market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for semiconductor devices from various end-use industries, such as automotive, consumer electronics, and telecommunications. In addition, the growing adoption of 3D sensing and 5G technologies is also contributing to the growth of this market. Based on type, the global semiconductor wafer polishing equipment market can be segmented into mechanical polishing, ultrasonic polishing, and other types. The mechanical polishing segment is expected to hold a major share of this market during the forecast period owing to its low cost and high efficiency. Based on application, the global semiconductor wafer polishing equipment market can be divided into foundries, memory manufacturers,, IDMs), and other applications segments. The foundries segment is projected to account for a major share of this market duringthe forecast period dueto rising demand for advanced ICs from various end-use industries.
Product Definition:
Semiconductor wafer polishing equipment is a type of machinery used to smooth the surface of semiconductor wafers. This is important because it ensures that the electrical current travels evenly across the surface of the wafer, allowing for more efficient manufacturing. Additionally, a smooth surface makes it less likely that defects will form on the wafer during use.
Mechanical Polishing:
Mechanical polishing is a process of removing unwanted material from the surface of semiconductor wafers by using mechanical methods such as abrasion, chemical etching, and physical scrubbing. The method provides several advantages over other processes such as high throughput rate, low cost per unit volume (cost reduction), and simple operation & maintenance.
The global market for semiconductor wafer polishing equipment was valued at USD 6.5 billion in 2016.
Ultrasonic Polishing:
Ultrasonic polishing is a method of wafer surface finishing that utilizes ultrasonic energy to remove material from the wafer. Ultrasonic polishing equipment consists of an ultrasonic cleaning station, which is used to clean the substrate, and a high-frequency generator orator that generates ultrasonic waves. The polished wafers are then passed on for inspection and packaging in downstream facilities.
Application Insights:
The global demand for semiconductor wafer polishing equipment has witnessed a paradigm shift due to the growing demand for advanced and high-tech devices in various end-use industries. The memory manufacturers segment accounted for over 30% of the overall market share in 2017 and is expected to grow at a significant rate over the forecast period.
The foundries segment is anticipated to witness considerable growth during the forecast period owing to extensive use of polished wafers by foundry industry participants including mask fabricators, silicon metal depositors, and others. These players require highly refined products having smaller tolerances as compared with other applications where accuracy plays an important role but not critical such as test & measurement equipment or industrial machinery manufacturing sector.
Regional Analysis:
Asia Pacific is expected to be the largest regional market over the forecast period owing to rapid technological advancements and expansion of semiconductor industry in China, Taiwan, South Korea, Japan and India. The region accounted for a revenue share of more than 35% in 2017. The growth can be attributed to rising demand from foundries as well as memory manufacturers.
The Asia Pacific region is characterized by low labor costs along with high availability of skilled professionals in some Asian countries such as China and India which has encouraged many IDMs located outside Asia Pacific (ex., U.S., Germany) to set up manufacturing facilities in this region due to competitive pricing advantage over North America or Europe regions where labor costs are comparatively higher. This factor is also likely to boost regional market growth during the forecast period.
Europe was estimated at USD X million in 2017 owing both ends of the technology supply chain; that is foundry customers who require polishing machines for processing their electronic components.
Growth Factors:
- Increasing demand for semiconductor devices from the consumer electronics and automotive industries
- Growing number of fabs (semiconductor fabrication plants) across the globe
- Proliferation of 3D NAND flash memory technology
- Rising demand for miniaturized and energy-efficient semiconductor devices
- Emergence of new applications such as 5G, artificial intelligence, and internet of things
Scope Of The Report
Report Attributes
Report Details
Report Title
Semiconductor Wafer Polishing Equipment Market Research Report
By Type
Mechanical Polishing, Ultrasonic Polishing, Other
By Application
Foundries, Memory Manufacturers, IDMs
By Companies
Applied Materials, Ebara Corporation, Lapmaster, Logitech, Entrepix, Revasum, Tokyo Seimitsu, Logomatic
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
234
Number of Tables & Figures
164
Customization Available
Yes, the report can be customized as per your need.
Global Semiconductor Wafer Polishing Equipment Market Report Segments:
The global Semiconductor Wafer Polishing Equipment market is segmented on the basis of:
Types
Mechanical Polishing, Ultrasonic Polishing, Other
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Foundries, Memory Manufacturers, IDMs
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Applied Materials
- Ebara Corporation
- Lapmaster
- Logitech
- Entrepix
- Revasum
- Tokyo Seimitsu
- Logomatic
Highlights of The Semiconductor Wafer Polishing Equipment Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Mechanical Polishing
- Ultrasonic Polishing
- Other
- By Application:
- Foundries
- Memory Manufacturers
- IDMs
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Semiconductor Wafer Polishing Equipment Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Semiconductor wafer polishing equipment is a specialized tool used to remove the surface of semiconductor wafers. This process is used to create clean, smooth surfaces on the wafers that can be used in electronic devices.
Some of the key players operating in the semiconductor wafer polishing equipment market are Applied Materials, Ebara Corporation, Lapmaster, Logitech, Entrepix, Revasum, Tokyo Seimitsu, Logomatic.
The semiconductor wafer polishing equipment market is expected to register a CAGR of 5.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Semiconductor Wafer Polishing Equipment Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Semiconductor Wafer Polishing Equipment Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Semiconductor Wafer Polishing Equipment Market - Supply Chain
4.5. Global Semiconductor Wafer Polishing Equipment Market Forecast
4.5.1. Semiconductor Wafer Polishing Equipment Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Semiconductor Wafer Polishing Equipment Market Size (000 Units) and Y-o-Y Growth
4.5.3. Semiconductor Wafer Polishing Equipment Market Absolute $ Opportunity
5. Global Semiconductor Wafer Polishing Equipment Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Semiconductor Wafer Polishing Equipment Market Size and Volume Forecast by Type
5.3.1. Mechanical Polishing
5.3.2. Ultrasonic Polishing
5.3.3. Other
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Semiconductor Wafer Polishing Equipment Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Semiconductor Wafer Polishing Equipment Market Size and Volume Forecast by Application
6.3.1. Foundries
6.3.2. Memory Manufacturers
6.3.3. IDMs
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Semiconductor Wafer Polishing Equipment Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Semiconductor Wafer Polishing Equipment Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Semiconductor Wafer Polishing Equipment Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Semiconductor Wafer Polishing Equipment Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Semiconductor Wafer Polishing Equipment Demand Share Forecast, 2019-2026
9. North America Semiconductor Wafer Polishing Equipment Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Semiconductor Wafer Polishing Equipment Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Semiconductor Wafer Polishing Equipment Market Size and Volume Forecast by Application
9.4.1. Foundries
9.4.2. Memory Manufacturers
9.4.3. IDMs
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Semiconductor Wafer Polishing Equipment Market Size and Volume Forecast by Type
9.7.1. Mechanical Polishing
9.7.2. Ultrasonic Polishing
9.7.3. Other
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Semiconductor Wafer Polishing Equipment Demand Share Forecast, 2019-2026
10. Latin America Semiconductor Wafer Polishing Equipment Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Semiconductor Wafer Polishing Equipment Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Semiconductor Wafer Polishing Equipment Market Size and Volume Forecast by Application
10.4.1. Foundries
10.4.2. Memory Manufacturers
10.4.3. IDMs
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Semiconductor Wafer Polishing Equipment Market Size and Volume Forecast by Type
10.7.1. Mechanical Polishing
10.7.2. Ultrasonic Polishing
10.7.3. Other
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Semiconductor Wafer Polishing Equipment Demand Share Forecast, 2019-2026
11. Europe Semiconductor Wafer Polishing Equipment Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Semiconductor Wafer Polishing Equipment Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Semiconductor Wafer Polishing Equipment Market Size and Volume Forecast by Application
11.4.1. Foundries
11.4.2. Memory Manufacturers
11.4.3. IDMs
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Semiconductor Wafer Polishing Equipment Market Size and Volume Forecast by Type
11.7.1. Mechanical Polishing
11.7.2. Ultrasonic Polishing
11.7.3. Other
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Semiconductor Wafer Polishing Equipment Demand Share, 2019-2026
12. Asia Pacific Semiconductor Wafer Polishing Equipment Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Semiconductor Wafer Polishing Equipment Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Semiconductor Wafer Polishing Equipment Market Size and Volume Forecast by Application
12.4.1. Foundries
12.4.2. Memory Manufacturers
12.4.3. IDMs
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Semiconductor Wafer Polishing Equipment Market Size and Volume Forecast by Type
12.7.1. Mechanical Polishing
12.7.2. Ultrasonic Polishing
12.7.3. Other
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Semiconductor Wafer Polishing Equipment Demand Share, 2019-2026
13. Middle East & Africa Semiconductor Wafer Polishing Equipment Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Semiconductor Wafer Polishing Equipment Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Semiconductor Wafer Polishing Equipment Market Size and Volume Forecast by Application
13.4.1. Foundries
13.4.2. Memory Manufacturers
13.4.3. IDMs
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Semiconductor Wafer Polishing Equipment Market Size and Volume Forecast by Type
13.7.1. Mechanical Polishing
13.7.2. Ultrasonic Polishing
13.7.3. Other
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Semiconductor Wafer Polishing Equipment Demand Share, 2019-2026
14. Competition Landscape
14.1. Global Semiconductor Wafer Polishing Equipment Market: Market Share Analysis
14.2. Semiconductor Wafer Polishing Equipment Distributors and Customers
14.3. Semiconductor Wafer Polishing Equipment Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. Applied Materials
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. Ebara Corporation
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. Lapmaster
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. Logitech
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. Entrepix
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. Revasum
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. Tokyo Seimitsu
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. Logomatic
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. COMPANY9
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. COMPANY 10
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. COMPANY 11
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. COMPANY 12
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. COMPANY 13
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. COMPANY 14
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. COMPANY 15
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. COMPANY 16
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
